-
公开(公告)号：US10822471B2
公开(公告)日：2020-11-03
申请号：US13202414
申请日：2010-02-24
IPC分类号： F16G1/06 , C08K3/34 , C08L23/16 , F16G5/20 , C08L77/00 , C08K3/26 , C08K7/26 , C08K5/04 , C08K3/06 , C08L91/00
摘要： A friction drive belt (B) includes a belt body (10) that is wrapped around pulleys in contact therewith to transmit power. At least a pulley contact portion (15) of the belt main body (10) is made of a rubber composition containing 30-80 parts by mass of at least one layered silicate selected from a smectite group and a vermiculite group, per 100 parts by mass of raw rubber containing an ethylene-α-olefin elastomer.
-
公开(公告)号：US09698037B2
公开(公告)日：2017-07-04
申请号：US13156925
申请日：2011-06-09
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67757 , H01L21/67017
摘要： A substrate processing apparatus includes a holder configured to hold a substrate and carry the substrate into a process chamber, a waiting station located outside the process chamber in which the holder waits prior to carrying the substrate into the process chamber, a circulation path configured to circulate a gas throughout the waiting station, and an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station.
-
公开(公告)号：USD651990S1
公开(公告)日：2012-01-10
申请号：US29371214
申请日：2010-11-29
-
公开(公告)号：US20110305543A1
公开(公告)日：2011-12-15
申请号：US13156925
申请日：2011-06-09
IPC分类号： H01L21/677 , H01L21/673
CPC分类号： H01L21/67757 , H01L21/67017
摘要： A substrate processing apparatus includes a holder configured to hold a substrate and carry the substrate into a process chamber, a waiting station located outside the process chamber in which the holder waits prior to carrying the substrate into the process chamber, a circulation path configured to circulate a gas throughout the waiting station, and an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station.
摘要翻译： 基板处理装置包括保持器，其构造成保持基板并将基板运送到处理室中，等待站位于处理室外部，其中保持器在将基板运送到处理室之前等待，循环路径被配置为循环 整个等候站内的气体，以及形成在循环路径中的排气路径，其构造成从等待站排出气体。
-
公开(公告)号：US07917872B2
公开(公告)日：2011-03-29
申请号：US12111470
申请日：2008-04-29
IPC分类号： G06F17/50
CPC分类号： G06F17/5031
摘要： A simulation method to be implemented in a computer causes the computer to execute a procedure carrying out a weighting with respect to layout parameters of a circuit, which is an analyzing target, based on priority information of cells forming the circuit, and converting the weighted layout parameters into physical characteristics and storing the physical characteristics in a memory part, a procedure converting the physical characteristic read from the memory part into circuit parameters and storing the circuit parameters into the memory part, and analyzing the circuit based on a net list including the circuit parameters read from the memory part.
摘要翻译： 要在计算机中实现的模拟方法使得计算机基于作为分析对象的电路的布局参数，基于形成电路的单元的优先级信息来执行对加权的加权，并且将加权布局 参数转换为物理特性并将物理特性存储在存储器部分中，将从存储器部分读取的物理特性转换为电路参数并将电路参数存储到存储器部分中的过程，以及基于包括电路的网络列表来分析电路 参数从内存部分读取。
-
公开(公告)号：US20100240809A1
公开(公告)日：2010-09-23
申请号：US12741399
申请日：2008-10-27
申请人： Tomoyuki Yamada
发明人： Tomoyuki Yamada
IPC分类号： C08K5/16
CPC分类号： F16G5/04 , C08L23/0815 , C08L23/16 , F16G1/06 , C08L2666/02
摘要： An object is to provide a rubber composition that is capable of significantly improving mechanical properties. Another object is to provide a rubber belt that has excellent mechanical properties. Provided are a rubber composition, and a rubber belt formed by using the rubber composition, which is incorporated with a rubber component containing an ethylene/α-olefin copolymer, and an organically treated clay mineral organically treated with an organic ammonium ion, wherein the ethylene content of the ethylene/α-olefin copolymer is in a range of 60-85% by mass, the rubber component has a Mooney viscosity of 10-55 at 125° C., and the organically treated clay mineral is incorporated in 6-30 parts by mass per 100 parts by mass of the rubber component.
摘要翻译： 目的在于提供能够显着改善机械性能的橡胶组合物。 另一个目的是提供一种具有优异机械性能的橡胶带。 提供了一种橡胶组合物和通过使用橡胶组合物形成的橡胶带，该橡胶组合物与含有乙烯/α-烯烃共聚物的橡胶组分和用有机铵离子有机处理的有机处理的粘土矿物混合，其中乙烯 乙烯/α-烯烃共聚物的含量在60-85质量％的范围内，橡胶组分在125℃下门尼粘度为10-55，有机处理的粘土矿物掺入6-30 相对于100质量份橡胶成分为质量份。
-
公开(公告)号：US20100155770A1
公开(公告)日：2010-06-24
申请号：US12716938
申请日：2010-03-03
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L23/49582 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/85439 , H01L2224/85464 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2224/45099 , H01L2924/00
摘要： A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.
