-
公开(公告)号：US20100218899A1
公开(公告)日：2010-09-02
申请号：US12759400
申请日：2010-04-13
Applicant: Thomas J. Clare , Andre Cote , Eric Eckstein
Inventor： Thomas J. Clare , Andre Cote , Eric Eckstein
CPC classification number: H01L24/81 , B23K20/004 , B23K2101/32 , B23K2101/40 , G06K19/07718 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L21/67132 , H01L23/49855 , H01L24/75 , H01L24/83 , H01L2223/6677 , H01L2224/05573 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/78 , H01L2224/81121 , H01L2224/81801 , H01L2224/83851 , H01L2224/85 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01054 , H01L2924/01057 , H01L2924/01061 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19043 , Y10T156/12 , H01L2924/00 , H01L2224/29075 , H01L2924/00014
Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.
Abstract translation: 描述了用于接合独特地适用于大容量标签制造的集成电路的方法和装置，其中在芯片附着区域之前的基板的导电材料在将IC芯片或应答器放置在切割和粘合的导电材料之前被切割 。 该装置执行将第一芯片放置在具有导电层的基板上的方法，测量基板上的第一芯片的位置，在预期的随后放置的芯片的位置处切割导电层，以基于测量的 第一芯片的位置，并将随后放置的芯片放置在切口上的基板上。
-
公开(公告)号：US07709294B2
公开(公告)日：2010-05-04
申请号：US11166534
申请日：2005-06-24
Applicant: Thomas J. Clare , Andre Cote , Eric Eckstein
Inventor： Thomas J. Clare , Andre Cote , Eric Eckstein
CPC classification number: H01L24/81 , B23K20/004 , B23K2101/32 , B23K2101/40 , G06K19/07718 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L21/67132 , H01L23/49855 , H01L24/75 , H01L24/83 , H01L2223/6677 , H01L2224/05573 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/78 , H01L2224/81121 , H01L2224/81801 , H01L2224/83851 , H01L2224/85 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01054 , H01L2924/01057 , H01L2924/01061 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19043 , Y10T156/12 , H01L2924/00 , H01L2224/29075 , H01L2924/00014
Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.
Abstract translation: 描述了用于接合独特地适用于大容量标签制造的集成电路的方法和装置，其中在芯片附着区域之前的基板的导电材料在将IC芯片或应答器放置在切割和粘合的导电材料之前被切割 。 该装置执行将第一芯片放置在具有导电层的基板上的方法，测量基板上的第一芯片的位置，在预期的随后放置的芯片的位置处切割导电层，以基于测量的 第一芯片的位置，并将随后放置的芯片放置在切口上的基板上。
-
3.发明授权Security tag system for fabricating a tag including an integrated surface processing system 有权用于制造包括综合表面处理系统的标签的安全标签系统公开(公告)号：US07384496B2
公开(公告)日：2008-06-10
申请号：US10996786
申请日：2004-11-24
Applicant: Andre Cote , Eric Eckstein , Thomas J. Clare
Inventor： Andre Cote , Eric Eckstein , Thomas J. Clare
CPC classification number: B32B37/025 , B32B2310/0843 , B32B2519/02 , G08B13/2414 , G08B13/244 , H05K1/162 , H05K3/046 , H05K2201/0355 , H05K2201/09672 , H05K2203/0522 , H05K2203/0528 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T156/10 , Y10T156/1041 , Y10T156/1052 , Y10T156/1062 , Y10T156/1077 , Y10T156/108 , Y10T156/1082 , Y10T156/1089 , Y10T156/1097
Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.
Abstract translation: 制造标签的方法包括以下步骤：将第一图案化的粘合剂施加到基底的表面，并将第一导电箔施加到第一图案化的粘合剂上。 去除不粘附到第一图案化的粘合剂的第一导电箔的一部分，并且将第二图案化的粘合剂施加到标签的表面区域的一部分。 将预制的第二导电箔施加到第二图案化的粘合剂以将第二导电箔粘附到基板的表面，并且第一和第二导电箔的部分彼此电耦合以形成标签电路。 第二图案化粘合剂可以设置在第一和第二导电箔之间。
-
4.发明授权公开(公告)号：US07961102B2
公开(公告)日：2011-06-14
申请号：US12202762
申请日：2008-09-02
Applicant: Thomas J. Clare , Andre Cote
Inventor： Thomas J. Clare , Andre Cote
CPC classification number: G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07779 , G06K19/07783 , G06K19/07786 , H01L2224/16225 , H01L2224/16227
Abstract: A method for installing an RFID tag on shipping articles includes applying a strip of conductive material to the surface of the article and providing an RFID chip having a body, a first bottom conductive point, a second bottom conductive point and a nonconductive fin between the first bottom conductive point and the second bottom conductive point. The fin is received in the shipping article. The RFID chip is attached to the shipping article by inserting the chip onto the strip of conductive material on the shipping article such that the fin severs the strip into a first strip and a second strip. The first bottom conductive point is electrically attached to the first strip and the second bottom conductive point is electrically attached to the second strip.
