公开(公告)号：US10565701B2

公开(公告)日：2020-02-18

申请号：US14942777

申请日：2015-11-16

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Robert D. Tolles ,  Boguslaw A. Swedek ,  Abraham Ravid

IPC: B24B37/013 ,  G06T7/00 ,  G06F3/0486 ,  G06T7/40 ,  G06T5/00 ,  G06T5/50 ,  H04N9/04 ,  G06F3/0484

Abstract: A polishing system includes a polishing station including a platen to support a polishing pad, a support to hold a substrate, an in-line metrology station to measure the substrate before or after polishing of a surface of the substrate in the polishing station, and a controller. The in-line metrology station includes a color line-scan camera, a white light source, a frame supporting the light source and the camera, and a motor to cause relative motion between the camera and the support along a second axis perpendicular to the first axis to cause the light source and the camera to scan across the substrate. The controller is configured to receive a color data from the camera, to generate a 2-dimensional color image from the color data, and to control polishing at the polishing station based on the color image.

公开(公告)号：US20190295239A1

公开(公告)日：2019-09-26

申请号：US16435291

申请日：2019-06-07

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu

IPC: G06T7/00 ,  G06T7/90 ,  H01L21/67 ,  B24B37/013

Abstract: A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.

公开(公告)号：US10103073B2

公开(公告)日：2018-10-16

申请号：US15694632

申请日：2017-09-01

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/00 ,  H01L21/302 ,  H01L21/66 ,  H01L21/321 ,  B24B37/013 ,  B24B37/04

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US20180113440A1

公开(公告)日：2018-04-26

申请号：US15849562

申请日：2017-12-20

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Harry Q. Lee ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek

IPC: G05B19/418 ,  B24B49/12 ,  B24B37/013 ,  B24B37/04 ,  B24B37/20

CPC classification number: G05B19/418 ,  B24B37/013 ,  B24B37/042 ,  B24B37/205 ,  B24B49/12 ,  G05B2219/45232

Abstract: A method to assist in identifying a spectral feature and a characteristic of the selected spectral feature to monitor during polishing includes polishing a test substrate and measuring a sequence of spectra of light reflected from a substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The sequence of spectra are visually displayed as a contour plot.

公开(公告)号：US20180061032A1

公开(公告)日：2018-03-01

申请号：US15686785

申请日：2017-08-25

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu

IPC: G06T7/00 ,  G06T7/90 ,  H01L21/67 ,  B24B37/013

CPC classification number: G06T7/001 ,  B24B37/013 ,  G06T7/90 ,  G06T2207/10024 ,  G06T2207/30148 ,  H01L21/67253 ,  H01L21/67742 ,  H04N5/2256 ,  H04N9/07

Abstract: A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.

公开(公告)号：US20150371913A1

公开(公告)日：2015-12-24

申请号：US14312503

申请日：2014-06-23

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  B24B37/013 ,  B24B37/04 ,  H01L21/306 ,  H01L21/67

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/04 ,  H01L21/3212 ,  H01L22/14

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

Abstract translation: 在具有具有多个导电互连层的集成电路的制造中，抛光衬底层以提供集成电路的层。 衬底的层包括提供导电互连的导线。 衬底层包括在沟槽中由导电材料形成的闭合导电环路。 使用感应监测系统监测沟槽中导电材料的深度，并产生信号。 监测包括产生间歇地通过闭合导电回路的磁场。 从信号中提取随时间变化的值序列，表示导电材料随着时间的深度的值序列。

公开(公告)号：US09186774B2

公开(公告)日：2015-11-17

申请号：US13830032

申请日：2013-03-14

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Wen-Chiang Tu

IPC: B24B49/12 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/013

Abstract: A method of controlling a polishing operation includes receiving a first measurement of a first amount of metal on a substrate made by a first x-ray monitoring system after a first metal layer is deposited on the substrate and before a second metal layer is deposited on the substrate, transferring the substrate to a carrier head of a chemical mechanical polishing apparatus the substrate after the second metal layer is deposited on the substrate, making a second measurement of a second amount of metal on the substrate with a second x-ray monitoring system in the chemical mechanical polishing apparatus, comparing the first measurement to the second measurement to determine a difference, and adjusting a polishing endpoint or a polishing parameter of the polishing apparatus based on the difference.

Abstract translation: 控制抛光操作的方法包括在第一金属层沉积在基底上之后并且在第二金属层沉积在第一金属层之前，在由第一x射线监测系统制成的基底上接收第一量金属的第一测量 衬底，在第二金属层沉积在衬底上之后，将衬底转移到化学机械抛光装置的载体头部上，使衬底上的第二量的金属在第二X射线监测系统上进行第二次测量 所述化学机械抛光装置将所述第一测量与所述第二测量进行比较以确定差异，以及基于所述差异来调整所述抛光装置的抛光终点或抛光参数。

公开(公告)号：US09117751B2

公开(公告)日：2015-08-25

申请号：US14010193

申请日：2013-08-26

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/302 ,  H01L21/66 ,  B24B37/013 ,  B24B37/20 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/3105 ,  H01L21/321

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.

Abstract translation: 用于基于频谱的终点的方法和装置。 终点方法包括选择参考频谱。 参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。 对于特定的基于频谱的端点确定逻辑，经验地选择参考频谱，使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得当前频谱。 目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二基板上从感兴趣的薄膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。 该确定基于参考和当前光谱。

公开(公告)号：US20140273745A1

公开(公告)日：2014-09-18

申请号：US13830032

申请日：2013-03-14

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Wen-Chiang Tu

IPC: B24B37/005

CPC classification number: B24B49/12 ,  B24B37/013

Abstract: A method of controlling a polishing operation includes receiving a first measurement of a first amount of metal on a substrate made by a first x-ray monitoring system after a first metal layer is deposited on the substrate and before a second metal layer is deposited on the substrate, transferring the substrate to a carrier head of a chemical mechanical polishing apparatus the substrate after the second metal layer is deposited on the substrate, making a second measurement of a second amount of metal on the substrate with a second x-ray monitoring system in the chemical mechanical polishing apparatus, comparing the first measurement to the second measurement to determine a difference, and adjusting a polishing endpoint or a polishing parameter of the polishing apparatus based on the difference.

Abstract translation: 控制抛光操作的方法包括在第一金属层沉积在基底上之后并且在第二金属层沉积在第一金属层之前，在由第一x射线监测系统制成的基底上接收第一量金属的第一测量 衬底，在第二金属层沉积在衬底上之后，将衬底转移到化学机械抛光装置的载体头部上，使衬底上的第二量的金属在第二X射线监测系统上进行第二次测量 所述化学机械抛光装置将所述第一测量与所述第二测量进行比较以确定差异，以及基于所述差异来调整所述抛光装置的抛光终点或抛光参数。

公开(公告)号：US20140011429A1

公开(公告)日：2014-01-09

申请号：US14027070

申请日：2013-09-13

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Sivakumar Dhandapani

IPC: B24B49/12 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B37/105

Abstract: A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.

Abstract translation: 抛光装置包括用于保持具有多个光学孔的抛光垫的压板，用于将衬底保持在抛光垫上的载体头，用于在承载头和压板之间产生相对运动的电动机以及光学监控系统。 所述光学监视系统包括至少一个光源，公共检测器和配置成将来自所述至少一个光源的光引导到所述压板中的多个分离位置中的每一个的光学组件，以引导来自所述至少一个光源的每个位置的光 当衬底越过所述每个位置时，多个分离的位置到衬底，以在衬底经过所述每个位置时接收来自衬底的反射光，并将来自多个分离位置中的每一个的反射光引导到公共检测器 。