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公开(公告)号：US20170065038A1
公开(公告)日：2017-03-09
申请号：US15258092
申请日：2016-09-07
Applicant: Apple Inc.
Inventor： James G. Griffin, II , Benjamin A. Shaffer , Edward Siahaan
CPC classification number: A44C5/0053 , A44C5/14 , A45F2005/008 , B29C66/14
Abstract: A wearable band formed from two or more pieces of material is disclosed. The wearable band may include a first material having a thinned portion formed on an inner surface and adjacent an end of the first material, and a second material positioned adjacent to the first material. The second material may include a thinned portion formed on an inner surface and adjacent an end of the second material. The wearable band may also include a coupling component configured to couple the first material to the second material. The thinned portion of the first material may be folded onto itself, and the thinned portion of the second material may be folded onto itself.
Abstract translation: 公开了由两片或多片材料形成的可穿戴带。 可穿戴带可以包括具有形成在内表面上并且邻近第一材料的端部的变薄部分的第一材料和邻近第一材料定位的第二材料。 第二材料可以包括形成在内表面上并且邻近第二材料的端部的变薄部分。 可穿戴带还可以包括被配置为将第一材料耦合到第二材料的耦合部件。 第一材料的薄化部分可以折叠到其自身上，并且第二材料的变薄部分可以折叠到其自身上。
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公开(公告)号：US12238469B2
公开(公告)日：2025-02-25
申请号：US18626112
申请日：2024-04-03
Applicant: APPLE INC.
Inventor： Edward Siahaan , Daniel R. Bloom , Jason J. LeBlanc , Phillip Qian
IPC: H04R25/00 , H04R1/10 , H04R5/033 , H04R5/04 , G10K11/178
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US11784673B2
公开(公告)日：2023-10-10
申请号：US17469001
申请日：2021-09-08
Applicant: Apple Inc.
Inventor： Daniel R. Bloom , Chelsea E. Wojeski , Edward Siahaan , Nathan Morris , Ryan S. Haley , Tian Shi Li , Toni Ristoski
IPC: H04B1/3827
CPC classification number: H04B1/3827
Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.
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公开(公告)号：US11518138B2
公开(公告)日：2022-12-06
申请号：US14578319
申请日：2014-12-19
Applicant: Apple Inc.
Inventor： Edward Siahaan , Douglas J. Weber , Hsiang Hung Chen , Naoto Matsuyuki , Yoji Hamada , Teodor Dabov , Whitney D. Mattson , Ying-Liang Su
IPC: B32B5/02 , B32B7/02 , B29C65/02 , B32B5/26 , B32B3/26 , B32B3/04 , B32B7/027 , B29L31/00 , B32B7/023
Abstract: Embodiments disclosed are directed to a woven fabric band that is capable of being secured to another object using threads or the band itself. The woven fabric band may include an inner layer having a first temperature melting point and an outer layer having a second temperature melting point that is higher than the first temperature melting point. When heat having the first temperature is applied to the woven fabric band, the inner layer of the woven fabric band melts while the outer layer remains in its original state. When the inner layer melts, the inner layer conforms to a first shape. As a result of the inner layer conforming to the first shape, the outer layer also conforms to the same shape.
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公开(公告)号：US20210105553A1
公开(公告)日：2021-04-08
申请号：US17104830
申请日：2020-11-25
Applicant: Apple Inc.
Inventor： Phillip Qian , Edward Siahaan , Erik L. Wang , Christopher J. Stringer , Matthew Dean Rohrbach , Daniel Max Strongwater , Jason J. LeBlanc
Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
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Patent Agency Ranking
公开(公告)号：US20200280786A1
公开(公告)日：2020-09-03
申请号：US16878556
申请日：2020-05-19
Applicant: Apple Inc.
Inventor： Jared M. Kole , Daniel R. Bloom , Audrey L. Sheng , Tian Shi Li , Eugene Antony Whang , Edward Siahaan , Phillip Qian , Alex C. Hellwig , Oliver M. Hewitt , Yuta Kuboyama , Christopher S. Erickson , Sneha Kadetotad , Edwin J. Corona Aparicio , Rajesh Anantharaman , Jacob E. Mattingley , Tsu-Hui Lin , Robert D. Zupke , Dustin A. Hatfield , Axit H. Patel
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US10237640B2
公开(公告)日：2019-03-19
申请号：US15431368
申请日：2017-02-13
Applicant: Apple Inc.
