公开(公告)号：US20250081647A1

公开(公告)日：2025-03-06

申请号：US18462082

申请日：2023-09-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Soon Wei WANG ,  Jin Yoong LIONG ,  Kai Chat TAN ,  May May GAN

IPC: H01L27/146 ,  H01L23/00

Abstract: Implementations of an image sensor package may include an optically transmissive cover including a groove along an entire perimeter of the optically transmissive cover; an image sensor die; an adhesive material coupling the optically transmissive cover to the image sensor die; and a mold compound contacting sidewalls of the image sensor die, contacting the adhesive material, and extending into the groove.

公开(公告)号：US20250076084A1

公开(公告)日：2025-03-06

申请号：US18954343

申请日：2024-11-20

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jacques Jean BERTIN

IPC: G01D5/20

Abstract: A receiver coil of an inductive angular position sensor can have circuit features that become smaller than reasonable for high resolution measurement designs. This is especially true when multiple receiver coils are used, such as in a three-phase configuration, and when each of the multiple receiver coils is in a twisted loop configuration. The disclosed inductive angular position sensor utilizes different spatial frequencies for a rotor coil and the receiver coils. For example, the spatial frequency of the receiver coils may be kept smaller than the rotor coil. In this condition, the fundamental frequency of the angular position sensor is shifted to the least common multiple of the spatial frequencies, making the angular resolution of the inductive angular position sensor high, while the circuit features of the receiver coils are maintained at a reasonable size.

公开(公告)号：US12244323B2

公开(公告)日：2025-03-04

申请号：US18433108

申请日：2024-02-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jacques Jean Bertin

IPC: H03M1/12 ,  G01B7/00 ,  G01B7/30 ,  G01D5/14 ,  G01D11/24 ,  H03M1/48

Abstract: Various embodiments provide a filter for propagation delay compensation and interpolation in encoder digital signal processing. The filter can include a first low pass filter configured to reduce noise of a digital input comprising a measured angular position; a first differentiator configured to receive a filtered digital input and to calculate a speed from a difference in time of the measured angular position and a previous angular position; a second low pass filter configured to reduce noise from the speed; a second differentiator configured to receive a filtered speed and to calculate acceleration using a difference in time of the filtered speed and a previous speed; a third low pass filter configured to reduce noise of the acceleration; and a delay compensator configured to receive the filtered digit input, the filtered speed, and a filtered acceleration, and to calculate a propagation delay compensated digital output.

公开(公告)号：US12237351B2

公开(公告)日：2025-02-25

申请号：US17344082

申请日：2021-06-10

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te Hsieh

IPC: H01L27/146

Abstract: Implementations of semiconductor packages may include: a substrate having a first side and a second side and a die having an active area on a second side of the die. A first side of the die may be coupled to the second side of the substrate. The semiconductor package may also include a glass lid having a first side and a second side. The glass lid may be coupled over a second side of the die. The semiconductor package may include a first and a second molding compound and one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound. The second molding compound may be coupled to the substrate and the around the die and the glass lid.

公开(公告)号：US12231852B2

公开(公告)日：2025-02-18

申请号：US18391468

申请日：2023-12-20

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Ivo Leonardus Coenen ,  Dennis Wayne Mitchler

IPC: H04R25/00 ,  H04B5/70

Abstract: Hearing instruments, such as hearing aids, may improve a quality of presented audio through the use of a binaural application, such as beamforming. The binaural application may require communication between the hearing instruments so that audio from a left hearing instrument may be combined with audio from a right hearing instrument. The combining at a hearing instrument can require synchronizing audio sampled locally with sampled audio received from wireless communication. This synchronization may cause a noticeable delay of an output of the binaural application if the latency of the wireless communication is not low (e.g., a few samples of delay). Presented herein is a low-latency communication protocol that communicates packets on a sample-by-sample basis and that compensates for delays caused by overhead protocol data transmitted with the audio data.

公开(公告)号：US12230551B2

公开(公告)日：2025-02-18

申请号：US17664549

申请日：2022-05-23

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Oseob Jeon ,  Youngsun Ko ,  Seungwon Im ,  Jerome Teysseyre ,  Michael J. Seddon

IPC: H05K7/20 ,  H01L21/48 ,  H01L23/44

Abstract: Implementations of a semiconductor package may include one or more semiconductor die directly coupled to only a direct leadframe attach (DLA) leadframe including two or more leads; and a coating covering the one or more semiconductor die and the DLA leadframe where when the semiconductor package is coupled into an immersion cooling enclosure, the coating may be in contact with a dielectric coolant while the two or more leads extend out of the immersion cooling enclosure.

公开(公告)号：US12225304B2

公开(公告)日：2025-02-11

申请号：US17660860

申请日：2022-04-27

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Nicholas Paul Cowley ,  Andrew David Talbot

IPC: H04N25/63 ,  H01L27/146

Abstract: An image sensor may be implemented by mounting a first die to a second die. The first die may include an image sensor pixel array having active pixels and non-active pixels, while the second die may include pixel control and readout circuitry that are coupled to the image sensor pixel array via inter-die connections. The image sensor pixel array may have pixel columns in excess of corresponding column readout paths in the pixel readout circuitry and/or pixel rows in excess of corresponding sets of row control paths in the pixel control circuitry. A select set of inter-die connections may be implemented to provide connections between a desired set of pixel columns and the limited number of column readout paths and to provide connections between a desired set of pixel rows and the limited number of sets of row control paths.

公开(公告)号：US12224208B2

公开(公告)日：2025-02-11

申请号：US17248751

申请日：2021-02-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Gordon M. Grivna

IPC: H01L21/78 ,  B26F3/02 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/683

Abstract: An apparatus for singulating a layer of material on a semiconductor substrate includes a chamber. The chamber is configured for supporting a semiconductor substrate attached to a carrier substrate, the semiconductor substrate can include a plurality of die formed as part of the semiconductor substrate and separated from each other by singulation lines and a layer of material disposed over a major surface of the semiconductor substrate. In some examples, the singulation lines terminate so that the layer of material extends over the singulation lines. The apparatus includes a pressure transfer vessel inside the chamber and a compression structure movably associated with the chamber. The compression structure can be configured so that the pressure transfer vessel is interposed between the semiconductor substrate and the compression structure. The compression structure and the pressure transfer vessel are adapted to apply pressure to the entire semiconductor substrate to singulate the layer of material that extends over the singulation lines.

公开(公告)号：US20250029901A1

公开(公告)日：2025-01-23

申请号：US18353148

申请日：2023-07-17

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Silnore Tejero SABANDO ,  Chee Hiong CHEW

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/498

Abstract: A compact power inverter is efficiently laid out on a multi-layer direct bond metal (DBM) structure, having a reduced footprint and straight, short-run wire bonds. The compact layout reduces an amount of material needed to fabricate a multi-layer DBM that includes a silicon nitride ceramic layer. The layout is further designed so that wire bonds can be routed without bending around corners. The compact DBM structure and short wire bonds provide a solution that is both low-cost and highly reliable.

公开(公告)号：US20250022813A1

公开(公告)日：2025-01-16

申请号：US18902442

申请日：2024-09-30

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Michael J. SEDDON ,  Francis J. CARNEY

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/32 ,  H01L25/065

Abstract: Implementations of a semiconductor device may include a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and one of a permanent die support structure, a temporary die support structure, or any combination thereof coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof. The first largest planar surface, the second largest planar surface, and the thickness may be formed by at least two semiconductor die. The warpage of one of the first largest planar surface or the second largest planar surface may be less than 200 microns.