摘要翻译： 通过以大致整体的方式施加镀镍（102），镀钯（103）和镀金（104）的方式形成用于半导体器件的引线框架（100），以引导诸如铜薄板的框架体（101） 并且进一步将银电镀（105）选择性地施加到将被半导体器件的封装封装的内部部分的一部分。 引线框架（100）还可以包括封装的基部。 镀银有助于内部部件的良好的光反射率和引线接合效率，而闪镀电镀有助于在封装外部的外部部件具有优异的耐腐蚀性和焊接效率。
-
公开(公告)号：US20090037855A1
公开(公告)日：2009-02-05
申请号：US12111470
申请日：2008-04-29
IPC分类号： G06F17/50
CPC分类号： G06F17/5031
摘要： A simulation method to be implemented in a computer causes the computer to execute a procedure carrying out a weighting with respect to layout parameters of a circuit, which is an analyzing target, based on priority information of cells forming the circuit, and converting the weighted layout parameters into physical characteristics and storing the physical characteristics in a memory part, a procedure converting the physical characteristic read from the memory part into circuit parameters and storing the circuit parameters into the memory part, and analyzing the circuit based on a net list including the circuit parameters read from the memory part.
摘要翻译： 要在计算机中实现的模拟方法使得计算机基于作为分析对象的电路的布局参数，基于形成电路的单元的优先级信息来执行对加权的加权，并且将加权布局 参数转换为物理特性并将物理特性存储在存储器部分中，将从存储器部分读取的物理特性转换为电路参数并将电路参数存储到存储器部分中的过程，以及基于包括电路的网络列表来分析电路 参数从内存部分读取。
-
19.发明授权Milling and classifying apparatus, collision mill, air classifier, toner, and method for producing toner 有权研磨和分级设备，碰撞磨机，空气分级机，调色剂和生产调色剂的方法公开(公告)号：US07438245B2
公开(公告)日：2008-10-21
申请号：US11178457
申请日：2005-07-12
申请人： Masahiro Kawamoto , Kohta Wakimoto , Kohji Kubota , Mamoru Kawaguchi , Yoshiyuki Okegawa , Hideyuki Ueda , Masayuki Kakimoto , Hiroaki Sugiyama , Tomoyuki Yamada , Yuuichi Kohyama , Masato Kobayashi , Fumio Nishide , Kenkoh Degura , Hirofumi Yamanaka , Tohru Suganuma , Shoji Watanabe , Ikuo Tasaki
发明人： Masahiro Kawamoto , Kohta Wakimoto , Kohji Kubota , Mamoru Kawaguchi , Yoshiyuki Okegawa , Hideyuki Ueda , Masayuki Kakimoto , Hiroaki Sugiyama , Tomoyuki Yamada , Yuuichi Kohyama , Masato Kobayashi , Fumio Nishide , Kenkoh Degura , Hirofumi Yamanaka , Tohru Suganuma , Shoji Watanabe , Ikuo Tasaki
CPC分类号： B02C23/12 , B02C19/066 , B07B7/086 , G03G9/0817
摘要： Disclosed is a milling and classifying apparatus, adapted to produce toner fine particles, comprising a collision mill, and an air classifier, wherein the collision mill comprises a jet nozzle room, a path, a collision plate, and a collision member mounted to a support of the collision plate at downstream of the collision plate, the air classifier comprises a dispersion room and a classification room, the classification room is disposed below the dispersion room, and a flow stabilizer is arranged at a central suction of the separator core to control swirl stream generated within the classification room so as to centrifuge the powder into coarse particles and fine particles by action of the swirl stream.
摘要翻译： 公开了一种用于生产调色剂细颗粒的研磨和分级设备，包括碰撞磨机和空气分级机，其中所述碰撞磨机包括喷射喷嘴室，路径，碰撞板和安装到支撑件上的碰撞构件 在空气分级器包括分散室和分类室，分级室设置在分散室下方，流动稳定器布置在分离器芯的中心抽吸处以控制涡流 在分级室内产生的流，以便通过旋流流的作用将粉末离心成粗颗粒和细颗粒。
-
公开(公告)号：US5252548A
公开(公告)日：1993-10-12
申请号：US815562
申请日：1991-12-26
申请人： Hitoshi Abe , Tomoyuki Yamada
发明人： Hitoshi Abe , Tomoyuki Yamada
CPC分类号： H01L39/2432 , H01L39/2496 , Y10S505/701 , Y10S505/702 , Y10S505/729 , Y10S505/73 , Y10S505/731
摘要： In a method of forming an oxide superconductor/semiconductor junction between an oxide superconductor and a semiconductor containing bismuth or thallium, an atomic layer of silver of no more than 3 atoms thickness is formed by vapor deposition of silver on the surface of the semiconductor, an atomic layer of bismuth or thallium of no more than 3 atoms thickness is formed by vapor deposition of bismuth or thallium on the silver layer, the double atomic layer consisting of silver and bismuth or of silver and thallium are heated to form a layer wherein the atoms of silver and bismuth or silver and thallium are arranged regularly on the surface of the semiconductor, and the oxide superconductor is formed to a specified thickness on the regularly arranged layer.
摘要翻译： 在氧化物超导体和含有铋或铊的半导体之间形成氧化物超导体/半导体结的方法中，通过在半导体的表面上蒸镀银而形成不大于3原子厚的银的原子层， 通过在银层上铋或铊的气相沉积形成不超过3个原子厚度的铋或铊的原子层，将由银和铋或银和铊组成的双原子层加热形成其中原子 的银和铋或银和铊规则地排列在半导体的表面上，并且氧化物超导体在规则排列的层上形成为规定的厚度。
-
-
-
-
-
-
-
-
-
搜索结果
60 条记录 (耗时 0.014 秒)
