公开(公告)号：US20090179325A1

公开(公告)日：2009-07-16

申请号：US12349960

申请日：2009-01-07

申请人： Sung-min Park ,  Keun-hyuk Lee ,  Seung-Won Lim

发明人： Sung-min Park ,  Keun-hyuk Lee ,  Seung-Won Lim

IPC分类号： H01L23/48 ,  H01L23/49

CPC分类号： H01L24/49 ,  H01L23/142 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/36 ,  H01L24/37 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a semiconductor package, and in particular a semiconductor package which is capable of electrically connecting to the outside without a lead. The leadless package includes a plurality of lower conducting layer patterns disposed separately from one another; an insulating layer pattern on the lower conducting layer patterns; a plurality of upper conducting layer patterns disposed separately from one another, on the insulating layer pattern; at least one semiconductor chip disposed on the upper conducting layer patterns; hole patterns formed through the upper conducting layer patterns and the insulating layer pattern, so that a part of the top surface of the lower conducting layer patterns are exposed; and electrical connectors electrically connecting: the at least one semiconductor chip and the upper conducting layer patterns; the upper conducting layer patterns and the lower conducting layer patterns exposed by the hole patterns; and the at least one semiconductor chip and the lower conducting layer patterns exposed by the hole patterns.

摘要翻译： 提供了一种半导体封装，特别是能够在没有引线的情况下电连接到外部的半导体封装。 无引线封装包括彼此分开设置的多个下导电层图案; 在下导电层图案上的绝缘层图案; 在绝缘层图案上彼此分开设置的多个上导电层图案; 设置在上导电层图案上的至少一个半导体芯片; 通过上导电层图案和绝缘层图案形成的孔图案，使得下导电层图案的顶表面的一部分露出; 以及电连接器，其电连接：所述至少一个半导体芯片和所述上导电层图案; 上导电层图案和由孔图案曝光的下导电层图案; 并且所述至少一个半导体芯片和由所述孔图案曝光的所述下导电层图案。

公开(公告)号：US07061080B2

公开(公告)日：2006-06-13

申请号：US10167067

申请日：2002-06-10

申请人： Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

发明人： Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

IPC分类号： H01L23/495

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

公开(公告)号：US6094615A

公开(公告)日：2000-07-25

申请号：US684060

申请日：1996-07-19

申请人： Sung Min Park

发明人： Sung Min Park

IPC分类号： G01P3/488 ,  B60K31/00 ,  B60K31/04 ,  F02D29/02 ,  F02D41/04 ,  F02D45/00 ,  F02P5/15 ,  B60T7/12 ,  G05D1/00 ,  G06F17/00

CPC分类号： B60K31/042

摘要： A speed limit control system and method for vehicles, which can control both the amount of fuel injection and ignition timing of an engine so as to restrict speed more than a regulation speed includes a vehicle speed sensor for generating electronic signals in accordance with an actual vehicle speed; a control device for judging the actual vehicle speed in accordance with signals from the vehicle speed sensor, outputting control signals for controlling ignition timing of an engine and the amount of the fuel injection in accordance with the speed variation in order not to exceed a predetermined regulation speed; an ignition device for igniting at a predetermined timing by signals, the signals being transferred from the engine control device; and an injection device for injecting the predetermined amount of fuel by signals, the signals being transferred from the engine control device.

摘要翻译： 一种能够控制发动机的燃料喷射量和点火正时以限制速度超过调节速度的车辆的限速控制系统和方法，包括用于根据实际车辆产生电子信号的车速传感器 速度; 用于根据来自车速传感器的信号来判定实际车速的控制装置，根据速度变化输出用于控制发动机的点火正时和燃料喷射量的控制信号，以便不超过预定的规定 速度; 点火装置，用于通过信号在预定定时点火，所述信号从所述发动机控制装置传送; 以及用于通过信号喷射预定量的燃料的喷射装置，所述信号从发动机控制装置传送。

公开(公告)号：US08742855B2

公开(公告)日：2014-06-03

申请号：US13318833

申请日：2009-12-28

申请人： Hyung Soon Shin ,  Sung Min Park ,  Na Rae Jeong ,  Ji Sook Yun ,  Yu Jin Kim

发明人： Hyung Soon Shin ,  Sung Min Park ,  Na Rae Jeong ,  Ji Sook Yun ,  Yu Jin Kim

IPC分类号： H03K3/03

CPC分类号： H03K3/0322

摘要： Disclosed herein is a feed-forward ring oscillator. The feed-forward ring oscillator includes a plurality of delay cells for receiving a first differential input signal pair and a second differential input signal pair, and outputting a differential output signal pair. The delay cells are connected in a ring shape. Each of the delay cells receives a differential output signal pair of a delay cell of a previous stage as a first differential input signal pair and receives a differential output signal pair of a delay cell of a stage before the previous stage as a second differential input signal pair. Each of the delay cells comprises multiple independent gate field-effect transistors.

