公开(公告)号：US06458237B1

公开(公告)日：2002-10-01

申请号：US09045115

申请日：1998-03-20

申请人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： B32B700

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.

摘要翻译： 提供了一种将具有凸块的半导体器件安装在具有焊盘的板上，使得每个凸起接合到相应的一个焊盘的方法。 在半导体器件和电路板之间提供通过加热硬化的粘合剂。 该方法包括以下步骤：将半导体器件的凸起按压在板的焊盘上，并且加热其中每个凸块和相应的一个焊盘彼此接触的部分。 在上述步骤中供应热量的粘合剂的温度达到粘合剂硬化的温度之前，焊盘的凸块的压力达到预定值。

公开(公告)号：US06787925B2

公开(公告)日：2004-09-07

申请号：US09805559

申请日：2001-03-14

申请人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.

摘要翻译： 提供了一种将具有凸块的半导体器件安装在具有焊盘的板上，使得每个凸起接合到相应的一个焊盘的方法。 在半导体器件和电路板之间提供通过加热硬化的粘合剂。 该方法包括以下步骤：将半导体器件的凸起按压在板的焊盘上，并且加热其中每个凸块和相应的一个焊盘彼此接触的部分。 在上述步骤中供应热量的粘合剂的温度达到粘合剂硬化的温度之前，焊盘的凸块的压力达到预定值。

公开(公告)号：US06240634B1

公开(公告)日：2001-06-05

申请号：US09460727

申请日：1999-12-14

申请人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H05K330

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53178 ,  H01L2924/00

摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

摘要翻译： 在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片暂时附接到板上。 通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。 微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上 单芯片的裸芯片，以生产多芯片封装模块。

公开(公告)号：US6122823A

公开(公告)日：2000-09-26

申请号：US401985

申请日：1999-09-23

申请人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L25/04 ,  H01L25/18 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53178

摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

摘要翻译： 在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片临时附接到板上。 通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。 微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上 单芯片的裸芯片，以生产多芯片封装模块。

公开(公告)号：US6006426A

公开(公告)日：1999-12-28

申请号：US26490

申请日：1998-02-19

申请人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L25/04 ,  H01L25/18 ,  H05K3/30

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53178

摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

摘要翻译： 在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片临时附接到板上。 通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。 微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上 单芯片的裸芯片，以生产多芯片封装模块。

公开(公告)号：US20050196703A1

公开(公告)日：2005-09-08

申请号：US11117308

申请日：2005-04-29

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G03F7/16 ,  B05C5/02 ,  B05C11/10 ,  B05D3/00 ,  B05D7/00 ,  H01L21/56 ,  H01L21/60 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  G03C1/725

CPC分类号： B05C11/1034 ,  B05C5/0212 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/05599

摘要： A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

摘要翻译： 将树脂涂布到布线板的预定区域的树脂涂布方法包括以下步骤：对从树脂施加装置挤出的树脂的外观进行成像; 并且基于在成像步骤中获得的树脂的外观自动调节从树脂施加装置挤出的树脂的量。

公开(公告)号：US06885522B1

公开(公告)日：2005-04-26

申请号：US09548313

申请日：2000-04-12

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US06716665B2

公开(公告)日：2004-04-06

申请号：US09753570

申请日：2001-01-04

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： H01L2144

CPC分类号： H01L21/6836 ,  H01L21/56 ,  H01L21/563 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512

摘要： A wafer receiving conductive input/output bumps on the upward front side is placed on a platen. An underfill material sheet, adhered to the surface of the thin film tape, is superposed on the front side of the wafer. The underfill material sheet is forced to soften. When the underfill material sheet is urged against the wafer, the input/output bumps is allowed to penetrate through the underfill material sheet. After the underfill material is hardened, the thin film tape is peeled off from the hardened underfill material sheet. The underfill material can thus be supplied commonly to a large number of individual semiconductor chips included in the wafer. As compared with the case where the underfill material is supplied separately to the individual semiconductor chips, the working time can greatly be shortened.

摘要翻译： 将在前侧的导电输入/输出凸块接收的晶片放置在压板上。 附着在薄膜带表面上的底部填充材料片重叠在晶片的前侧。 底部填充材料片被强制软化。 当将底部填充材料片压向晶片时，允许输入/输出凸块穿过底部填充材料片。 在底部填充材料硬化之后，薄膜带从硬化的底部填充材料片剥离。 因此，底部填充材料可以共同地供应到包括在晶片中的大量单独的半导体芯片。 与将底部填充材料单独供给到各个半导体芯片的情况相比，可以大大缩短工作时间。

公开(公告)号：US07394163B2

公开(公告)日：2008-07-01

申请号：US10187843

申请日：2002-07-03

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/563 ,  H01L21/67092 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83951 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.

摘要翻译： 通过用作底层填充剂的粘合剂填充芯片和基板之间的间隙来安装半导体芯片的方法，其中安装IC芯片。 底部填充物的圆角被制成具有优选的形状。 为了实现这一点，将具有凸块的头IC芯片放置在被底部填充胶粘剂覆盖的悬挂上，并设置有垫。 接合工具按压头IC芯片并对头IC芯片施加超声波振荡，使得凸块适当地粘合到焊盘。 当头部IC芯片被按压并进行超声波振荡时，发射紫外线108以使在头IC芯片11和悬架12之间展开的粘合剂151的周边部分151a硬化。

公开(公告)号：US07347347B2

公开(公告)日：2008-03-25

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。