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11.发明授权公开(公告)号：US06989277B2
公开(公告)日：2006-01-24
申请号：US10448400
申请日：2003-05-30
Applicant: Jyisy Yang , Yu-Ching Liu , Shyhliang A. Lou
Inventor： Jyisy Yang , Yu-Ching Liu , Shyhliang A. Lou
IPC: G01N33/543
CPC classification number: G01N21/3577 , G01N21/3563
Abstract: This invention relates to a method for immunoassays based on infrared reflection absorption spectroscopy that utilizes proteins such as antigen and antibody that have specific absorptions in infrared absorption spectrum under 1550 cm−1. A chip is made from infrared reflective substrates such as a gold or silver plate, whereon the antibodies or antigens are immobilized by the specific bonding action between metal surfaces of the chip and proteins, and the protein signals are then detected by infrared reflection-absorption and infrared microscopy. Since infrared radiation is capable of interacting with any organic molecules, there is no need to label the samples with fluorescent reagents or nucleic irradiation reagent. This invention thus provides a label-free process that can avoid the inconvenience of labeling common biochemical material for detection in the prior art, thus achieving the purpose of higher speed of detection.
Abstract translation: 本发明涉及一种基于红外反射吸收光谱法的免疫测定方法，其利用在1550cm -1以下的红外吸收光谱中具有特异吸收光谱的抗原和抗体等蛋白质。 芯片由诸如金或银板的红外反射基板制成，其中抗体或抗原通过芯片和蛋白质的金属表面之间的特异性结合作用被固定，然后通过红外反射吸收来检测蛋白质信号， 红外显微镜。 由于红外辐射能够与任何有机分子相互作用，所以不需要用荧光试剂或核辐射试剂标记样品。 因此，本发明提供了一种无标记的方法，其可以避免在现有技术中标记用于检测的常见生化材料的不便之处，从而达到更高检测速度的目的。
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公开(公告)号：US06960468B2
公开(公告)日：2005-11-01
申请号：US10136357
申请日：2002-05-02
Applicant: Bor-Iuan Jan , Jia-Huey Tsao , Chih-Wei Ho , Yu-Ching Liu , Chao-Chi Pan , Zu-Sho Chow , Yao-Sung Chang , Cheng-Tao Wu , Wen-Hsun Kuo
Inventor： Bor-Iuan Jan , Jia-Huey Tsao , Chih-Wei Ho , Yu-Ching Liu , Chao-Chi Pan , Zu-Sho Chow , Yao-Sung Chang , Cheng-Tao Wu , Wen-Hsun Kuo
CPC classification number: B82Y30/00 , B01J2219/00387 , B01J2219/00527 , B01J2219/00576 , B01J2219/00605 , B01J2219/0061 , B01J2219/00612 , B01J2219/00617 , B01J2219/00619 , B01J2219/00626 , B01J2219/00637 , B01J2219/00677 , B01J2219/0072 , B01J2219/00722 , B01J2219/00725 , B01J2219/00729 , C40B40/06 , C40B40/10 , C40B60/14 , G01N33/545 , G02B21/34 , Y10T436/143333
Abstract: The invention discloses an on-spot hydrophilic enhanced slide/microarray. The preparation method relates to a hydrophobic copolymer prepared by blending, grafting or co-polymerization of a hydrophobic material and a compound bearing functional groups such as anhydride, imide, cyclic amide, and cyclic ester, and application of the hydrophobic copolymer onto an organic or inorganic substrate. The resulting slide has the properties of on-spot hydrophilic/hydrophobic dynamic conversion, as well as on-spot hydrophilic enhancement for the preparation of high-density and high-efficiency bio-chip/microarray.
