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公开(公告)号:US20070098942A1
公开(公告)日:2007-05-03
申请号:US11554237
申请日:2006-10-30
Applicant: Andre Cote , Detlef Duschek
Inventor: Andre Cote , Detlef Duschek
CPC classification number: G06K19/07749 , G06K19/07718 , G06K19/0775 , G08B13/244 , H01L21/56 , H01L21/67132 , H01L24/86 , H01L24/96 , H01L24/97 , H01L2224/16 , H01L2224/7965 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/3025 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T428/14 , H01L2924/00
Abstract: A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.
Abstract translation: 将在机器方向上连续移动的聚酯片材加热至刚好低于其玻璃热温度的温度,以使该聚合物具有延展性。 电路(例如,RFID芯片,EAS芯片,应答器,IC)被放置在聚合物片材上并且嵌入到多片材中,优选地具有耐热柔软(例如橡胶)辊,其将电路压入聚合物而不破坏 电路。 可以将导电条或线施加到聚合物片上或其上,以与电路的连接点(例如,导电凸块)对齐,以与电路导电连通。 优选地,导电条或线被切割以形成在导线的切割部分之间不导电的间隙,以避免电路的短路和/或允许导电条或线作为电路的天线发挥作用,并因此形成芯片 表带或标签。 因此,聚酰胺片为电路和电线提供了保护性的子宫或屏蔽。
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公开(公告)号:US20120286938A1
公开(公告)日:2012-11-15
申请号:US13468759
申请日:2012-05-10
Applicant: Andre Cote , Edmund S. Nabrotzky
Inventor: Andre Cote , Edmund S. Nabrotzky
IPC: G06K19/073 , G06K7/01
CPC classification number: G06K19/07707 , G06K19/0702 , G06Q10/08
Abstract: RFID driven display system components such as wireless displays (visual RFID tags) and multi-antenna wireless RFID readers that monitor/control the RFID driven displays in order to provide visual real-time information to display viewers and/or provide useful information to a central processing station that monitors the status of and/or updates the RFID driven displays, networks including one or more of the components, and methods for using the RFID driven display system components to monitor assets in applications such as inventory control and manufacturing.
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公开(公告)号:USD644590S1
公开(公告)日:2011-09-06
申请号:US29336086
申请日:2009-04-28
Applicant: Andre Cote , Steve Tetreault , Luc Lapointe , Alexandre Curthelet , Jacques Mayrand , Alex Miklosi
Designer: Andre Cote , Steve Tetreault , Luc Lapointe , Alexandre Curthelet , Jacques Mayrand , Alex Miklosi
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公开(公告)号:USD636323S1
公开(公告)日:2011-04-19
申请号:US29352527
申请日:2009-12-22
Applicant: Andre Cote
Designer: Andre Cote
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公开(公告)号:US20100218899A1
公开(公告)日:2010-09-02
申请号:US12759400
申请日:2010-04-13
Applicant: Thomas J. Clare , Andre Cote , Eric Eckstein
Inventor: Thomas J. Clare , Andre Cote , Eric Eckstein
CPC classification number: H01L24/81 , B23K20/004 , B23K2101/32 , B23K2101/40 , G06K19/07718 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L21/67132 , H01L23/49855 , H01L24/75 , H01L24/83 , H01L2223/6677 , H01L2224/05573 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/78 , H01L2224/81121 , H01L2224/81801 , H01L2224/83851 , H01L2224/85 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01054 , H01L2924/01057 , H01L2924/01061 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19043 , Y10T156/12 , H01L2924/00 , H01L2224/29075 , H01L2924/00014
Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.
Abstract translation: 描述了用于接合独特地适用于大容量标签制造的集成电路的方法和装置,其中在芯片附着区域之前的基板的导电材料在将IC芯片或应答器放置在切割和粘合的导电材料之前被切割 。 该装置执行将第一芯片放置在具有导电层的基板上的方法,测量基板上的第一芯片的位置,在预期的随后放置的芯片的位置处切割导电层,以基于测量的 第一芯片的位置,并将随后放置的芯片放置在切口上的基板上。
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公开(公告)号:US07709294B2
公开(公告)日:2010-05-04
申请号:US11166534
申请日:2005-06-24
Applicant: Thomas J. Clare , Andre Cote , Eric Eckstein
Inventor: Thomas J. Clare , Andre Cote , Eric Eckstein
CPC classification number: H01L24/81 , B23K20/004 , B23K2101/32 , B23K2101/40 , G06K19/07718 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L21/67132 , H01L23/49855 , H01L24/75 , H01L24/83 , H01L2223/6677 , H01L2224/05573 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/78 , H01L2224/81121 , H01L2224/81801 , H01L2224/83851 , H01L2224/85 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01054 , H01L2924/01057 , H01L2924/01061 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19043 , Y10T156/12 , H01L2924/00 , H01L2224/29075 , H01L2924/00014
Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.
