公开(公告)号：US20240075582A1

公开(公告)日：2024-03-07

申请号：US17979850

申请日：2022-11-03

Applicant: Applied Materials, Inc.

Inventor： Steven M. ZUNIGA ,  Jay GURUSAMY

IPC: B24B37/10 ,  B24B37/20 ,  B24B41/02 ,  B24B47/02 ,  B24B53/017

CPC classification number: B24B37/105 ,  B24B37/20 ,  B24B41/02 ,  B24B47/02 ,  B24B53/017

Abstract: The present disclosure is directed towards polishing modules for performing chemical mechanical polishing of a substrate. The substrate may be a semiconductor substrate. The polishing modules described have a plurality of pads, such as polishing pads, disposed within a single polishing station. The pads are configured to remain stationary during processing, such as during polishing or buff operations. Either an x-y gantry assembly or a head actuation assembly is coupled to a system body of a polishing module and is configured to move a carrier head over the pads. Between process operations the polishing pads may be indexed to expose a new polishing pad to the carrier head.

公开(公告)号：US20210323119A1

公开(公告)日：2021-10-21

申请号：US17076315

申请日：2020-10-21

Applicant: Applied Materials, Inc.

Inventor： Jagan RANGARAJAN ,  Edward GOLUBOVSKY ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: B24B37/34 ,  B24B37/30 ,  B24B37/04 ,  H01L21/67 ,  H01L21/677 ,  H01L21/306

Abstract: Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.

公开(公告)号：US20200156206A1

公开(公告)日：2020-05-21

申请号：US16690062

申请日：2019-11-20

Applicant: Applied Materials, Inc.

Inventor： Steven M. ZUNIGA ,  Jay GURUSAMY ,  Bum Jick KIM ,  Danielle LOI

IPC: B24B37/30

Abstract: A polishing system is provided, including a carrier with an offset distance. The offset distance allows a shifted carrier head to cover more surface area of the polishing surface. The offset distance effectively provides an additional rotation of the carrier head about the axis, which allows for a greater area traversed on the polishing surface, improving chemical mechanical polishing uniformity on the substrate.

公开(公告)号：US20160005618A1

公开(公告)日：2016-01-07

申请号：US14476991

申请日：2014-09-04

Applicant: Applied Materials, Inc.

Inventor： Chih Hung CHEN ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: H01L21/306 ,  B24B41/047 ,  H01L21/67 ,  B24B37/10

CPC classification number: B24B41/047 ,  B24B37/10

Abstract: A polishing device includes a housing, a flexible base coupled to the housing, and a contact region disposed on a first side of the flexible base, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base.

Abstract translation: 抛光装置包括壳体，联接到壳体的柔性基座和设置在柔性基座的第一侧面上的接触区域，其中柔性基座基于容纳在壳体内的压力而膨胀和收缩，并且柔性基座的第二侧 以在第一侧上形成小于柔性基底的表面积的接触区域。

公开(公告)号：US20240383099A1

公开(公告)日：2024-11-21

申请号：US18318880

申请日：2023-05-17

Applicant: Applied Materials, Inc.

Inventor： Christopher Heung-Gyun LEE ,  Ghunbong CHEUNG ,  Jay GURUSAMY ,  Ekaterina MIKHAYLICHENKO ,  Chih-Han YANG

IPC: B24B53/00 ,  B24B49/10 ,  B24B49/18

Abstract: Embodiments of the present disclosure provided herein include an apparatus and method for pad conditioning in a chemical mechanical polishing system. The apparatus includes a first conditioning head coupleable to a first pad conditioning disk disposed at a first head distance from the first conditioning head. The apparatus further includes a second a third conditioning head configured similarly to the first conditioning head. The apparatus includes a controller configured to receive sensor readings, determine whether the sensor readings are outside of a predetermined range, and adjust the first, second, and third head distances. A method of conditioning a polishing pad includes receiving sensor readings from at least one pad thickness sensor, determining if the sensor readings are outside of a predetermined range, and, upon determining that the sensor readings are outside of the predetermined range, adjusting a head distance of a conditioning head based on the sensor readings.

公开(公告)号：US20240307963A1

公开(公告)日：2024-09-19

申请号：US18183000

申请日：2023-03-13

Applicant: Applied Materials, Inc.

