摘要:
This disclosure concerns a semiconductor memory device comprising: a memory cell array having memory cells arrayed two-dimensionally; word lines connected to the memory cells of rows of the memory cell array; bit lines connected to the memory cells of columns of the memory cell array; sense amplifiers connected to the bit lines, and detecting data stored in the memory cells; a test pad passing a predetermined reference current from a power source, and transmitting a reference voltage based on the reference current; and test circuits connected between the power source and the test pad and intervening between the power source and the bit lines, the test circuits passing test currents according to the reference voltage via the bit lines.
摘要:
A semiconductor storage device according to the present invention, comprising: a first semiconductor layer formed on a substrate via a buried insulation layer; an FBC (Floating Body Cell) having a channel body of floating type formed on the first semiconductor layer, a main gate which forms a channel at a first face side of the channel body, and an auxiliary gate formed to capacitively couple on a second face at an opposite side of the first face; a logic circuit formed on the first semiconductor layer, separate from the FBC by an insulation film, which transfers a signal for the FBC; a second semiconductor layer which locates below the FBC and is formed along an under face of the buried insulation film; and a third semiconductor layer which locates below the logic circuit and is formed along an under face of the buried insulation film, wherein the second and third semiconductor layers are set to be in a potential different from each other.
摘要:
This disclosure concerns a memory comprising a charge trapping film; a gate insulating film; a back gate on the charge trapping film; a front gate on the gate insulating film; and a body region provided between a drain and a source, wherein the memory includes a first storage state for storing data depending on the number of majority carriers in the body region and a second storage state for storing data depending on the amount of charges in the charge trapping film, and the memory is shifted from the first storage state to the second storage state by converting the number of majority carriers in the body region into the amount of charges in the charge trapping film or from the second storage state to the first storage state by converting the amount of charges in the charge trapping film into the number of majority carriers in the body region.
摘要:
A memory includes: first sense amplifiers arranged in a first interval of an arrangement of memory cell arrays, each being connected to first bit lines corresponding to two memory cell arrays provided at both sides of the first sense amplifier; second sense amplifiers arranged in a second interval of the arrangement of the memory cell arrays, each being connected to second bit lines corresponding to two memory cell arrays at both sides of the second sense amplifier; edge arrays provided beside both ends of an arrangement of the memory cell arrays, the edge arrays generating only the reference data; and edge sense amplifiers provided between the arrangement of the memory cell arrays and the edge arrays, wherein the edge sense amplifier detects data from the memory cell array at one end of the memory cell arrays based on the reference data from one of the edge arrays.
摘要:
A DC/DC converter device according to the present invention includes a plurality of resonant DC/DC converters 3, connected in parallel, and a timing control circuit 5 driving the plurality of resonant DC/DC converters at substantially the same frequency with a phase shift.
摘要:
A high-voltage generating transformer for a discharge lamp lighting apparatus according to the present invention includes a rodlike core; a secondary winding bobbin that is divided into a plurality of sections, and where the core is disposed in the central portion thereof; a secondary winding part wound on the secondary winding bobbin, divided between the plurality of sections of the bobbin; a primary winding bobbin disposed around the outer periphery of the secondary winding part; and a primary winding part wound on the primary winding bobbin; wherein the primary winding bobbin is changed in thickness every section or every plurality of sections of the second winding part such that the bobbin has a thickened thickness on the side where the potential difference between the primary winding part and the secondary winding part is high, and the bobbin has a thinned thickness on the side where the potential difference is low.
摘要:
This disclosure concerns a semiconductor storage device comprising a semiconductor layer provided on the insulation layer provided on the semiconductor substrate; a source layer and a drain layer provided in the semiconductor layer; a body provided between the source layer and the drain layer, the body being in an electrically floating state; an emitter layer contacting with the source layer, the emitter layer having an opposite conductive type to the source layer; a word line including the source layer, the drain layer, and the body, the word line being provided to memory cells arrayed in a first direction in a plurality of tow-dimensionally arranged memory cells; a source line connected to the source layers of the memory cells arrayed in the first direction; and a bit line connected to the drain layers of the memory cells arrayed in a second direction intersecting the first direction.
摘要:
A semiconductor storage device according to the present invention, comprising: a first semiconductor layer formed on a substrate via a buried insulation layer; an FBC (Floating Body Cell) having a channel body of floating type formed on the first semiconductor layer, a main gate which forms a channel at a first face side of the channel body, and an auxiliary gate formed to capacitively couple on a second face at an opposite side of the first face; a logic circuit formed on the first semiconductor layer, separate from the FBC by an insulation film, which transfers a signal for the FBC; a second semiconductor layer which locates below the FBC and is formed along an under face of the buried insulation film; and a third semiconductor layer which locates below the logic circuit and is formed along an under face of the buried insulation film, wherein the second and third semiconductor layers are set to be in a potential different from each other.
摘要:
This disclosure concerns a memory including a memory cell including a floating body in an electrically floating state and storing data according to the number of majority carriers in the floating body; a word line connected to a gate of the memory cell; a first bit line connected to the memory cell to transmit the data; a second bit line transmitting reference data used to detect the data stored in the memory cell; a first sense node and a second sense node transmitting the data stored in the memory cell and the reference data, respectively; a first short-circuiting switch provided between the first sense node and the second sense node; and a first flip-flop applying a load current to the memory cell during a data read operation and amplifying a potential difference generated between the first sense node and the second sense node by turning off the first short-circuiting switch
摘要:
The disclosure concerns a semiconductor memory device that includes memory cells that store data by accumulating or discharging an electric charge; memory cell arrays having a plurality of the memory cells disposed in a matrix; a plurality of word lines connected to the memory cells arrayed in rows of the memory cell arrays; a plurality of bit lines connected to the memory cells arrayed in columns of the memory cell arrays; a plurality of dummy cells arrayed in a row direction of the memory cell arrays and are connected to the bit lines; sense amplifiers detecting data within the memory cells by using an average value of electric characteristics of the dummy cells that store mutually different digital data as a reference signal; and a plurality of switching elements electrically connecting four or more of the bit lines in order to generate the reference signal.