Abstract translation: 描述了用于接合独特地适用于大容量标签制造的集成电路的方法和装置,其中在芯片附着区域之前的基板的导电材料在将IC芯片或应答器放置在切割和粘合的导电材料之前被切割 。 该装置执行将第一芯片放置在具有导电层的基板上的方法,测量基板上的第一芯片的位置,在预期的随后放置的芯片的位置处切割导电层,以基于测量的 第一芯片的位置,并将随后放置的芯片放置在切口上的基板上。
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公开(公告)号:US07564360B2
公开(公告)日:2009-07-21
申请号:US11679250
申请日:2007-02-27
Applicant: Andre Cote , Farrokh Abadi
Inventor: Andre Cote , Farrokh Abadi
IPC: G08B13/14
CPC classification number: G01V15/00 , E05B73/0017 , G08B13/2434
Abstract: A releasable security tag for attachment to an article of merchandise includes: a locking mechanism with a release for attaching the tag to the article of merchandise; an EAS resonant circuit or an RFID circuit for responding to a first RF signal at a predetermined frequency corresponding to the resonant circuit or to the RFID circuit; an ambient RF energy harvesting circuit; a release signal detection circuit coupled to and powered by the ambient RF energy harvesting circuit and an electro-mechanical actuator electrically coupled to the release signal detection circuit. The electro-mechanical actuator releases the locking mechanism whenever the release signal detection circuit receives a release signal.
Abstract translation: 用于附接到商品的可释放的安全标签包括:具有用于将标签附接到商品的释放的锁定机构; 用于响应于对应于谐振电路或RFID电路的预定频率的第一RF信号的EAS谐振电路或RFID电路; 环境RF能量收集电路; 耦合到环境RF能量收集电路并由其供电的释放信号检测电路和电耦合到释放信号检测电路的机电致动器。 每当释放信号检测电路接收释放信号时,机电执行器释放锁定机构。
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公开(公告)号:US20070205902A1
公开(公告)日:2007-09-06
申请号:US11679250
申请日:2007-02-27
Applicant: Andre Cote , Farrokh Abadi
Inventor: Andre Cote , Farrokh Abadi
IPC: G08B13/14
CPC classification number: G01V15/00 , E05B73/0017 , G08B13/2434
Abstract: A releasable security tag for attachment to an article of merchandise is disclosed. Features of the security tag include: a locking mechanism with a release for attaching the tag to the article of merchandise; an EAS resonant circuit or an RFID circuit for responding to a first RF signal at a predetermined frequency corresponding to the resonant circuit or to the RFID circuit; an ambient RF energy harvesting circuit; a release signal detection circuit coupled to and powered by the ambient RF energy harvesting circuit and an electro-mechanical actuator electrically coupled to the release signal detection circuit. The electro-mechanical actuator releases the locking mechanism whenever the release signal detection circuit receives a release signal.
Abstract translation: 公开了用于附接到商品的可释放的安全标签。 安全标签的特征包括:锁定机构,具有用于将标签附接到商品的释放件; 用于响应于对应于谐振电路或RFID电路的预定频率的第一RF信号的EAS谐振电路或RFID电路; 环境RF能量收集电路; 耦合到环境RF能量收集电路并由其供电的释放信号检测电路和电耦合到释放信号检测电路的机电致动器。 每当释放信号检测电路接收释放信号时,机电执行器释放锁定机构。
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公开(公告)号:US20070146143A1
公开(公告)日:2007-06-28
申请号:US11614475
申请日:2006-12-21
Applicant: Andre Cote , Luis Soler Bonnin
Inventor: Andre Cote , Luis Soler Bonnin
IPC: G08B13/14
CPC classification number: G06K19/07749 , G08B13/2417 , G08B13/2445
Abstract: A communication-ready corrugated article and method for making the corrugated article is disclosed. The corrugated article includes a linersheet (e.g., craft paper), an undulating medium (e.g., craft paper), a conductive strip (e.g., metal, aluminum, wire, coil), and a security chip (e.g., RFID chip, EAS chip, integrated circuit, chip strap, RFID tag, EAS tag). The linersheet has a first side and a second side. The undulating medium is coupled to the first side of the linersheet, the conductive strip is positioned on the first side of the linersheet between the linersheet and the undulating medium. The security chip is attached to the second side of the linersheet opposite the conductive strip and is coupled to the conductive strip through the linersheet.
Abstract translation: 公开了一种用于制造瓦楞纸制品的通信型波纹制品和方法。 波纹制品包括衬垫(例如工艺纸),波状介质(例如工艺纸),导电带(例如金属,铝,线,线圈)和安全芯片(例如,RFID芯片,EAS芯片 ,集成电路,芯片带,RFID标签,EAS标签)。 衬垫具有第一侧和第二侧。 波纹介质耦合到衬垫的第一侧,导电带位于衬垫和波纹介质之间的衬垫的第一侧上。 安全芯片附接到与导电条相对的衬垫的第二侧,并通过衬垫与导电带相连。
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公开(公告)号:US20070114659A1
公开(公告)日:2007-05-24
申请号:US11560692
申请日:2006-11-16
Applicant: Andre Cote , Detlef Dusckek
Inventor: Andre Cote , Detlef Dusckek
IPC: H01L23/34
CPC classification number: H01L21/67144 , H01L24/95 , H01L2224/75822 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
Abstract: A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.
Abstract translation: 旋转芯片连接工艺和制造方法在旋转工艺中从晶片获取芯片(例如,集成电路(IC))。 具有定位单元的芯片晶片被放置在链轮的顶部上,该轮链轮从晶片直接拾取IC并将它们以半连续的逐步运动移动到将接受IC的网。 链轮包括优选地与典型的拾放机器人系统中使用的相同类型的切屑,其中真空头适合于根据需要刺穿晶片平膜(如果需要),抓斗和IC以及放置和IC。 该定位系统将IC的放置位置保持在纸幅上的准确位置,可以使多个链轮轮放置单元在适当位置上连续移动。
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