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公开(公告)号：US08664534B2
公开(公告)日：2014-03-04
申请号：US11915097
申请日：2006-05-19
IPC分类号： H05K1/00
CPC分类号： H05K1/0281 , H05K1/0265 , H05K1/056 , H05K2201/0352 , H05K2201/09736
摘要： It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 μm, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 μm.
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的印刷电路板。 根据本发明的优选实施例的印刷电路板（40）具有基底（1），形成在柔性区域（36）中的导体（7）和形成为非柔性的导体（8,9）的结构 地区（46）。 形成在柔性区域（36）中的导体（7）具有1-30μm的总厚度，并且形成在非柔性区域（46）中的导体（8,9）的总厚度为30-150μm 。
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公开(公告)号：US20120285732A1
公开(公告)日：2012-11-15
申请号：US13550347
申请日：2012-07-16
CPC分类号： H05K3/4691 , H05K1/0278 , H05K1/0366 , H05K3/281 , H05K3/4611 , H05K3/4626 , H05K3/4688 , H05K2203/0571 , H05K2203/063
摘要： It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的多层电路板。 根据本发明的优选实施例，多层电路板（12）具有其中非柔性印刷电路板（6）通过盖板（10）层叠到柔性印刷电路板（1）的两侧上的结构。 在多层电路板（12）中，盖板（10）保护印刷电路板（6）不在其上的印刷电路板（1）的区域，同时还用作粘合层（11），用于与 印刷电路板（6）。 换句话说，相同的层用作多层电路板（12）中的覆盖层（10）和粘合剂层（11）。
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公开(公告)号：US20100270059A1
公开(公告)日：2010-10-28
申请号：US11915097
申请日：2006-05-19
IPC分类号： H05K1/02
CPC分类号： H05K1/0281 , H05K1/0265 , H05K1/056 , H05K2201/0352 , H05K2201/09736
摘要： It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 μm, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 μm.
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的印刷电路板。 根据本发明的优选实施例的印刷电路板（40）具有基底（1），形成在柔性区域（36）中的导体（7）和形成为非柔性的导体（8,9）的结构 地区（46）。 形成在柔性区域（36）中的导体（7）的总厚度为1-30μm，形成在非柔性区域（46）中的导体（8,9）的总厚度为30-150μm 。
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公开(公告)号：US20100065313A1
公开(公告)日：2010-03-18
申请号：US11916090
申请日：2006-05-26
IPC分类号： H05K1/14
CPC分类号： H05K3/4691 , H05K1/0278 , H05K1/0366 , H05K3/281 , H05K3/4611 , H05K3/4626 , H05K3/4688 , H05K2203/0571 , H05K2203/063
摘要： It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).
摘要翻译： 本发明的目的是提供一种能够以高密度容纳在电子设备的外壳中的多层电路板。 根据本发明的优选实施例，多层电路板（12）具有其中非柔性印刷电路板（6）通过盖板（10）层叠到柔性印刷电路板（1）的两侧上的结构。 在多层电路板（12）中，盖板（10）保护印刷电路板（6）不在其上的印刷电路板（1）的区域，同时还用作粘合层（11），用于与 印刷电路板（6）。 换句话说，相同的层用作多层电路板（12）中的覆盖层（10）和粘合剂层（11）。
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公开(公告)号：US20070287021A1
公开(公告)日：2007-12-13
申请号：US10591696
申请日：2005-03-04
CPC分类号： C08J5/24 , C08G59/504 , C08G73/1042 , C08G73/106 , C08G73/14 , C08K5/3445 , C08L63/00 , C08L79/08 , H05K1/0346 , H05K1/0353 , H05K2201/0154 , Y10T428/12549 , Y10T428/249921 , Y10T428/249924 , Y10T428/249941 , Y10T428/249951 , C08L2666/20 , C08L2666/22
摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.
摘要翻译： 本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中 或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。 本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。
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公开(公告)号：US07758951B2
公开(公告)日：2010-07-20
申请号：US10591696
申请日：2005-03-04
CPC分类号： C08J5/24 , C08G59/504 , C08G73/1042 , C08G73/106 , C08G73/14 , C08K5/3445 , C08L63/00 , C08L79/08 , H05K1/0346 , H05K1/0353 , H05K2201/0154 , Y10T428/12549 , Y10T428/249921 , Y10T428/249924 , Y10T428/249941 , Y10T428/249951 , C08L2666/20 , C08L2666/22
摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.
