Abstract:
Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.
Abstract:
An electronic device having openings covered by a vent assembly is disclosed. The vent assembly may include multiple adhesive layers surrounding an air-permeable, liquid resistant membrane that allow air to flow into and/or out of the electronic device, while also preventing liquid ingress into the electronic device. The membrane may be supported by several structural elements. For example, the vent assembly includes an adhesive layer secured with the membrane, with the adhesive layer including a web region having multiple ribs that engage the membrane. Also, the vent assembly includes a mesh material that includes a porous region that receives a portion of the adhesive layer. Also, an additional vent assembly may cover an additional opening of the electronic device and provide protection for an operational component in the electronic device. The additional vent assembly may allow air into the additional opening for the operational component.
Abstract:
A portable electronic device including an enclosure having an enclosure wall that forms an interior chamber. A speaker module is positioned within the interior chamber and includes a speaker and a module wall forming a back volume chamber of the speaker. The back volume chamber includes an acoustic vent port formed through the module wall to acoustically couple the back volume chamber to the interior chamber. The device further including an electromechanical valve for regulating the acoustic coupling of the back volume chamber to the interior chamber. The electromechanical valve is operable to transition between an open configuration in which the acoustic vent port is open to the interior chamber and a closed configuration in which the acoustic vent port is closed off from the interior chamber.
Abstract:
A heat spreader including multiple layers of anisotropic material to conduct thermal energy. Multiple graphite sheet layers may be laminated and each sheet may be thermally connected to one or more thermal energy sources in a portable electronic device. Methods for making a heat spreader are also disclosed.
Abstract:
This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.
Abstract:
An improved electrical connector retainer employs a shell having a cavity. A pair of mated electrical connectors are received within the cavity and at least a portion of an upper wall of the shell is deflected towards a lower wall of the shell. The shell is configured to retain the upper wall in the deflected position, maintaining the pair of connectors in the mated position.
Abstract:
Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
Abstract:
A control mechanism for an electronic device comprises a cover glass having an aperture defined therein. The aperture extends from an interior to an exterior of the device. A control member is positioned within the aperture, coupled to an actuator. The control member comprises a ceramic insert having a contact surface exposed to the exterior of the housing, operable to actuate the actuator in response to a force on the contact surface. A bearing member is molded about the insert. The bearing member has a hardness less than that of the ceramic insert, and less than that of the cover glass.
Abstract:
Methods and systems for processing touch inputs are disclosed. The invention in one respect includes reading data from a multi-touch sensing device such as a multi-touch touch screen where the data pertains to touch input with respect to the multi-touch sensing device, and identifying at least one multi-touch gesture based on the data from the multi-touch sensing device and providing an appropriate multi-haptic response.
Abstract:
An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.