Abstract translation: 一种用于在运送物品上安装RFID标签的方法包括将导电材料条施加到制品的表面，并提供具有主体，第一底部导电点，第二底部导电点和非导电鳍片的RFID芯片，其在第一 底部导电点和第二底部导电点。 散货在货运文章中收到。 将RFID芯片通过将芯片插入到运输制品上的导电材料条上而连接到运输制品，使得翅片将条切割成第一条带和第二条带。 第一底部导电点电连接到第一条带，并且第二底部导电点电连接到第二条带。
-
公开(公告)号：US20090015412A1
公开(公告)日：2009-01-15
申请号：US12202762
申请日：2008-09-02
Applicant: Thomas J. Clare , Andre Cote
Inventor： Thomas J. Clare , Andre Cote
CPC classification number: G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07779 , G06K19/07783 , G06K19/07786 , H01L2224/16225 , H01L2224/16227
Abstract: A method for installing an RFID tag on shipping articles includes applying a strip of conductive material to the surface of the article and providing an RFID chip having a body, a first bottom conductive point, a second bottom conductive point and a nonconductive fin between the first bottom conductive point and the second bottom conductive point. The fin is received in the shipping article. The RFID chip is attached to the shipping article by inserting the chip onto the strip of conductive material on the shipping article such that the fin severs the strip into a first strip and a second strip. The first bottom conductive point is electrically attached to the first strip and the second bottom conductive point is electrically attached to the second strip.
Abstract translation: 一种用于在运送物品上安装RFID标签的方法包括将导电材料条施加到制品的表面，并提供具有主体，第一底部导电点，第二底部导电点和非导电鳍片的RFID芯片，其在第一 底部导电点和第二底部导电点。 散货在货运文章中收到。 将RFID芯片通过将芯片插入到运输制品上的导电材料条上而连接到运输制品，使得翅片将条切割成第一条带和第二条带。 第一底部导电点电连接到第一条带，并且第二底部导电点电连接到第二条带。
-
Patent Agency Ranking
6.发明授权公开(公告)号：US07436305B2
公开(公告)日：2008-10-14
申请号：US11457890
申请日：2006-07-17
Applicant: Thomas J. Clare , Andre Cote
Inventor： Thomas J. Clare , Andre Cote
CPC classification number: G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07779 , G06K19/07783 , G06K19/07786 , H01L2224/16225 , H01L2224/16227
Abstract: A method for installing an RFID tag on shipping articles includes applying a strip of conductive material to the surface of the article and providing an RFID chip having a body, a first bottom conductive point, a second bottom conductive point and a nonconductive fin between the first bottom conductive point and the second bottom conductive point. The fin is received in the shipping article. The RFID chip is attached to the shipping article by inserting the chip onto the strip of conductive material on the shipping article such that the fin severs the strip into a first strip and a second strip. The first bottom conductive point is electrically attached to the first strip and the second bottom conductive point is electrically attached to the second strip.
Abstract translation: 一种用于在运送物品上安装RFID标签的方法包括将导电材料条施加到制品的表面，并提供具有主体，第一底部导电点，第二底部导电点和非导电鳍片的RFID芯片，其在第一 底部导电点和第二底部导电点。 散货在货运文章中收到。 将RFID芯片通过将芯片插入到运输制品上的导电材料条上而连接到运输制品，使得翅片将条切割成第一条带和第二条带。 第一底部导电点电连接到第一条带，并且第二底部导电点电连接到第二条带。
-
7.发明授权Identification marking and method for applying the identification marking to an item 有权识别标识和将识别标记应用于物品的方法公开(公告)号：US07138919B2
公开(公告)日：2006-11-21
申请号：US10996939
申请日：2004-11-24
Applicant: Thomas J. Clare , Andre Cote
Inventor： Thomas J. Clare , Andre Cote
IPC: G08B13/14
CPC classification number: G06Q30/0283 , Y10T29/49004 , Y10T29/49117 , Y10T29/49133 , Y10T156/10
Abstract: A method for processing a surface of an item and providing an association using a surface processing system includes receiving an item having a first identification marking on a surface of the item to provide a received item for providing a first identification signal in response to a first interrogation signal and applying a second identification marking to the surface of the item for providing a second identification signal in response to a second interrogation signal. At least one of the first and second interrogation signals is applied to the item to provide at least one of the first and second identification signals. At least one of the first and second identification signals is received in response to the at least one of the first and second interrogation signals. An association is made is determined in response to the first receiving.
