摘要:
The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:
摘要:
This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.
摘要:
An image forming apparatus includes a movable image bearing member; an image forming device for forming a toner image on the image bearing member; a charging member for charging the image bearing member in a charging station; and an electrical power source for supplying power to the charging member. A detector detects the voltage-current characteristic between the charging member and the image bearing member; and a controller controls the output of the electrical power source, in accordance with an output of the detector, when a surface area portion of the image bearing member, where the toner image is not going to be formed as the image bearing member rotates, is in the charging station.
摘要:
A completion and workover fluid is described, containing a soluble salt, a hydroxyethyl cellulose and at least one compound selected from 2-mercaptobenzimidazole compounds, 2-mercaptobenzothiazole compounds, 2-mercaptothiazoline and 2-thioimidazolidone.
摘要:
It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 μm, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 μm.
摘要:
Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 μm and a glass filler having an average particle diameter of 1.0 to 3.0 μm, a specific gravity of 2.3 to 2.6 g/cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.
摘要翻译:提供一种通过用树脂组合物浸渍基材而制备的预浸料,其中树脂组合物含有平均粒径为2.5-4.5μm的氢氧化铝和平均粒径为1.0-3.0μm的玻璃填料,比重 为2.3〜2.6g / cm 3,SiO 2含量为50〜65质量% 相对于树脂组合物中的固体成分的总量,氢氧化铝和玻璃填料的配合量的总和为30〜50质量%。 根据上述预浸料,能够得到的是一种金属复合层压板,其中尽管使用二氧化硅等无机填料和氢氧化铝组合,但是无机填料均匀分散,加工性优异 并具有低热膨胀系数。
摘要:
It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).
摘要:
A charging device includes a member to be charged, and a charging member for charging the member to be charged. The charging member includes a surface layer which can contact the surface of the member to be charged. A voltage is applied between the member to be charged and the charging member. The contact angle with water .gamma..sub.R of the surface layer of the charging member is greater than the contact angle with water .gamma..sub.D of the surface of the member to be charged. An image forming apparatus includes the above-described charging device.
摘要:
This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.