公开(公告)号：US08331991B2

公开(公告)日：2012-12-11

申请号：US12173680

申请日：2008-07-15

Applicant: Tae Hun Kim ,  Jang Jae Jung

Inventor： Tae Hun Kim ,  Jang Jae Jung

IPC: H04M1/00 ,  H04B1/38

CPC classification number: G06F3/04886 ,  G06F3/0481 ,  G06F3/0489

Abstract: A mobile terminal, computer program product, and method for controlling the same are disclosed, by which a terminal user is enabled to input specific commands to the mobile terminal with minimum effort in a manner of configuring a display screen with consideration of enhanced user's convenience. The present invention includes a display unit, a wireless communication unit for an internet access, a user input unit for receiving an input from a user, and a control unit controlling both a text input box and an indicator indicating one selected from the group consisting of at least two functions of the text input box to be displayed on a standby image of the display unit.

Abstract translation: 公开了一种用于控制移动终端的计算机程序产品和方法，通过该终端用户能够以考虑到增强的用户便利性的方式配置显示屏幕的方式以最小的努力向移动终端输入特定命令。 本发明包括显示单元，用于互联网接入的无线通信单元，用于从用户接收输入的用户输入单元，以及控制单元，控制文本输入框和指示从以下组成的组中选择的一个的指示： 要显示在显示单元的待机图像上的文本输入框的至少两个功能。

公开(公告)号：US20120299040A1

公开(公告)日：2012-11-29

申请号：US13478849

申请日：2012-05-23

Applicant: Tae Hun KIM ,  Seung Wan CHAE ,  Yong Il KIM ,  Seung Jae LEE ,  Tae Sung JANG ,  Jong Rak SOHN ,  Bo Kyoung KIM

Inventor： Tae Hun KIM ,  Seung Wan CHAE ,  Yong Il KIM ,  Seung Jae LEE ,  Tae Sung JANG ,  Jong Rak SOHN ,  Bo Kyoung KIM

IPC: H01L33/60 ,  H01L33/62

CPC classification number: H01L33/46 ,  H01L33/20 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/00

Abstract: There is provided a semiconductor light emitting device including: a light transmissive substrate; a light emitting part; first and second electrodes electrically connected to the first and second conductivity type semiconductor layers, respectively; and a rear reflective part including a reflective metallic layer, and a light transmissive dielectric layer interposed between the light transmissive substrate and the reflective metallic layer.

Abstract translation: 提供了一种半导体发光器件，包括：透光衬底; 发光部分; 分别与第一和第二导电类型半导体层电连接的第一和第二电极; 以及包括反射金属层的后反射部分和介于透光基板和反射金属层之间的透光电介质层。

公开(公告)号：US20120176333A1

公开(公告)日：2012-07-12

申请号：US13423088

申请日：2012-03-16

Applicant: Tae Hun KIM ,  Jin Sang PARK

Inventor： Tae Hun KIM ,  Jin Sang PARK

IPC: G06F3/041 ,  G09G5/00

CPC classification number: G06F3/04886 ,  G06F3/0482 ,  H04M1/274558 ,  H04M1/274583 ,  H04M2250/22

Abstract: A mobile communication device capable of providing a candidate phone number list and a method of controlling an operation of the mobile communication device is provided. The method includes displaying a phone number input window and a display window on the touch screen, displaying a string of numbers input to the phone number input window in the display window and displaying a candidate phone number list on the touch screen if a touch input to the display window is detected when the input number string is displayed in the display window, the candidate phone number list including a plurality of phone numbers that contain the input number string.

Abstract translation: 提供了能提供候选电话号码列表的移动通信设备和控制移动通信设备的操作的方法。 该方法包括在触摸屏上显示电话号码输入窗口和显示窗口，在显示窗口中显示输入到电话号码输入窗口的号码串，并在触摸屏上显示候选电话号码列表，如果触摸输入 当在显示窗口中显示输入号码串时检测到显示窗口，候选电话号码列表包括包含输入号码串的多个电话号码。

公开(公告)号：US08159456B2

公开(公告)日：2012-04-17

申请号：US12326264

申请日：2008-12-02

Applicant: Tae Hun Kim ,  Jin Sang Park

Inventor： Tae Hun Kim ,  Jin Sang Park

IPC: G09G5/00

CPC classification number: G06F3/04886 ,  G06F3/0482 ,  H04M1/274558 ,  H04M1/274583 ,  H04M2250/22

Abstract: A mobile communication device capable of providing a candidate phone number list and a method of controlling an operation of the mobile communication device is provided. The method includes displaying a phone number input window and a display window on the touch screen, displaying a string of numbers input to the phone number input window in the display window and displaying a candidate phone number list on the touch screen if a touch input to the display window is detected when the input number string is displayed in the display window, the candidate phone number list including a plurality of phone numbers that contain the input number string.