摘要翻译： 这里公开了一种前馈环形振荡器。 前馈环形振荡器包括用于接收第一差分输入信号对和第二差分输入信号对的多个延迟单元，并输出差分输出信号对。 延迟单元以环形连接。 每个延迟单元接收前一级的延迟单元的差分输出信号对作为第一差分输入信号对，并将前一级之前的级的延迟单元的差分输出信号对作为第二差分输入信号 对。 每个延迟单元包括多个独立的栅极场效应晶体管。

公开(公告)号：US08494649B2

公开(公告)日：2013-07-23

申请号：US12828081

申请日：2010-06-30

申请人： Christopher C. Stancer ,  Piotr J. Przybyszewski ,  Sandy K. Wixon ,  Joel Peltier ,  Sung-Min Park ,  David E. Manahan ,  Jonathan Edmonson ,  Ben W. Herberg

发明人： Christopher C. Stancer ,  Piotr J. Przybyszewski ,  Sandy K. Wixon ,  Joel Peltier ,  Sung-Min Park ,  David E. Manahan ,  Jonathan Edmonson ,  Ben W. Herberg

IPC分类号： A61N1/05

CPC分类号： A61N1/3754 ,  A61N1/08 ,  A61N1/3624 ,  A61N1/3718 ,  A61N1/37247 ,  A61N1/37264 ,  A61N1/37282 ,  A61N1/3962

摘要： Techniques are described for controlling effects caused when an implantable medical device (IMD) is subject to a disruptive energy field. The IMD may include an implantable lead that includes one or more electrodes. The IMD may further include a first component having a parasitic inductance. The IMD may further include a second component having a reactance. In some examples, the reactance of the second component may be selected based on the parasitic inductance of the first component such that an amount of energy reflected along the lead in response to energy produced by an electromagnetic energy source is below a selected threshold. In additional examples, the parasitic inductance of the first component and the reactance of the second component are configured such that an amount of energy reflected along the lead in response to a frequency of electromagnetic energy is below a selected threshold.

摘要翻译： 描述了用于控制当可植入医疗装置（IMD）受到破坏性能量场时所引起的影响的技术。 IMD可以包括包括一个或多个电极的可植入引线。 IMD还可以包括具有寄生电感的第一分量。 IMD还可以包括具有电抗的第二部件。 在一些示例中，可以基于第一部件的寄生电感来选择第二部件的电抗，使得响应于由电磁能源产生的能量而沿着引线反射的能量的量低于选定的阈值。 在另外的示例中，第一部件的寄生电感和第二部件的电抗被配置为使得响应于电磁能的频率沿着引线反射的能量的量低于选定的阈值。

公开(公告)号：US08486654B2

公开(公告)日：2013-07-16

申请号：US13034387

申请日：2011-02-24

申请人： Hyun Min Koo ,  Sung Min Park ,  Jae Chan Park ,  Kyoung Heon Kim ,  In Geol Choi

发明人： Hyun Min Koo ,  Sung Min Park ,  Jae Chan Park ,  Kyoung Heon Kim ,  In Geol Choi

IPC分类号： G01N33/573

CPC分类号： C12Q1/48 ,  C12N9/1051 ,  G01N2333/91102

摘要： Provided herein are a composition for measuring 3,6-anhydro-L-galactose (3,6-L-AHG) transferase activity by reduction of NADP to NADPH, and a method of measuring 3,6-L-AHG transferase activity using the same. The composition and method are useful for determining 3,6-L-AHG in a material containing 3,6-L-AHG such as algae biomass and industrial applications.

摘要翻译： 本文提供了通过将NADP还原成NADPH来测量3,6-脱水-L-半乳糖（3,6-L-AHG）转移酶活性的组合物，以及使用以下方法测量3,6-L-AHG转移酶活性的方法 相同。 该组合物和方法可用于测定含有3,6-L-AHG的材料中的3,6-L-AHG，例如藻类生物质和工业应用。

公开(公告)号：US08417133B2

公开(公告)日：2013-04-09

申请号：US12923225

申请日：2010-09-09

申请人： Myung-kook Ahn ,  Sang-don Lee ,  Sung-min Park

发明人： Myung-kook Ahn ,  Sang-don Lee ,  Sung-min Park

IPC分类号： G03G15/02

CPC分类号： G03G15/0275 ,  G03G15/0266 ,  G03G15/55 ,  G03G15/553 ,  G03G2215/00776

摘要： Provided is an apparatus and method for supplying a charge voltage to an organic photoconductor (OPC) drum. The apparatus includes a storage unit for storing first service life information of the OPC drum according to a first supplying method, and second service life information of the OPC drum according to a second supplying method, a sensor unit for measuring information about conditions surrounding the apparatus, a control unit for selecting one of the first and second supplying methods according to the measured information and determining a charge voltage corresponding to the service life information according to the selected method, and a voltage supplying unit using the selected method to supply the determined charge voltage to the OPC drum.

