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    Optical Fiber Illumination by a Set of Light Emitters
    11.
    发明申请
    Optical Fiber Illumination by a Set of Light Emitters 有权

    公开(公告)号：US20230034270A1

    公开(公告)日：2023-02-02

    申请号：US17865169

    申请日：2022-07-14

    Applicant: Apple Inc.

    Inventor： Brian S. Medower ,  Eamon H. O'Connor ,  Keith Lyon ,  Marc A. Drader ,  Salman Karbasi ,  Shifa Xu ,  Yazan Z. Alnahhas

    IPC: H01S5/183 ,  H01S5/42 ,  H01S5/00 ,  F21V8/00

    Abstract: An electronic device includes a substrate, a set of light emitters on the substrate and arranged in a plurality of axisymmetric light emitter groups, a set of lenses including a different lens disposed over each axisymmetric light emitter group of the plurality of axisymmetric light emitter groups, and a set of optical fibers. At least one optical fiber in the set of optical fibers has a proximal end, a distal end, and a bend between the proximal end and the distal end. The proximal end is positioned to receive light, through a respective lens in the set of lenses, from the light emitters of a respective axisymmetric light emitter group in the plurality of axisymmetric light emitter groups.

    Electronic Devices With Optical Fiber Ribbons
    12.
    发明申请
    Electronic Devices With Optical Fiber Ribbons 有权

    公开(公告)号：US20220236507A1

    公开(公告)日：2022-07-28

    申请号：US17528023

    申请日：2021-11-16

    Applicant: Apple Inc.

    Inventor： Prabhakar Gulgunje ,  Brian S. Medower ,  Mahmut C. Orsan ,  Nathan K. Gupta ,  Shifa Xu ,  Shubhaditya Majumdar ,  Wei Lin ,  Yazan Z. Alnahhas

    IPC: G02B6/44 ,  G02B6/42

    Abstract: A light pipe such as a fiber ribbon may be formed from fibers joined by binder such as extruded binder. The fiber ribbon or other light pipe may have bends. A light source may provide light to an input of a fiber ribbon that is guided by the fiber ribbon to a corresponding output. The output may be located in an interior portion of an electronic device or may be positioned so that light from the output exits the electronic device and illuminates external objects. The light source may have light-emitting devices on a substrate. The light-emitting devices may be vertical cavity surface-emitting laser diodes or other lasers and/or may be light-emitting diodes. Light-emitting devices may be arranged in discrete clusters corresponding to the locations of fiber cores in the fiber ribbon.

    Projection of patterned and flood illumination
    14.
    发明申请
    Projection of patterned and flood illumination 有权

    公开(公告)号：US20210364902A1

    公开(公告)日：2021-11-25

    申请号：US17223047

    申请日：2021-04-06

    Applicant: Apple Inc.

    Inventor： Yazan Z. Alnahhas ,  Harish Govindarajan ,  Oyvind Svensen ,  Yuval Tsur ,  Zhengyu Miao

    IPC: G03B21/20 ,  G03B21/16

    Abstract: An optoelectronic apparatus includes a heat sink, which is shaped to define a base, a first platform at a first elevation above the base, and a second platform alongside the first platform at a second elevation above the base, which is different from the first elevation. A first monolithic emitter array is mounted on the first platform and is configured to emit first optical beams. A second monolithic emitter array is mounted on the second platform and is configured to emit second optical beams. An optical element is configured to direct both the first and the second optical beams toward a target region.

    Emitter array with uniform brightness
    15.
    发明申请
    Emitter array with uniform brightness 有权

    公开(公告)号：US20210313764A1

    公开(公告)日：2021-10-07

    申请号：US17221856

    申请日：2021-04-05

    Applicant: Apple Inc.

    Inventor： Yazan Z. Alnahhas ,  Oyvind Svensen ,  Weiping Li ,  Yuval Tsur

    IPC: H01S5/042 ,  H01S5/42 ,  H01S5/183

    Abstract: An optoelectronic device includes a semiconductor substrate and an array of emitters disposed on the substrate, including at least first emitters disposed in a central zone of the array and second emitters disposed in at least one peripheral zone of the array, surrounding the central zone. The array includes at least one cathode and at least one anode disposed on opposing sides of the emitters. The first emitters have a first resistance between the at least one cathode and the at least one anode, and the second emitters have a second resistance, greater than the first resistance, between the at least one cathode and the at least one anode. A drive circuit is coupled to apply a selected voltage between the at least one cathode and the at least one anode so as to cause the emitters to emit optical radiation.

    Electromagnetic shielding of compact electronic modules
    16.
    发明授权
    Electromagnetic shielding of compact electronic modules 有权

    公开(公告)号：US11056441B2

    公开(公告)日：2021-07-06

    申请号：US16703911

    申请日：2019-12-05

    Applicant: Apple Inc.

    Inventor： Colleen F. Mischke ,  Kayo Yanagisawa ,  Yazan Z. Alnahhas

    IPC: H01L23/552 ,  H01L33/48 ,  H01L25/16 ,  H01L33/58

    Abstract: An electronic module includes a circuit substrate including conductive pads interconnected by traces, including a ground pad for connection to an electrical ground. One or more electronic components are mounted on the circuit substrate. A housing including a dielectric material is mounted on the circuit substrate so as to cover the one or more electronic components. A metal lead, which has first and second ends, is embedded in the dielectric material such that the first end contacts the ground pad on the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material. A conductive coating is disposed over the outer surface of the housing in galvanic contact with the exposed second end of the metal lead.

    Circuit substrate with embedded heat sink
    18.
    发明授权
    Circuit substrate with embedded heat sink 有权

    公开(公告)号：US10034375B2

    公开(公告)日：2018-07-24

    申请号：US15145828

    申请日：2016-05-04

    Applicant: APPLE INC.

    Inventor： Dennis R. Pyper ,  Venkataram R. Raju ,  Yazan Z. Alnahhas

    IPC: H05K1/00 ,  H05K1/14 ,  H05K3/36 ,  H05K1/02 ,  H05K1/18

    Abstract: An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.

    Circuit substrate with embedded heat sink
    19.
    发明申请
    Circuit substrate with embedded heat sink 审中-公开
    带嵌入式散热片的电路基板

    公开(公告)号：US20160345423A1

    公开(公告)日：2016-11-24

    申请号：US15145828

    申请日：2016-05-04

    Applicant: APPLE INC.

    Inventor： Dennis R. Pyper ,  Venkataram R. Raju ,  Yazan Z. Alnahhas

    IPC: H05K1/02 ,  H05K3/36 ,  H05K3/30 ,  H05K1/14 ,  H05K1/18

    CPC classification number: H05K1/141 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/144 ,  H05K1/183 ,  H05K3/368 ,  H05K2201/10416

    Abstract: An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.

    Abstract translation: 一种装置包括主基板，装置和散热器。 主基板被构造成用于将装置安装在其上的安装位置并且具有位于安装位置下方的空腔。 该装置安装在安装位置，并且散热器装配到空腔中并且耦合到装置和散热器。 散热器被配置为将热量从设备传导到散热器并且在设备和散热器之间提供电绝缘。

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