Abstract translation: 本发明公开了一种现场亲水增强载玻片/微阵列。 该制备方法涉及通过共混，接枝或共聚疏水材料和带有官能团的化合物如酸酐，酰亚胺，环状酰胺和环状酯制备的疏水性共聚物，以及将疏水性共聚物应用于有机或 无机底物。 所得到的载片具有现场亲水/疏水动态转化的性质，以及用于制备高密度和高效率生物芯片/微阵列的现场亲水增强。
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13.发明授权Activated inorganic slide having aldehyde groups deposited by plasma deposition 有权通过等离子体沉积沉积醛基的活性无机载片公开(公告)号：US06528291B1
公开(公告)日：2003-03-04
申请号：US09658945
申请日：2000-09-11
Applicant: Zu-Sho Chow , Jia-Huey Tsao , Wen-Hsun Kuo , Chih-Wei Ho , Bor-Iuan Jan , Chao-Chi Pan , Yao-Sung Chang , Cheng-Tao Wu , Yu-Ching Liu
Inventor： Zu-Sho Chow , Jia-Huey Tsao , Wen-Hsun Kuo , Chih-Wei Ho , Bor-Iuan Jan , Chao-Chi Pan , Yao-Sung Chang , Cheng-Tao Wu , Yu-Ching Liu
IPC: C12N1114
CPC classification number: B01J19/0046 , B01J2219/00274 , B01J2219/00576 , B01J2219/00677 , G01N33/54353 , G01N33/545 , G01N33/551 , G01N33/552 , Y10S530/811 , Y10S530/815 , Y10S530/816
Abstract: A method is provided for preparing an active slide, including introducing a monomer containing an aldehyde group, or a mixture of a monomer containing an aldehyde group and an acidic functional group provider into a plasma chamber; and depositing the aldehyde group and acidic functional group onto the surface of an organic or inorganic matrix using plasma deposition to form a slide comprising a layer of polymerized actively functional groups thereon. The aldehyde groups and negatively charged groups are deposited on the surface of the active slide, such that the bio-molecules bound thereto possess the properties of an inducible orientation and thus form a mono-layer.
Abstract translation: 提供了制备活性载体的方法，包括将含有醛基的单体或含有醛基的单体和酸性官能团提供剂的混合物引入等离子体室中; 以及使用等离子体沉积法将醛基和酸性官能团沉积在有机或无机基体的表面上以形成包含其上聚合的主动官能团层的载玻片。 醛基和带负电荷的基团沉积在活性载体的表面上，使得与其结合的生物分子具有可诱导取向的特性，从而形成单层。
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公开(公告)号：US20050059875A1
公开(公告)日：2005-03-17
申请号：US10820824
申请日：2004-04-09
Applicant: Yung-Ming Chung , Yu-Ching Liu
Inventor： Yung-Ming Chung , Yu-Ching Liu
CPC classification number: C12Q1/005 , A61B6/505 , A61B8/0875 , B82Y15/00 , B82Y30/00 , G01N2333/916
Abstract: This invention is related a biosensor for bone mineral density measurement, comprising a stimulating source; a transducer having antibodies against TRAP 5a, TRAP 5b or total TRAP (i.e. TRAP 5a+TRAP 5b) immobilized thereon; a signal detecting unit; and a signal processing unit; wherein the TRAP refers to tartrate-resistant acid phosphatase (TRAP). The method for bone mineral density measurement disclosed in this invention is detecting the concentration or activity of TRAP, TRAP 5a and TRAP 5b in blood by using the biosensor described above. Accordingly, the method can monitor changes of the bone mineral density to prevent osteoporosis.
