公开(公告)号：US20110305543A1

公开(公告)日：2011-12-15

申请号：US13156925

申请日：2011-06-09

申请人： Seiyo NAKASHIMA ,  Yuichi MATSUDA ,  Takashi NOGAMI ,  Shinobu SUGIURA ,  Tomoyuki YAMADA

发明人： Seiyo NAKASHIMA ,  Yuichi MATSUDA ,  Takashi NOGAMI ,  Shinobu SUGIURA ,  Tomoyuki YAMADA

IPC分类号： H01L21/677 ,  H01L21/673

CPC分类号： H01L21/67757 ,  H01L21/67017

摘要： A substrate processing apparatus includes a holder configured to hold a substrate and carry the substrate into a process chamber, a waiting station located outside the process chamber in which the holder waits prior to carrying the substrate into the process chamber, a circulation path configured to circulate a gas throughout the waiting station, and an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station.

摘要翻译： 基板处理装置包括保持器，其构造成保持基板并将基板运送到处理室中，等待站位于处理室外部，其中保持器在将基板运送到处理室之前等待，循环路径被配置为循环 整个等候站内的气体，以及形成在循环路径中的排气路径，其构造成从等待站排出气体。

公开(公告)号：US20110184991A1

公开(公告)日：2011-07-28

申请号：US13005157

申请日：2011-01-12

申请人： Yuichi MATSUDA ,  Yuji Nomura

发明人： Yuichi MATSUDA ,  Yuji Nomura

IPC分类号： G06F17/30

CPC分类号： H04L41/069 ,  G06F11/079 ,  H04L41/0622

摘要： A computer-readable non-transitory recording medium storing therein an information managing program causing a computer to execute extracting from among events that have occurred at objects under management and having dependence relations, combinations of a first event that has occurred at a source-of-dependence object and a second event that has occurred at a dependent object dependent on the source-of-dependence object; judging for each extracted combination, whether a dependence relation exists between the first event and the second event, by using the difference between the time of occurrence of the first event and that of the second event; determining from among the events and based on a judgment result obtained at the judging, an event that has occurred at an object that is a source-of-dependence object but not a dependent object, to be an event to be stored; and storing to a database, information related to the event to be stored.

摘要翻译： 一种存储信息管理程序的计算机可读的非暂时性记录介质，其使得计算机执行从在管理对象发生的事件中提取并具有依赖关系的信息管理程序， 依赖对象和依赖于依赖关系对象的依赖对象发生的第二个事件; 对于每个提取的组合，通过使用第一事件的发生时间和第二事件的发生时间之间的差异，判断第一事件和第二事件之间是否存在依赖关系; 从所述事件中确定并且基于在所述判断处获得的判断结果，将在作为依赖源的对象而不是依赖对象的对象发生的事件作为要存储的事件; 并向数据库存储与要存储的事件相关的信息。

公开(公告)号：US20100307808A1

公开(公告)日：2010-12-09

申请号：US12792334

申请日：2010-06-02

申请人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA ,  Masao NAKAZAWA

发明人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA ,  Masao NAKAZAWA

IPC分类号： H05K1/11

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/0287 ,  H05K1/0306 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/09609 ,  H05K2201/09945 ,  H01L2924/00 ,  H01L2224/0401

摘要： A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and piercing the insulating base material in a thickness direction thereof. Pads made of portions of wiring layers are oppositely disposed on both surfaces of the core substrate and electrically connected to opposite ends of a plurality of filamentous conductors in such a manner that the pads share the filamentous conductors. A wiring connection between one surface side and the other surface side of the core substrate is made through the pads. The insulating base material is made of an inorganic dielectric. Pads made of portions of the wiring layers are disposed on both surfaces of the core substrate and electrically connected only to corresponding one end sides of different groups each formed of a plurality of filamentous conductors.

摘要翻译： 布线基板包括芯基板，该芯基板具有密封地设置在绝缘基材中的绝缘基材和大量丝状导体，并且在其厚度方向上刺穿绝缘基材。 由布线层部分构成的垫相对地设置在芯基板的两个表面上，并且以多个丝状导体的相对端电连接，使得焊盘共享丝状导体。 通过焊盘制造芯基板的一个表面侧和另一个表面侧之间的布线连接。 绝缘基材由无机电介质制成。 由布线层的一部分制成的垫片设置在芯基板的两个表面上，并且仅电连接到由多个丝状导体形成的不同组的相应一端侧。

公开(公告)号：US20110095433A1

公开(公告)日：2011-04-28

申请号：US12908943

申请日：2010-10-21

申请人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA ,  Tsuyoshi KOBAYASHI ,  Tatsuaki DENDA

发明人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA ,  Tsuyoshi KOBAYASHI ,  Tatsuaki DENDA

IPC分类号： H01L23/535 ,  H05K1/02 ,  H01L21/768 ,  B05D5/12

CPC分类号： H05K3/323 ,  H01L24/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0315 ,  H05K2203/1142 ,  H05K2203/1147 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

摘要： There is provided a method of manufacturing a conductive film. The method includes: (a) providing an anodized layer having a plurality of through holes extending therethrough in its thickness direction; (b) forming a plurality of linear conductors by filling each of the through holes with a conductive material; (c) forming protection layers on both surfaces of the anodized layer; (d) removing the anodized layer to form a plurality of gaps between the linear conductors; (e) forming an organic insulation layer between the protection layers to fill the gaps with the organic insulation layer; and (f) removing the protection layers.

摘要翻译： 提供了一种制造导电膜的方法。 该方法包括：（a）提供阳极氧化层，其具有在其厚度方向上延伸穿过其中的多个通孔; （b）通过用导电材料填充每个所述通孔来形成多个线性导体; （c）在阳极氧化层的两个表面上形成保护层; （d）去除所述阳极化层以在所述线状导体之间形成多个间隙; （e）在保护层之间形成有机绝缘层，以用有机绝缘层填充间隙; 和（f）去除保护层。

公开(公告)号：US20120313245A1

公开(公告)日：2012-12-13

申请号：US13493123

申请日：2012-06-11

申请人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA

发明人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA

IPC分类号： H01L23/52

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00

摘要： One embodiment provides a semiconductor device having: a core substrate having first and second surfaces and an accommodation hole penetrating therethrough; a semiconductor element accommodated in the accommodation hole so that a front surface thereof is on the first surface side; a first metal film formed on a back surface of the semiconductor element; a second metal film formed on the second surface of the core substrate; an insulating layer covering the first and second metal films; and a third metal film formed on the insulating layer, via parts thereof penetrating through the insulating layer to respectively reach the first and second metal films.

摘要翻译： 一个实施例提供一种半导体器件，其具有：具有第一和第二表面的芯基板和贯穿其中的容纳孔; 容纳在所述容纳孔中使得其前表面位于所述第一表面侧的半导体元件; 形成在所述半导体元件的背面上的第一金属膜; 形成在芯基板的第二表面上的第二金属膜; 覆盖第一和第二金属膜的绝缘层; 以及形成在所述绝缘层上的第三金属膜，经由其穿过所述绝缘层的部分分别到达所述第一和第二金属膜。