摘要翻译： 本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中 或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。 本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。
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公开(公告)号：US07871694B2
公开(公告)日：2011-01-18
申请号：US12180384
申请日：2008-07-25
CPC分类号： C08J5/24 , C08G59/504 , C08G73/1042 , C08G73/106 , C08G73/14 , C08K5/3445 , C08L63/00 , C08L79/08 , H05K1/0346 , H05K1/0353 , H05K2201/0154 , Y10T428/12549 , Y10T428/249921 , Y10T428/249924 , Y10T428/249941 , Y10T428/249951 , C08L2666/20 , C08L2666/22
摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.
摘要翻译： 本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中 或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。 本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。
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公开(公告)号：US06740454B1
公开(公告)日：2004-05-25
申请号：US09744687
申请日：2001-01-29
申请人： Nobuo Ando , Masaki Yamaguchi , Yukinori Hato
发明人： Nobuo Ando , Masaki Yamaguchi , Yukinori Hato
IPC分类号： H01M470
CPC分类号： H01M10/052 , H01M4/137 , H01M4/60 , H01M4/745 , H01M4/80 , H01M10/058 , H01M10/44 , H01M2010/4292
摘要： An organic electrolytic cell having a positive electrode, a negative electrode, and an electrolyte comprising a solution of a lithium salt in an aprotic organic solvent, wherein a positive electrode collector and a negative electrode collector have pores that penetrate from the front surface to the back surface, a positive electrode active material and a negative electrode active material can reversibly carry lithium, and, when the lithium derived from the negative electrode or the positive electrode is in electrochemical contact with the lithium disposed opposite the negative electrode or the positive electrode, the whole or part of the lithium passes through at least one layer of the positive electrode or the negative electrode and is carried. The opposing area of the lithium is not larger than 40 % of the area of the negative electrode and the porosity of each current collector is not less than 1 % and not more than 30 %.
摘要翻译： 一种具有正极，负极和电解质的有机电解质，其包含锂盐在非质子性有机溶剂中的溶液，其中正极集电体和负极集电体具有从前表面到后面穿透的孔 正极活性物质和负极活性物质可以可逆地携带锂，并且当来自负极或正极的锂与与负极或正极相对配置的锂电化学接触时， 锂的全部或部分通过正极或负极的至少一层并被承载。 锂的相对面积不大于负极面积的40％，每个集电器的孔隙率不小于1％且不大于30％。
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公开(公告)号：US08327727B2
公开(公告)日：2012-12-11
申请号：US12546777
申请日：2009-08-25
CPC分类号： G01R1/06716 , G01R1/06755 , G01R31/2863
摘要： To eliminate or otherwise reduce unintended movement of a probe tip of a probe assembly being held by a probe arm, the probe assembly includes one or more resilient members that compensate for the contraction or expansion of the probe arm in accordance with the coefficient of thermal expansion of the material from which the probe arm is made. Thus, the probe tip can remain in contact with a sample being measured at the desired location on the sample, during an automated full or wide scale temperature range sweep.
摘要翻译： 为了消除或以其他方式减少由探针臂保持的探针组件的探针尖端的意外移动，探针组件包括一个或多个弹性构件，其根据热膨胀系数补偿探针臂的收缩或膨胀 的探针臂的材料。 因此，在自动化全宽或大范围温度范围扫描期间，探针尖端可以保持与在样品上期望位置处被测量的样品接触。
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公开(公告)号：US07186696B2
公开(公告)日：2007-03-06
申请号：US10379094
申请日：2003-03-04
IPC分类号： A01N43/04
摘要： An object of the present invention is to provide a means for the measurement of amylase activity that exists in a biological sample such as saliva in a more convenient manner and particularly to provide a means (method and reagent) where a sample containing amylase in high concentration is directly measured without dilution. In the present invention, there has been found a method, which is an enzymatic method using a modified oligosaccharide substrate, comprising adding saccharide such as oligosaccharide that is competitive to the oligosaccharide substrate whereupon amylase activity in an amylase sample having a high activity value can be directly measured without dilution, and a result, the present invention has been achieved.
摘要翻译： 本发明的目的是提供一种用于以更方便的方式测定存在于生物样品如唾液中的淀粉酶活性的方法，特别是提供一种方法（方法和试剂），其中含有高浓度淀粉酶的样品 直接测量而不稀释。 在本发明中，已经发现了使用改性的寡糖底物的酶法，其包括向寡糖底物添加竞争性低聚糖等糖类，由此具有高活性值的淀粉酶样品中的淀粉酶活性可以是 不经稀释直接测量，结果，本发明已经实现。
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