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公开(公告)号：US20220155365A1
公开(公告)日：2022-05-19
申请号：US17524788
申请日：2021-11-12
Applicant: MPI Corporation
Inventor： Volker Hansel , Sebastian Giessmann , Frank Fehrmann , Chien-Hung Chen
Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.
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公开(公告)号：US20220074970A1
公开(公告)日：2022-03-10
申请号：US17469412
申请日：2021-09-08
Applicant: MPI Corporation
Inventor： Ming-Hsiang Hsieh , Chia-Nan Chou , Hao Wei , Chia-Jung Liu , Chia-An Yu
IPC: G01R1/067
Abstract: A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.
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公开(公告)号：US20210333219A1
公开(公告)日：2021-10-28
申请号：US16858711
申请日：2020-04-27
Applicant: MPI Corporation
Inventor： Frank FEHRMANN , Chien-Hung CHEN , Ching-Yang YANG
Abstract: A method of determining a first distance between a probe and a wafer held by a wafer probe station includes adjusting a microscope at a specific magnification; moving the microscope perpendicularly relative to a chuck to focus on the chuck to obtain a clear image of the chuck; defining a specific position of the microscope after the clear image of the chuck is obtained; maintaining the specific magnification of the microscope and moving the microscope perpendicularly relative to the chuck from the specific position by a travelling distance to focus on the probe to obtain a clear image of the probe; and determining the travelling distance minus a thickness of a wafer to be placed on a side of the chuck facing to the microscope as the first distance between the probe and the wafer.
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公开(公告)号：US20210185211A1
公开(公告)日：2021-06-17
申请号：US17118037
申请日：2020-12-10
Applicant: MPI CORPORATION
Inventor： PING-YING WU , YUNG-CHIN LIU , HSUAN-CHIAO HUANG
Abstract: A light emitting element detecting method and a light emitting element detecting equipment adapted for the method are discloses. The method includes the steps of generating a first control signal to open a shutter of an image capturing device which captures an image toward a light outlet of a light emitting element, generating a pulse signal to light up the light emitting element, generating a second control signal to close the shutter of the image capturing device and obtaining a detection image, and determining the light emitting status of the light outlet of the light emitting element according to the detection image. As a result, the present invention can accurately detect whether the light outlet of the light emitting element has the problem of emitting no light or flashing.
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公开(公告)号：US20210181237A1
公开(公告)日：2021-06-17
申请号：US17118564
申请日：2020-12-10
Applicant: MPI Corporation
Inventor： Zhi-Wei SU , Tzung-Je TZENG , Wen-Chi CHEN , Huo-Kang HSU , Hsueh-Chih WU , Sheng-Wei LIN , Chin-Yi LIN , Che-Wei LIN , Jian-Kai HONG , Shu-Jui CHANG
Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.
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Patent Agency Ranking
公开(公告)号：US20210156907A1
公开(公告)日：2021-05-27
申请号：US16950324
申请日：2020-11-17
Applicant: MPI CORPORATION
Inventor： WEN PIN CHUANG , YI CHING LO
Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.
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公开(公告)号：US10678370B2
公开(公告)日：2020-06-09
申请号：US16104309
申请日：2018-08-17
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Guan-Jhih Liou , Chien-Hung Chen , Yung-Chin Liu
Abstract: An aligning method for use in semiconductor inspection apparatus is provided. The semiconductor inspection apparatus includes a stage and a touch-control screen. The aligning method includes defining a reference direction; displaying an image of a device under test supported by the stage on the touch-control screen; detecting a first touch point and a second touch point occurred on the touch-control screen; defining a straight line according to the first touch point and the second touch point; calculating an included angle defined by the straight and the reference direction; and rotating the stage according to the included angle.
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公开(公告)号：US20200011898A1
公开(公告)日：2020-01-09
申请号：US16459076
申请日：2019-07-01
Applicant: MPI CORPORATION
Inventor： Tzu Yang CHEN , Chia Ju Wei
Abstract: A probe head includes a linear probe which is flattened at at least one of tail, body and head portions thereof and thereby defined with first and second width axes, along which each of the tail, body and head portions is defined with first and second widths, and upper and lower die units having upper and lower installation holes respectively, wherein the tail and head portions are inserted respectively, which are offset from each other along the second width axis so that the body portion is curved. The first and second widths of the body portion are respectively larger and smaller than the first and second widths of at least one of the tail and head portions. As a result, the probes of the same probe head are consistent in bending direction and moving behavior and prevented from rotation, drop and escape.
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公开(公告)号：US20190187206A1
公开(公告)日：2019-06-20
申请号：US16213498
申请日：2018-12-07
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Chien-Hung Chen , Guan-Jhih Liou , Yu-Hsun Hsu
IPC: G01R31/28
CPC classification number: G01R31/2893 , H04N5/23299
Abstract: A wafer inspection method was provided. A motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper limit position and a lower limit position in a displacement range. The wafer inspection method includes: determining a position of the control rod in the displacement range based on a measurement signal; determining a moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; and controlling, based on the control signal, the motorized chuck stage and a camera stage to be displaced the same distance.
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公开(公告)号：US10312123B2
公开(公告)日：2019-06-04
申请号：US15414852
申请日：2017-01-25
Applicant: MPI Corporation
Inventor： Chen-Ching Chen , Yu-Hsun Hsu , Po-Yi Ting , Stojan Kanev
IPC: G01R31/28 , H01L21/677 , A47B88/497 , A47B88/457 , G01K13/00 , H01L21/673 , G01R31/44 , A47B88/988
Abstract: A method for compensating probe misplacement and a probe apparatus are provided. The method is applicable to a probe module which includes a probe and a fixing base. The probe includes a probe body section and a probe tip section. The probe body section is fixed on the fixing base. The method includes: measuring a temperature of a probe body of the probe body section of the probe; calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section; calculating a compensation value according to the thermal expansion amount; moving the probe or a to-be-tested element according to the calculated compensation value, to align a probe tip of the probe tip section with the to-be-tested element or align the to-be-tested element with the probe tip of the probe tip section.
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