公开(公告)号：US11581203B2

公开(公告)日：2023-02-14

申请号：US17392392

申请日：2021-08-03

Applicant: APPLIED MATERIALS, INC.

Inventor： Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Paul B. Reuter ,  Shay Assaf ,  Sushant S. Koshti

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/677

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a first load lock disposed within the interior volume of the factory interface, and a first factory interface robot disposed within the interior volume of the factory interface, wherein the first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock.

公开(公告)号：US20210090917A1

公开(公告)日：2021-03-25

申请号：US17028281

申请日：2020-09-22

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Andrew J. Constant ,  Shay Assaf ,  Jacob Newman

IPC: H01L21/67

Abstract: Embodiments of the disclosure are directed to load lock chambers and methods of using load lock chambers. The load lock chambers include a middle section, an upper section connected to the middle section and a lower section connected to the middle section. A slit valve in a facet on the outside of the middle section provides an opening to access the middle volume from outside the load lock.

公开(公告)号：US10818525B2

公开(公告)日：2020-10-27

申请号：US16431239

申请日：2019-06-04

Applicant: Applied Materials, Inc.

Inventor： Shay Assaf ,  Andrew Constant ,  Jacob Newman ,  Charles Carlson ,  William Tyler Weaver ,  Stephen Hickerson

IPC: H01L21/67

Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.

公开(公告)号：US09890473B2

公开(公告)日：2018-02-13

申请号：US14735189

申请日：2015-06-10

Applicant: Applied Materials, Inc.

Inventor： Jacob Newman

IPC: C30B25/14 ,  C30B25/10 ,  C30B25/12

CPC classification number: C30B25/14 ,  C30B25/105 ,  C30B25/12

Abstract: Embodiments relate to methods and apparatus for batch processing of substrates during epitaxial film formation. In one example, a process chamber includes a chamber lid and substrate support. The chamber lid includes a centrally disposed gas inlet and a first gas deflector coupled to the chamber lid and adapted to direct the first process gas laterally across surfaces of a plurality of substrates. The lid also includes one or more gas outlets disposed radially outward of the centrally disposed gas inlet, and a plurality of lamps disposed between the centrally disposed gas inlet and the one or more gas outlets. The substrate support is rotatable and includes both a gas passage formed therein for introducing a second process gas to the internal volume of the process chamber and a second gas deflector adapted to direct the second process gas laterally across the surfaces of the plurality of substrates.

公开(公告)号：US09696097B2

公开(公告)日：2017-07-04

申请号：US14504021

申请日：2014-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Kallol Bera ,  Kim Vellore ,  Andrew Constant ,  Jacob Newman ,  Jeffrey Blahnik ,  Jason Schaller ,  William Weaver ,  Robert Vopat ,  Benjamin Riordon

IPC: E21B27/00 ,  F28F3/12 ,  H01L21/67 ,  H01L21/673

CPC classification number: F28F3/12 ,  H01L21/67109 ,  H01L21/67303

Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.

公开(公告)号：US20140271055A1

公开(公告)日：2014-09-18

申请号：US14211049

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Malcolm N. Daniel, JR. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

IPC: H01L21/677 ,  B25J9/16 ,  B25J11/00

CPC classification number: B25J9/1682 ,  B25J9/043 ,  B25J11/0095 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  Y10S901/29 ,  Y10T74/20305

Abstract: Electronic device processing systems are described. The system includes a mainframe housing having a transfer chamber, a first facet, a second facet opposite the first facet, a third facet, and a fourth facet opposite the third facet, a first carousel assembly coupled to a first facet, a second carousel assembly coupled to the third facet, a first load lock coupled to the second facet, a second load lock coupled to the fourth facet, and a robot adapted to operate in the transfer chamber to exchange substrates from the first and second carousels. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.

Abstract translation: 描述电子设备处理系统。 该系统包括主体壳体，其具有传送室，第一小面，与第一小面相对的第二小面，第三小面和与第三小面相对的第四小面，耦合到第一小面的第一旋转木马组件，第二转盘组件 耦合到第三小面，耦合到第二小面的第一负载锁定，耦合到第四小面的第二负载锁和适于在传送室中操作以从第一和第二转盘交换衬底的机器人。 还有许多其他方面描述了用于传输基底的方法和多轴机器人。

公开(公告)号：US12159796B2

公开(公告)日：2024-12-03

申请号：US18107701

申请日：2023-02-09

Applicant: Applied Materials, Inc.

Inventor： Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Paul B. Reuter ,  Shay Assaf ,  Sushant S. Koshti

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/677

Abstract: Devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a load lock disposed within the interior volume of the factory interface, and a factory interface robot disposed within the interior volume of the factory interface, wherein the factory interface robot is configured to transfer substrates between a set of substrate carriers and the load lock.

公开(公告)号：US20220068677A1

公开(公告)日：2022-03-03

申请号：US17392392

申请日：2021-08-03

Applicant: APPLIED MATERIALS, INC.

Inventor： Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Paul B. Reuter ,  Shay Assaf ,  Sushant S. Koshti

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  B65G47/90

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a first load lock disposed within the interior volume of the factory interface, and a first factory interface robot disposed within the interior volume of the factory interface, wherein the first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock.

公开(公告)号：US11204312B2

公开(公告)日：2021-12-21

申请号：US16818499

申请日：2020-03-13

Applicant: Applied Materials, Inc.

Inventor： Ami Sade ,  Todd Egan ,  Shay Assaf ,  Jacob Newman

IPC: G01N21/01 ,  G01B11/06 ,  G01N21/21 ,  G01N21/55

Abstract: Full wafer in-situ metrology chambers and methods of use are described. The metrology chambers include a substrate support and a sensor bar that are rotatable relative to each other. The sensor bar includes a plurality of sensors at different radii from a central axis.

公开(公告)号：US20210285865A1

公开(公告)日：2021-09-16

申请号：US16818499

申请日：2020-03-13

Applicant: Applied Materials, Inc.

Inventor： Ami Sade ,  Todd Egan ,  Shay Assaf ,  Jacob Newman

IPC: G01N21/01 ,  G01B11/06 ,  G01N21/21 ,  G01N21/55

Abstract: Full wafer in-situ metrology chambers and methods of use are described. The metrology chambers include a substrate support and a sensor bar that are rotatable relative to each other. The sensor bar includes a plurality of sensors at different radii from a central axis.