公开(公告)号：US20110221047A1

公开(公告)日：2011-09-15

申请号：US13043782

申请日：2011-03-09

Applicant: YU-LIN YANG ,  LIH-MING DOONG

Inventor： YU-LIN YANG ,  LIH-MING DOONG

IPC: H01L23/495

CPC classification number: H01L23/4334 ,  H01L23/49572 ,  H01L2224/16245 ,  H01L2224/73253

Abstract: A flip chip package structure includes a chip placed under a lead frame, a bump on the upper surface of the chip that is electrically connected to the lead of the lead frame, and a backside metal on the lower surface of the chip that is exposed outside an encapsulant encapsulating the chip and a portion of the lead frame.

Abstract translation: 倒装芯片封装结构包括放置在引线框架下面的芯片，芯片上表面上的电连接到引线框架的引线的凸起，以及在外部暴露在芯片的下表面上的背面金属 密封剂封装芯片和引线框架的一部分。

公开(公告)号：US20090283896A1

公开(公告)日：2009-11-19

申请号：US12453405

申请日：2009-05-11

Applicant: Yu-Lin Yang

Inventor： Yu-Lin Yang

IPC: H01L23/498 ,  H01L21/98 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L21/56 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor die has a surface and an active region on the surface. A thick-film coating is applied to the surface of the semiconductor die to cover only a portion or entire of the active region before the semiconductor die is cut from a wafer. The thick-film coating reduces the stress to the semiconductor die. The thick-film coating does not cover the bonding pads of the semiconductor die to avoid influencing the bonding wires bonding to the boding pads.

Abstract translation: 半导体管芯具有表面和表面上的有源区。 在半导体管芯从晶片切割之前，将厚膜涂层施加到半导体管芯的表面，以仅覆盖有源区域的一部分或全部。 厚膜涂层减少了对半导体管芯的应力。 厚膜涂层不覆盖半导体管芯的接合焊盘，以避免影响结合到焊盘的接合线。

公开(公告)号：US20130307088A1

公开(公告)日：2013-11-21

申请号：US13475297

申请日：2012-05-18

Applicant: Yu-Lin Yang ,  Tsu-Hsiu Perng ,  Chih Chieh Yeh ,  Li-Shyue Lai

Inventor： Yu-Lin Yang ,  Tsu-Hsiu Perng ,  Chih Chieh Yeh ,  Li-Shyue Lai

IPC: H01L21/283 ,  H01L29/78

CPC classification number: H01L27/0886 ,  H01L29/0649 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/7845

Abstract: A method and device including a substrate having a fin. A metal gate structure is formed on the fin. The metal gate structure includes a stress metal layer formed on the fin such that the stress metal layer extends to a first height from an STI feature, the first height being greater than the fin height. A conduction metal layer is formed on the stress metal layer.

Abstract translation: 一种包括具有翅片的基板的方法和装置。 在翅片上形成金属栅极结构。 金属栅极结构包括形成在翅片上的应力金属层，使得应力金属层从STI特征延伸到第一高度，第一高度大于翅片高度。 在应力金属层上形成导电金属层。

公开(公告)号：US08097952B2

公开(公告)日：2012-01-17

申请号：US12693704

申请日：2010-01-26

Applicant: Yu-Lin Yang

Inventor： Yu-Lin Yang

IPC: H01L23/495 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/49575 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/37599 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10S257/923 ,  H01L2924/00 ,  H01L2224/37099

Abstract: An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the conductive strip may be carried out by an SMT process, and thus requires lower cost than wire bonding processes. A conductive strip may be bonded to more than two dice or leads to save more bonding wires. A conductive strip is stronger than a bonding wire, and thus lowers the possibility of being broken.