Abstract translation: 本发明涉及用于骨矿物质密度测量的生物传感器，其包括刺激源; 具有针对固定在其上的TRAP 5a，TRAP 5b或总TRAP（即TRAP 5a + TRAP 5b）的抗体的传感器; 信号检测单元; 和信号处理单元; 其中TRAP指的是酒石酸抗性酸性磷酸酶（TRAP）。 本发明公开的骨矿物质密度测量方法是通过使用上述生物传感器检测血液中TRAP，TRAP 5a和TRAP 5b的浓度或活性。 因此，该方法可以监测骨矿物质密度的变化以预防骨质疏松症。
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公开(公告)号：US06733894B2
公开(公告)日：2004-05-11
申请号：US10246402
申请日：2002-09-19
Applicant: Chih-Wei Ho , Zu-Sho Chow , Bor-Iuan Jan , Jia-Huey Tsao , Chao-Chi Pan , Wen-Hsun Kuo , Yao-Sung Chang , Cheng-Tao Wu , Yu-Ching Liu
Inventor： Chih-Wei Ho , Zu-Sho Chow , Bor-Iuan Jan , Jia-Huey Tsao , Chao-Chi Pan , Wen-Hsun Kuo , Yao-Sung Chang , Cheng-Tao Wu , Yu-Ching Liu
IPC: B32B2742
CPC classification number: B82Y30/00 , B01J19/0046 , B01J2219/00387 , B01J2219/00529 , B01J2219/00576 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/0061 , B01J2219/00612 , B01J2219/00626 , B01J2219/00637 , B01J2219/00641 , B01J2219/00677 , C07B2200/11 , C40B60/14 , Y10T428/31612 , Y10T428/31663 , Y10T428/31667 , Y10T428/31786 , Y10T428/31938 , Y10T428/31942
Abstract: The invention features a method for preparing a high-density functional slide by coating a sol-gel containing amine-group bearing silanes and a solution containing polyaldehyde groups onto an organic or inorganic substrate, respectively. The resulting slide is useful in the preparation of highly homogeneous functional-group slides and the high-density and high-efficiency bio-chip/microarray.
Abstract translation: 本发明的特征在于通过将含有胺基的硅烷和含有多醛基团的溶液分别涂布到有机或无机基材上来制备高密度功能性载体的方法。 所得到的载片可用于制备高度均匀的功能团载片和高密度和高效率的生物芯片/微阵列。
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Patent Agency Ranking
公开(公告)号：US08994680B2
公开(公告)日：2015-03-31
申请号：US13615227
申请日：2012-09-13
Applicant: Szu-Wei Lai , Yu-Ching Liu , Wan-Yu Ho
Inventor： Szu-Wei Lai , Yu-Ching Liu , Wan-Yu Ho
CPC classification number: G06F3/0412 , G06F1/169 , G06F3/041 , G06F2203/04103 , H05K3/4685 , H05K2201/0326 , Y10T29/49155 , Y10T29/49162
Abstract: A system for displaying images is provided. The system includes a touch sensor device including a transparent substrate having a sensing region and a non-sensing region adjacent to the sensing region. A sensing electrode pattern layer is on the transparent substrate in the sensing region. An inorganic dielectric material layer is on the transparent substrate. The inorganic dielectric material layer has a first portion in the non-sensing region and a second portion in the sensing region and partially covering the sensing electrode pattern layer. A method of forming a touch sensor device is also disclosed.
Abstract translation: 提供了一种用于显示图像的系统。 该系统包括触摸传感器装置，其包括具有感测区域和与感测区域相邻的非感测区域的透明基板。 感测电极图案层位于感测区域中的透明衬底上。 无机介电材料层位于透明基板上。 无机介电材料层具有非感测区域中的第一部分和感测区域中的第二部分，并且部分地覆盖感测电极图案层。 还公开了一种形成触摸传感器装置的方法。
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公开(公告)号：US08537547B2
公开(公告)日：2013-09-17
申请号：US12982813
申请日：2010-12-30
Applicant: Yu-Ching Liu , Chi-An Yu , Xi-Hang Li , Bing Liu , Zhi-Bing Li , Jie-Peng Kang , Jing-Bin Liang , Hai-Gui Huang
Inventor： Yu-Ching Liu , Chi-An Yu , Xi-Hang Li , Bing Liu , Zhi-Bing Li , Jie-Peng Kang , Jing-Bin Liang , Hai-Gui Huang
IPC: H05K7/20
CPC classification number: H05K13/0486 , B23K1/018 , B23K3/00 , B23K3/08 , H05K7/20136
Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.