Abstract translation: 一种用于处理物品的表面并使用表面处理系统提供关联的方法包括在物品的表面上接收具有第一标识标记的物品，以提供响应于第一询问提供第一识别信号的接收物品 信号并将第二识别标记应用于物品的表面，以响应于第二询问信号提供第二识别信号。 第一和第二询问信号中的至少一个被施加到该项目以提供第一和第二识别信号中的至少一个。 响应于第一和第二询问信号中的至少一个接收第一和第二识别信号中的至少一个。 响应于首次接收确定关联。
-
8.发明申请Security tag and system for fabricating a tag including an integrated surface processing system 有权用于制造包括集成表面处理系统的标签的安全标签和系统公开(公告)号：US20060175003A1
公开(公告)日：2006-08-10
申请号：US11399551
申请日：2006-04-06
Applicant: Eric Eckstein , Andre Cote
Inventor： Eric Eckstein , Andre Cote
CPC classification number: B32B37/025 , B32B2310/0843 , B32B2519/02 , G08B13/2414 , G08B13/244 , H05K1/162 , H05K3/046 , H05K2201/0355 , H05K2201/09672 , H05K2203/0522 , H05K2203/0528 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T156/10 , Y10T156/1041 , Y10T156/1052 , Y10T156/1062 , Y10T156/1077 , Y10T156/108 , Y10T156/1082 , Y10T156/1089 , Y10T156/1097
Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.
Abstract translation: 制造标签的方法包括以下步骤：将第一图案化的粘合剂施加到基底的表面，并将第一导电箔施加到第一图案化的粘合剂上。 去除不粘附到第一图案化的粘合剂的第一导电箔的一部分，并且将第二图案化的粘合剂施加到标签的表面区域的一部分。 将预制的第二导电箔施加到第二图案化的粘合剂以将第二导电箔粘附到基板的表面，并且第一和第二导电箔的部分彼此电耦合以形成标签电路。 第二图案化粘合剂可以设置在第一和第二导电箔之间。
-
9.发明申请Security tag system for fabricating a tag including an integrated surface processing system 有权用于制造包括综合表面处理系统的标签的安全标签系统公开(公告)号：US20050183817A1
公开(公告)日：2005-08-25
申请号：US10996786
申请日：2004-11-24
Applicant: Eric Eckstein , Andre Cote
Inventor： Eric Eckstein , Andre Cote
CPC classification number: B32B37/025 , B32B2310/0843 , B32B2519/02 , G08B13/2414 , G08B13/244 , H05K1/162 , H05K3/046 , H05K2201/0355 , H05K2201/09672 , H05K2203/0522 , H05K2203/0528 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T156/10 , Y10T156/1041 , Y10T156/1052 , Y10T156/1062 , Y10T156/1077 , Y10T156/108 , Y10T156/1082 , Y10T156/1089 , Y10T156/1097
Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.
Abstract translation: 制造标签的方法包括以下步骤：将第一图案化的粘合剂施加到基底的表面，并将第一导电箔施加到第一图案化的粘合剂上。 去除不粘附到第一图案化的粘合剂的第一导电箔的一部分，并且将第二图案化的粘合剂施加到标签的表面区域的一部分。 将预制的第二导电箔施加到第二图案化的粘合剂以将第二导电箔粘附到基板的表面，并且第一和第二导电箔的部分彼此电耦合以形成标签电路。 第二图案化粘合剂可以设置在第一和第二导电箔之间。
-
10.发明申请PROCESS FOR FORMING AT LEAST A PORTION OF A PACKAGE OR AN ENVELOPE BEARING A PRINTED INDICIA 有权至少形成一个包装件的部件或一个印刷印刷品的包装件公开(公告)号：US20070113966A1
公开(公告)日：2007-05-24
申请号：US11532715
申请日：2006-09-18
Applicant: Eric Eckstein , Andre Cote
Inventor： Eric Eckstein , Andre Cote
CPC classification number: B32B37/025 , B32B2310/0843 , B32B2519/02 , G08B13/2414 , G08B13/244 , H05K1/162 , H05K3/046 , H05K2201/0355 , H05K2201/09672 , H05K2203/0522 , H05K2203/0528 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T156/10 , Y10T156/1041 , Y10T156/1052 , Y10T156/1062 , Y10T156/1077 , Y10T156/108 , Y10T156/1082 , Y10T156/1089 , Y10T156/1097
Abstract: A process for forming a portion of a package or envelope bearing printed indicia, a label bearing printed indicia or a sheet bearing printed indicia includes providing a substrate which constitutes a portion of the package, label or sheet to a printing apparatus, and utilizing the printing apparatus or an adjunct to the printing apparatus to form at least one electrically conductive component of an EAS and/or RFID tag on the substrate substantially contemporaneously with the printing of the indicia on the substrate. The forming of the electrically conductive component on the substrate is accomplished slightly prior to the printing of the indicia on the substrate, slightly after the printing of the indicia on the substrate and at the same time as the printing of the indicia on the substrate.
Abstract translation: 用于形成承载印刷标记的包装或信封的一部分的方法，带有印刷标签的印刷标签或承载印刷标记的片材的方法包括将构成包装，标签或片材的一部分的基材提供到印刷装置，并且利用印刷 装置或辅助装置，以基本上同时在基板上印刷标记而在基板上形成EAS和/或RFID标签的至少一个导电部件。 导电组件在衬底上的形成在印刷衬底上的标记之前略微地完成，稍后在衬底上印刷标记之后，并且与衬底上的标记的印刷同时进行。
-
-
-
-
-
-
-
-
-
Search Results
95
records
(took 0.024 seconds)