Abstract translation: 电子封装结构和方法使用导电条来将芯片到管芯，管芯到引线，芯片载体与引线或引线对引线接合。 导电带可以承载比接合线更大的电流，并且因此可以代替多个接合线。 导电带的接合可以通过SMT工艺进行，因此比引线键合工艺要低。 导电条可以结合到多于两个的骰子或导线上以节省更多的接合线。 导电条比接合线更强，从而降低破损的可能性。

公开(公告)号：US07960213B2

公开(公告)日：2011-06-14

申请号：US12693712

申请日：2010-01-26

Applicant: Yu-Lin Yang

Inventor： Yu-Lin Yang

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H01L23/49575 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/37599 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10S257/923 ,  H01L2924/00 ,  H01L2224/37099

Abstract: An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the conductive strip may be carried out by an SMT process, and thus requires lower cost than wire bonding processes. A conductive strip may be bonded to more than two dice or leads to save more bonding wires. A conductive strip is stronger than a bonding wire, and thus lowers the possibility of being broken.

Abstract translation: 电子封装结构和方法使用导电条来将芯片到管芯，管芯到引线，芯片载体与引线或引线对引线接合。 导电带可以承载比接合线更大的电流，并且因此可以代替多个接合线。 导电带的接合可以通过SMT工艺进行，因此比引线键合工艺要低。 导电条可以结合到多于两个的骰子或导线上以节省更多的接合线。 导电条比接合线更强，从而降低破损的可能性。

公开(公告)号：US20100108669A1

公开(公告)日：2010-05-06

申请号：US12458655

申请日：2009-07-20

Applicant: Yu-Lin Yang

Inventor： Yu-Lin Yang

IPC: B65D6/00

CPC classification number: B65D11/1873

Abstract: An assembly box structure includes two first side boards and two second side boards. Symmetric protruding portions are outwardly extended from two short sides of the first side boards. Symmetric recession portions are inwardly caved at two sides of a longer edge of the second side board. The protruding portion of one side of the first side board is embedded with the recession portion of the second side board through the two first side boards interlaced and assembled to the two second side boards, thereby rapidly assembling the hollow box body. Side bottom boards are extended from the bottoms of the first and second side boards. A plurality of through holes is arranged according to the proper distance spaced at interval. A plurality of expansion cylinders is at the periphery of the bottom of a bottom board, and corresponds to the through holes of each side bottom board.

Abstract translation: 组装盒结构包括两个第一侧板和两个第二侧板。 对称突出部分从第一侧板的两个短边向外延伸。 对称的凹陷部分在第二侧板的较长边缘的两侧向内凹陷。 第一侧板的一侧的突出部分通过两个第一侧板被嵌入第二侧板的凹陷部分，并将其组装到两个第二侧板上，从而快速组装中空箱体。 侧底板从第一和第二侧板的底部延伸。 多个通孔按照间隔隔开的适当距离排列。 多个膨胀圆筒位于底板的底部的周边，并且对应于每个侧板底板的通孔。

公开(公告)号：US20090289058A1

公开(公告)日：2009-11-26

申请号：US12230729

申请日：2008-09-04

Applicant: Yu-Lin Yang

Inventor： Yu-Lin Yang

IPC: B65D6/00

CPC classification number: B65D11/1873 ,  B65D21/083

Abstract: A box assembly includes a plurality of boards connected to each other and each of the boards includes a plurality of first flips on one side thereof and second flips on another side thereof. Each first flip is cooperated with a first slit which opens downward and each second flip is cooperated with a second slit which opens upward. When connecting two boards, the first flips are inserted into the second slits and the second flips are inserted into the first slits. The first and second flips may extend at angle from the boards so as to obtain a polygonal box.

Abstract translation: 盒组件包括彼此连接的多个板，并且每个板在其一侧上包括多个第一翻转，而在其另一侧上包括第二翻转。 每个第一翻转件与向下开口的第一狭缝配合，并且每个第二翻转件与向上打开的第二狭缝配合。 当连接两个板时，第一翻转被插入到第二个狭缝中，并且第二翻转被插入到第一个狭缝中。 第一和第二翻转可以与板的角度延伸以获得多边形盒。