Abstract translation: 一种用于电路板组件的修理装置包括用于电路板组件与待修复表面相对的表面的冷却装置。 冷却装置限定用于接收电路板组件的室。 电路板组件设置在室内以在电路板组件和室的底部之间限定热交换空间。 还提供了修复电路板组件的方法。
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18.发明申请公开(公告)号：US20130161837A1
公开(公告)日：2013-06-27
申请号：US13490810
申请日：2012-06-07
Applicant: Chia-Yin Chen , Yu-Ching Liu , Yueh-Chiung Chang , Yu-Po Wang
Inventor： Chia-Yin Chen , Yu-Ching Liu , Yueh-Chiung Chang , Yu-Po Wang
CPC classification number: H01L24/03 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/03462 , H01L2224/03552 , H01L2224/0381 , H01L2224/03831 , H01L2224/04042 , H01L2224/27013 , H01L2224/29339 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/8385 , H01L2924/01028 , H01L2924/01029 , H01L2924/01079 , H01L2924/12042 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A packaging substrate and a semiconductor package using the packaging substrate are provided. The packaging substrate includes: a substrate body having a die attach area, a circuit layer formed around the die attach area and having a plurality of conductive traces each having a wire bonding pad, and a surface treatment layer formed on the wire bonding pads. Therein, only one of the conductive traces is connected to an electroplating line so as to prevent cross-talk that otherwise occurs between conductive traces due to too many electroplating lines in the prior art.
Abstract translation: 提供了使用封装基板的封装基板和半导体封装。 封装基板包括：具有管芯附着区域的基板主体，形成在管芯附着区域周围的电路层，并且具有多个导线，每个导线具有引线焊盘，以及形成在引线接合焊盘上的表面处理层。 其中，仅有一个导电迹线连接到电镀线，以便防止由于现有技术中的电镀线太多导致的导电迹线之间的串扰。
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公开(公告)号：US20120218853A1
公开(公告)日：2012-08-30
申请号：US13207454
申请日：2011-08-11
Applicant: YU-CHING LIU , FU-CHI YANG , CHI-AN YU , XI-HANG LI , BING LIU , JING-BIN LIANG , HAI-GUI HUANG , XUE-BING BAO
Inventor： YU-CHING LIU , FU-CHI YANG , CHI-AN YU , XI-HANG LI , BING LIU , JING-BIN LIANG , HAI-GUI HUANG , XUE-BING BAO
IPC: B01F11/00
CPC classification number: B01F11/0031 , B01F9/0014 , B01F9/10 , B01F11/0008
Abstract: A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.
Abstract translation: 焊膏混合器包括壳体，振动机构，旋转机构和用于固定焊膏罐的固定装置。 壳体限定接收空间，并且振动机构和旋转机构保持在接收空间内。 夹具可以通过振动机构振动并由旋转机构旋转。
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公开(公告)号：US20120008284A1
公开(公告)日：2012-01-12
申请号：US12982813
申请日：2010-12-30
Applicant: YU-CHING LIU , CHI-AN YU , XI-HANG LI , BING LIU , ZHI-BING LI , JIE-PENG KANG , JING-BIN LIANG , HAI-GUI HUANG
Inventor： YU-CHING LIU , CHI-AN YU , XI-HANG LI , BING LIU , ZHI-BING LI , JIE-PENG KANG , JING-BIN LIANG , HAI-GUI HUANG
IPC: H05K7/20
CPC classification number: H05K13/0486 , B23K1/018 , B23K3/00 , B23K3/08 , H05K7/20136
Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.
Abstract translation: 一种用于电路板组件的修理装置包括用于电路板组件与待修复表面相对的表面的冷却装置。 冷却装置限定用于接收电路板组件的室。 电路板组件设置在室内以在电路板组件和室的底部之间限定热交换空间。 还提供了修复电路板组件的方法。
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