Inventor： Edward Siahaan , Kurt R. Stiehl , Victor M. Tiscareno , Wey-Jiun Lin , Cameron P. Frazier , Christopher D. Prest , Jeffrey Y. Hayashida
Abstract: A removable component for use with an earphone is disclosed. As an example, the removable component can be an ear tip. According to one aspect, an improved ear tip can be provided for use with a headphone. The ear tip is suitable for in-ear operation and can have a cosmetic deformable outer member. The deformable outer member can enable the ear tip to readily conform to a user's ear. The ear tip can also include an inner member to structurally support the outer member and to facilitate attachment to a headphone. Methods for forming such ear tips are also disclosed.
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公开(公告)号：US09602911B1
公开(公告)日：2017-03-21
申请号：US14856344
申请日：2015-09-16
Applicant: Apple Inc.
Inventor： Phillip Qian , Edward Siahaan , Scott C. Grinker , Jason J. LeBlanc
Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be positioned within.
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19.发明授权Methods for attaching structures using heat activated thermoset film and induction heating 有权使用热活化热固性薄膜和感应加热连接结构的方法公开(公告)号：US09492967B2
公开(公告)日：2016-11-15
申请号：US14254431
申请日：2014-04-16
Applicant: Apple Inc.
Inventor： John B. Ardisana, II , Eric S. Jol , Edward Siahaan
CPC classification number: B29C65/4835 , B29C65/32 , B29C65/3644 , B29C65/3652 , B29C65/3676 , B29C65/368 , B29C65/5021 , B29C65/5057 , B29C65/78 , B29C66/1122 , B29C66/50 , B29C66/545 , B29C66/61 , B29K2101/10 , B29L2031/36
Abstract: An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.
Abstract translation: 电子设备组件可以具有封装在塑料和/或金属外壳结构内的电子部件。 组件可以包括使用热活化的热固性聚合物膜连接的第一和第二壳体结构。 热活化的热固性聚合物膜可以使用诸如沿着或靠近第一和第二壳体结构之间的接头放置的金属条或金属图案的金属结构来加热。 可以通过使用诸如感应加热器的外部设备加热金属来提高热固性聚合物膜的金属和相关层的温度。 使用电磁感应加热的金属层可以形成在热活化的热固性膜上，或者可以形成在与热活化的热固性聚合物膜相邻的外壳结构中的一个中。
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公开(公告)号：US20160316285A1
公开(公告)日：2016-10-27
申请号：US14695357
申请日：2015-04-24
Applicant: APPLE INC.
Inventor： Phillip Qian , Edward Siahaan , Erik L. Wang , Esge B. Andersen
CPC classification number: H04R1/086
Abstract: An acoustic device such as a microphone or speaker is positioned with and coupled to a housing to connect an acoustic port of the acoustic device with an external opening of the housing. A reservoir is connected to the external opening via a bleed channel. The bleed channel may be less resistive to liquid ingress than the acoustic port. As such, the reservoir and bleed channel may redirect liquid from the external opening away from the acoustic port. In some implementations, the reservoir and/or the bleed channel may be defined by one or more acoustically permeable barriers such as meshes that cover the acoustic port, compressible materials such as foams that form a perimeter around the acoustic port, and/or adhesive layers that couple the acoustic device, the housing, and/or one or more other components.
Abstract translation: 诸如麦克风或扬声器之类的声学装置被定位并连接到壳体，以将声学装置的声学接口与壳体的外部开口相连接。 储液器通过排放通道连接到外部开口。 泄放通道可能比声学端口对液体进入的阻力更小。 因此，储存器和排出通道可以将液体从外部开口转向远离声学端口。 在一些实施方案中，储存器和/或排放通道可以由一个或多个声透过性屏障限定，例如覆盖声学端口的网孔，可压缩材料，例如围绕声学端口形成周边的泡沫，和/或粘合剂层 耦合声学装置，壳体和/或一个或多个其它部件。
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