摘要翻译： 提供了一种用于向有机感光鼓（OPC）鼓提供充电电压的装置和方法。 该装置包括存储单元，用于根据第一供应方法存储OPC滚筒的第一使用寿命信息，以及根据第二提供方法存储OPC滚筒的第二使用寿命信息;传感器单元，用于测量关于设备周围的条件的信息 控制单元，用于根据所测量的信息选择第一和第二供给方法之一，并根据所选择的方法确定与使用寿命信息相对应的充电电压;以及电压提供单元，使用所选择的方法来提供所确定的电荷 电压到OPC鼓。

公开(公告)号：US08403087B2

公开(公告)日：2013-03-26

申请号：US12736546

申请日：2008-05-26

申请人： Gwang-Ju Park ,  Byung-Gill Ha ,  Byung-Ju Kang ,  Do-Hyung Kim ,  Qyu-Bok Baek ,  Sung-Min Park ,  Ki-Yong Ue

发明人： Gwang-Ju Park ,  Byung-Gill Ha ,  Byung-Ju Kang ,  Do-Hyung Kim ,  Qyu-Bok Baek ,  Sung-Min Park ,  Ki-Yong Ue

IPC分类号： B60K7/00

CPC分类号： H02K1/32 ,  B60L2220/44 ,  H02K5/18 ,  H02K5/20 ,  H02K7/14 ,  H02K9/22 ,  H02K21/222 ,  Y02T10/641

摘要： An outer rotor-type motor of the present invention comprises a stator block, a stator, a main cooling part, an outer rotor and an outer housing. The stator block is formed in the shape of a cylinder with a rear end closed. The stator block is installed on a shaft passing through a central portion of the rear end thereof. The stator is fixedly installed on an outer circumferential surface of the stator block. The main cooling portion is provided on an inner circumferential surface of the stator block to lower temperature of a corresponding portion. The outer rotor rotatably installed at an outside of the stator and the outer housing has a circumferential portion fixed to a front circumferential portion of the outer rotor.

摘要翻译： 本发明的外转子式电动机包括定子块，定子，主冷却部，外转子和外壳。 定子块形成为具有后端封闭的气缸的形状。 定子块安装在通过其后端的中心部分的轴上。 定子固定地安装在定子块的外圆周表面上。 主冷却部设置在定子块的内周面上，以降低相应部分的温度。 可旋转地安装在定子外部的外转子和外壳体具有固定到外转子的前周边部分的周向部分。

公开(公告)号：US08350369B2

公开(公告)日：2013-01-08

申请号：US11969410

申请日：2008-01-04

申请人： Keun-hyuk Lee ,  Seung-won Lim ,  Sung-min Park ,  Taek-keun Lee

发明人： Keun-hyuk Lee ,  Seung-won Lim ,  Sung-min Park ,  Taek-keun Lee

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/49844 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00012

摘要： Provided is a high power semiconductor package including: an insulation substrate having first and second surfaces opposite to each other; an interconnection patterns formed on the first surface of the insulation substrate, the interconnection patterns including a plurality of first dimples; a power control semiconductor chip mounted on the first surface of the insulation substrate, the power control semiconductor chip electrically connected with the interconnection patterns; and an encapsulation member encapsulating the insulation substrate, the interconnection patterns, and the power control semiconductor chip and exposing at least a portion of the second surface of the insulation substrate.

摘要翻译： 提供一种高功率半导体封装，包括：具有彼此相对的第一和第二表面的绝缘基板; 形成在绝缘基板的第一表面上的互连图案，所述互连图案包括多个第一凹坑; 功率控制半导体芯片，安装在所述绝缘基板的所述第一表面上，所述功率控制半导体芯片与所述互连图案电连接; 以及密封绝缘基板，互连图案和功率控制半导体芯片的封装构件，并且暴露绝缘基板的第二表面的至少一部分。

公开(公告)号：US20120329104A1

公开(公告)日：2012-12-27

申请号：US13535016

申请日：2012-06-27

申请人： Jae Young KIM ,  Hyun Min KOO ,  Young kyoung PARK ,  Jae Chan PARK ,  Sung Min PARK ,  Jin Ho SEO ,  Yong Cheol PARK

发明人： Jae Young KIM ,  Hyun Min KOO ,  Young kyoung PARK ,  Jae Chan PARK ,  Sung Min PARK ,  Jin Ho SEO ,  Yong Cheol PARK

IPC分类号： C12N1/19 ,  C12N1/15 ,  C12N15/63 ,  C12N1/21

CPC分类号： C12N9/0006 ,  C12N9/1205 ,  C12Y101/01009 ,  C12Y101/01021 ,  C12Y207/01017 ,  Y02E50/17

摘要： A modified microorganism having enhanced xylose utilization, an expression vector for constructing the modified microorganism, and a method of producing a chemical using the same are disclosed.

摘要翻译： 公开了具有增强的木糖利用率的修饰微生物，构建修饰微生物的表达载体和使用其的化学品生产方法。