Abstract translation: 提供了能提供候选电话号码列表的移动通信设备和控制移动通信设备的操作的方法。 该方法包括在触摸屏上显示电话号码输入窗口和显示窗口，在显示窗口中显示输入到电话号码输入窗口的号码串，并在触摸屏上显示候选电话号码列表，如果触摸输入 当在显示窗口中显示输入号码串时检测到显示窗口，候选电话号码列表包括包含输入号码串的多个电话号码。

公开(公告)号：US20120001152A1

公开(公告)日：2012-01-05

申请号：US13162254

申请日：2011-06-16

Applicant: Ki Sung KIM ,  Gi Bum KIM ,  Tae Hun KIM ,  Young Chul SHIN ,  Young Sun KIM

Inventor： Ki Sung KIM ,  Gi Bum KIM ,  Tae Hun KIM ,  Young Chul SHIN ,  Young Sun KIM

IPC: H01L33/06 ,  H01L33/22

CPC classification number: H01L33/22 ,  H01L33/0066 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/20 ,  H01L2933/0025 ,  H01L2933/0091

Abstract: A semiconductor light emitting diode (LED) and a manufacturing method thereof are disclosed. The method for manufacturing a semiconductor light emitting diode (LED) includes: forming a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a substrate with prominences and depressions; removing the substrate from the light emission structure to expose a first concavoconvex portion corresponding to the prominences and depressions; forming a protection layer on the first concavoconvex portion; removing a portion of the protection layer to expose a convex portion of the first concavoconvex portion; and forming a second concavoconvex portion on the convex portion of the first concavoconvex portion. The semiconductor light emitting diode (LED) includes: a light emission structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first concavoconvex portion formed on the light emission structure and having a second concavoconvex portion at a convex portion thereof; and a protection layer filling up a concave portion of the first concavoconvex portion.

Abstract translation: 公开了一种半导体发光二极管（LED）及其制造方法。 制造半导体发光二极管（LED）的方法包括：在具有突起和凹陷的基板上形成包括第一导电半导体层，有源层和第二导电半导体层的发光结构; 从所述发光结构去除所述衬底以暴露对应于所述突起和凹陷的第一凹凸部分; 在第一凹凸部上形成保护层; 去除所述保护层的一部分以暴露所述第一凹凸部的凸部; 以及在所述第一凹凸部的所述凸部上形成第二凹凸部。 半导体发光二极管（LED）包括：包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构; 形成在所述发光结构上的第一凹凸部，在其凸部具有第二凹凸部; 以及填充所述第一凹凸部的凹部的保护层。

公开(公告)号：US20110320969A1

公开(公告)日：2011-12-29

申请号：US13150528

申请日：2011-06-01

Applicant: Ju Hee HWANG ,  Jae Man HONG ,  Kyoung Jin KONG ,  Yun Seop GEUM ,  Tae Hun KIM ,  Jin Woo SHIN ,  Pil Woo LEE

Inventor： Ju Hee HWANG ,  Jae Man HONG ,  Kyoung Jin KONG ,  Yun Seop GEUM ,  Tae Hun KIM ,  Jin Woo SHIN ,  Pil Woo LEE

IPC: G06F3/048

CPC classification number: G06F3/0485 ,  G06F1/1626 ,  G06F1/1694 ,  G06F3/017 ,  G06F3/0304 ,  G06F3/04815 ,  G06F3/0482 ,  G06F3/04886 ,  G06F2203/04802 ,  G09G3/003 ,  G09G5/00 ,  G09G2340/14

Abstract: Provided is a three-dimensional (3D) object processing apparatus. The apparatus is capable of interacting with a user and utilizes a stereoscopic effect of a 3D user interface (UI) as information. The apparatus includes a combination of various units, including but not limited to, a display panel, a sensing unit and control unit to effectuate interaction between a user and a 3D object sourced from the apparatus.

Abstract translation: 提供一种三维（3D）对象处理装置。 该装置能够与用户交互并利用3D用户界面（UI）的立体效果作为信息。 该装置包括各种单元的组合，包括但不限于显示面板，感测单元和控制单元，以实现用户和来自该设备的3D对象之间的交互。

公开(公告)号：US20110242021A1

公开(公告)日：2011-10-06

申请号：US12949874

申请日：2010-11-19

Applicant: Woo-Sik JUN ,  Jin-Woo PARK ,  Won-Kyu KWAK ,  Won-Woong JUNG ,  Dae-Hyun KIM ,  Tae-Hun KIM ,  Jae-Sun LEE ,  Ung-Soo LEE ,  Ryan CHOI ,  Kevin HEO

Inventor： Woo-Sik JUN ,  Jin-Woo PARK ,  Won-Kyu KWAK ,  Won-Woong JUNG ,  Dae-Hyun KIM ,  Tae-Hun KIM ,  Jae-Sun LEE ,  Ung-Soo LEE ,  Ryan CHOI ,  Kevin HEO

IPC: G06F3/041 ,  B05D5/12

CPC classification number: G06F3/044 ,  G02F1/13338 ,  G06F2203/04103 ,  G06F2203/04111

Abstract: A structure for forming a touch screen panel directly on an upper substrate of a flat panel display device, and more particularly a touch screen panel integrated flat panel display device in which an insulating layer formed on the touch screen panel is implemented by a spin on glass (SOG layer having stable thermal property suitable for high temperature plastic process of a sealing material for encapsulating the upper substrate and a lower substrate of the flat panel display device, and a method of fabricating the same.

