公开(公告)号：US07507654B2

公开(公告)日：2009-03-24

申请号：US11521482

申请日：2006-09-15

申请人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

发明人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

IPC分类号： H01L21/44

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00

摘要： Method for mounting an electronic component on a circuit board firstly flip-chip bonding positioning bumps of the electronic component to pads of the circuit board by applying ultrasonic vibrations to the electronic component. Bonding bumps, whose diameters are shorter than those of the positioning bumps and whose projecting lengths are shorter than those of the positioning bumps, of the electronic component are flip-chip bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic element. In this manner, a center of each of the bonding bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction to the ultrasonic vibrations.

摘要翻译： 首先将电子部件安装在电路板上的方法首先通过向电子部件施加超声振动来将电子部件的凸块与电路板的焊盘进行倒装焊接。 通过对电子元件施加超声波振动，电子部件的直径比定位凸块短且其突出长度短于定位凸块的直径的接合凸块被倒装连接到电路板的电极。 以这种方式，每个接合凸块的中心相对于每个电极的宽度方向的中心在与超声振动的方向平行的方向上预先相对移位。

公开(公告)号：US20080265003A1

公开(公告)日：2008-10-30

申请号：US11979914

申请日：2007-11-09

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

IPC分类号： B23K20/10

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

公开(公告)号：US07436062B2

公开(公告)日：2008-10-14

申请号：US10223454

申请日：2002-08-20

申请人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

发明人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

IPC分类号： H01L23/48 ,  H01L23/04

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L24/13 ,  H01L24/14 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05664

摘要： An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 μm is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

摘要翻译： 一种用于改善超声波接合并安装在电路板上的半导体芯片元件100的底部填充填充的装置和方法。 半导体芯片元件100包括硅芯片101和形成在芯片101的底表面101a上的一组柱形突起117。 信号柱凸起113由金制成，而电源凸块114，接地柱形凸块115和虚拟凸块凸块116都由金 - 钯合金制成，其比信号柱凸块113更硬，因此在超声波期间不容易变形 治疗。 因此，在安装半导体芯片元件100的状态下，在芯片100的底面101a与半导体芯片元件100的电路基板120的上表面之间保持约30μm的间隙 安装。

公开(公告)号：US07355285B2

公开(公告)日：2008-04-08

申请号：US11041292

申请日：2005-01-25

申请人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

发明人： Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Takayoshi Matsumura

IPC分类号： H01L23/48

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2224/13099 ,  H01L2924/00

摘要： The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

摘要翻译： 将电子部件安装在电路板上的结构能够将具有非常短的分离的凸块的电子部件可靠地倒置接合到电路板而没有位移。 将电子部件安装在电路板上的结构的特征在于，通过对电子部件施加超声波振动，电子部件的凸起分别与电路基板的电极倒装接合， 先前相对于每个电极的宽度方向上的中心在与超声波振动的方向平行的方向上相对移位。

公开(公告)号：US07350685B2

公开(公告)日：2008-04-01

申请号：US11041301

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B23K1/06

CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75343 ,  H01L2224/75755 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

摘要翻译： 该方法能够通过施加超声波振动将电子部件牢固地安装在电路板上。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 当将超声波振动施加到电子部件时，电路板的与发送到电路板的振动的振幅的峰值对应的部分被按压。

公开(公告)号：US20070264752A1

公开(公告)日：2007-11-15

申请号：US11634119

申请日：2006-12-06

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Kimio Nakamura ,  Kuniko Ishikawa ,  Yukio Ozaki

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.

摘要翻译： 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。

公开(公告)号：US20060097028A1

公开(公告)日：2006-05-11

申请号：US11062789

申请日：2005-02-23

申请人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

发明人： Norio Kainuma ,  Hidehiko Kira ,  Kenji Kobae ,  Takayoshi Matsumura

IPC分类号： B23K1/06

CPC分类号： B23K20/10 ,  B23K2101/40 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

摘要翻译： 一种超声波安装方法可以通过使用高频超声波提高安装效率，还可以安装大型半导体芯片。 该方法使用包括传播超声波振动器的超声波振动的喇叭15的超声波安装装置将半导体芯片52超声波接合到基板50，喇叭15由具有比金属更高的振动传播速度的陶瓷制成。 该方法包括以下步骤：将基板50设置在台13上，将半导体芯片52配置在基板50上，将半导体芯片52与设置在喇叭15上的凸部15a接触并施加超声波振动， 半导体芯片52到基板50。

公开(公告)号：US20060091185A1

公开(公告)日：2006-05-04

申请号：US11041301

申请日：2005-01-25

申请人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

发明人： Takayoshi Matsumura ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma

IPC分类号： B23K1/06

CPC分类号： H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75343 ,  H01L2224/75755 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

摘要翻译： 该方法能够通过施加超声波振动将电子部件牢固地安装在电路板上。 该方法包括对电子部件施加超声波振动以将电子部件倒装芯片连接到具有电极的电路板的步骤。 当将超声波振动施加到电子部件时，电路板的与发送到电路板的振动的振幅的峰值对应的部分被按压。

公开(公告)号：US20050196704A1

公开(公告)日：2005-09-08

申请号：US11117309

申请日：2005-04-29

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G03F7/16 ,  B05C5/02 ,  B05C11/10 ,  B05D3/00 ,  B05D7/00 ,  H01L21/56 ,  H01L21/60 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  G03C5/00

CPC分类号： B05C11/1034 ,  B05C5/0212 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/05599

摘要： A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

公开(公告)号：US06787925B2

公开(公告)日：2004-09-07

申请号：US09805559

申请日：2001-03-14

申请人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.

摘要翻译： 提供了一种将具有凸块的半导体器件安装在具有焊盘的板上，使得每个凸起接合到相应的一个焊盘的方法。 在半导体器件和电路板之间提供通过加热硬化的粘合剂。 该方法包括以下步骤：将半导体器件的凸起按压在板的焊盘上，并且加热其中每个凸块和相应的一个焊盘彼此接触的部分。 在上述步骤中供应热量的粘合剂的温度达到粘合剂硬化的温度之前，焊盘的凸块的压力达到预定值。