Inventor： Ximeng XUE ,  David J. LISCHKA ,  Jay GURUSAMY ,  Steven M. ZUNIGA ,  Jeonghoon OH ,  Jagan RANGARAJAN

IPC: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

CPC classification number: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

Abstract: Embodiments of the disclosure provided herein include an apparatus and method for additive manufacturing a component for a semiconductor processing apparatus. The apparatus for additive manufacturing includes a printhead configured to selectively deposit layers on build the component, wherein the printhead may selectively deposit a first set of layers onto the build platform, and selectively deposit a second set of layers on the first set of layers, each of the second set of layers comprising a gap that forms a cooling channel through the component. The cooling channel is filled a filler material. A third set of layers covers the cooling channel before the channel is exposed to a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid which is then drained. In other embodiments, the cooling channel may be machined into the component before being filled with the filler material.

公开(公告)号：US20240253179A1

公开(公告)日：2024-08-01

申请号：US18630886

申请日：2024-04-09

Applicant: Applied Materials, Inc.

Inventor： Andrew NAGENGAST ,  Steven M. ZUNIGA ,  Jay GURUSAMY ,  Charles C. GARRETSON ,  Vladimir GALBURT

IPC: B24B37/32 ,  B24B37/005 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/005 ,  B24B37/04

Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

公开(公告)号：US20240051081A1

公开(公告)日：2024-02-15

申请号：US17888007

申请日：2022-08-15

Applicant: Applied Materials, Inc.

Inventor： Jay GURUSAMY ,  Steven M. ZUNIGA ,  Takashi FUJIKAWA ,  Jeonghoon OH

IPC: B24B37/20

CPC classification number: B24B37/20

Abstract: Embodiments of the present disclosure provide a multiple disk pad conditioner and methods of using the multiple disk pad conditioner during a chemical mechanical polishing (CMP) process. The multiple disk pad conditioner has a plurality of conditioning heads having conditioning disks affixed thereto. The multiple disk pad conditioner can include a conditioning arm, and a plurality of conditioning heads attached to the conditioning arm. Each of the plurality of conditioning heads has a conditioning disk affixed thereto. In some embodiments, each of the conditioning heads include a rotational axis, wherein each of the rotational axes is disposed a distance apart in a first direction that extends along the length of the conditioning arm.

公开(公告)号：US20220111482A1

公开(公告)日：2022-04-14

申请号：US17495679

申请日：2021-10-06

Applicant: Applied Materials, Inc.

Inventor： Steven M. ZUNIGA ,  Andrew NAGENGAST ,  Jay GURUSAMY

IPC: B24B37/005 ,  B24B37/02 ,  B24B37/20 ,  B24B37/12

Abstract: An apparatus for chemical mechanical polishing (CMP) of a substrate is described herein. The apparatus includes an extension disposed between a retaining ring and a chucking membrane. The extension is disposed radially outward from the edge of the substrate and is configured to contact the retaining ring during substrate processing. The extension provides a repeatable and controlled point of contact between the retaining ring and the chucking membrane. The extension may have multiple configurations, such that the contact point between the retaining ring and the chucking membrane is set at a pre-determined location or such that the contact point is moveable by an adjustable stop.

公开(公告)号：US20150105005A1

公开(公告)日：2015-04-16

申请号：US14510195

申请日：2014-10-09

Applicant: Applied Materials, Inc.

Inventor： Steven M. ZUNIGA ,  Chih Hung CHEN ,  Jay GURUSAMY

IPC: H01L21/677 ,  B24B37/10 ,  B24B37/34

CPC classification number: B24B37/10 ,  B24B37/345

Abstract: A chemical mechanical polishing system is provided. The chemical mechanical polishing system includes a platen, a load cup, a hub, a first polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup, and a second polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup the second arm rotatable independently from the hub.

Abstract translation: 提供化学机械抛光系统。 所述化学机械抛光系统包括压板，负载杯，轮毂，从所述轮毂悬臂并能围绕所述压板和所述负载杯之间的所述轮毂的中心线旋转的第一抛光臂，以及从所述轮毂悬臂的第二抛光臂， 围绕压板和负载杯之间的毂的中心线，第二臂可独立于轮毂旋转。