Abstract translation: 一种直接在平板显示装置的上基板上形成触摸屏面板的结构，更具体地说是一种触摸屏面板集成平板显示装置，其中形成在触摸屏面板上的绝缘层通过旋转玻璃 （适用于封装上基板的密封材料和平板显示装置的下基板的高温塑性加工的具有稳定的热性质的SOG层及其制造方法。

公开(公告)号：US20110166121A1

公开(公告)日：2011-07-07

申请号：US13059832

申请日：2009-09-08

Applicant: Chang Seok Lee ,  Tae Hee Lee ,  Sook Kyung Yoon ,  Jeung Soon Choi ,  Yong Jin Jang ,  Sung Wook Kim ,  Hye Kyung Chang ,  Mi Jeong Park ,  Tae Hun Kim ,  Young Ha Ahn ,  Hee Dong Park ,  Hyun Jung Park ,  Dong Chul Lim ,  Joo Youn Lee ,  Sung Hack Lee ,  Wan Su Park ,  Yeong Soo Oh

Inventor： Chang Seok Lee ,  Tae Hee Lee ,  Sook Kyung Yoon ,  Jeung Soon Choi ,  Yong Jin Jang ,  Sung Wook Kim ,  Hye Kyung Chang ,  Mi Jeong Park ,  Tae Hun Kim ,  Young Ha Ahn ,  Hee Dong Park ,  Hyun Jung Park ,  Dong Chul Lim ,  Joo Youn Lee ,  Sung Hack Lee ,  Wan Su Park ,  Yeong Soo Oh

IPC: A61K31/397 ,  C07D487/04 ,  A61K31/4985 ,  A61K31/496 ,  A61K31/519 ,  A61P9/00 ,  A61P7/00

CPC classification number: C07D495/04 ,  C07D519/00

Abstract: The present invention relates to a fused heterocyclic compound having the Formula 1, which is useful as a platelet aggregation inhibitor, a method for preparing the same, and a pharmaceutical composition for inhibiting platelet aggregation comprising the same.

Abstract translation: 本发明涉及具有式1的稠合杂环化合物，其可用作血小板聚集抑制剂，其制备方法和包含其的用于抑制血小板聚集的药物组合物。

公开(公告)号：USD635535S1

公开(公告)日：2011-04-05

申请号：US29370860

申请日：2010-09-14

Applicant: Chul-Yong Cho ,  Sung-Il Bang ,  Tae-Hun Kim ,  Sin-Wi Moon ,  Yu-Li Sung

Designer： Chul-Yong Cho ,  Sung-Il Bang ,  Tae-Hun Kim ,  Sin-Wi Moon ,  Yu-Li Sung

公开(公告)号：US07868443B2

公开(公告)日：2011-01-11

申请号：US12603690

申请日：2009-10-22

Applicant: Heung-kyu Kwon ,  Tae-hun Kim ,  Su-chang Lee

Inventor： Heung-kyu Kwon ,  Tae-hun Kim ,  Su-chang Lee

IPC: H01L23/02 ,  H01L23/29 ,  H01L23/10 ,  H01L23/48 ,  H01L23/34 ,  H01L23/28 ,  H01L23/31

CPC classification number: H01L25/03 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from moisture penetration into a lower semiconductor chip. The vertical stack type multi-chip package comprises an organic substrate having a printed circuit pattern on which a semiconductor chip is mounted. A first semiconductor chip is mounted on a die bonding region of the organic substrate and is electrically connected to the organic substrate through a first wire. A metal stiffener is formed on the first semiconductor chip and connected to the organic substrate by a first ground unit around the first semiconductor chip. An encapsulant is used to seal the first semiconductor chip below the metal stiffener. A second semiconductor chip, which is larger in size than that the first semiconductor chip, is mounted on the metal stiffener and connected by a second ground unit. The second semiconductor chip is connected to the organic substrate by a second wire. A mold resin seals the second semiconductor chip and a solder ball is bonded to a solder ball pad below the organic substrate.

Abstract translation: 通过提高接地性能并防止多芯片封装的湿度渗透到下半导体芯片中的可靠性降低，提供了具有提高的可靠性的垂直堆叠型多芯片封装。 垂直堆叠型多芯片封装包括具有其上安装有半导体芯片的印刷电路图案的有机基板。 第一半导体芯片安装在有机基板的芯片接合区域上，并通过第一导线与有机基板电连接。 在第一半导体芯片上形成金属加强件，并通过第一半导体芯片周围的第一接地单元与有机基板连接。 密封剂用于将金属加强件下方的第一半导体芯片密封。 尺寸大于第一半导体芯片的第二半导体芯片安装在金属加强件上并通过第二接地单元连接。 第二半导体芯片通过第二线连接到有机基板。 模具树脂密封第二半导体芯片，焊球与有机基板下方的焊球焊盘接合。