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公开(公告)号:US20210170584A1
公开(公告)日:2021-06-10
申请号:US16708337
申请日:2019-12-09
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Kopec , Lyle Kosinski , Matvey Farber , Jeffrey Hudgens
IPC: B25J9/16
Abstract: An autoteach enclosure system includes a plurality of surfaces that at least partially enclose an interior volume of the autoteach enclosure system. The autoteach enclosure system further includes an autoteach pin at least partially disposed within the interior volume. The autoteach pin is a scannable feature having a fixed position within the autoteach enclosure system. The autoteach enclosure system further includes a front interface coupled to one or more of the plurality of surfaces to interface the autoteach enclosure system with a substantially vertical portion of a load port of a wafer processing system. The autoteach pin enables an autoteach operation of a robot arm of the wafer processing system. The autoteach operation is an operation to automatically teach the fixed position within the autoteach enclosure system to the robot arm of the wafer processing system.
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公开(公告)号:US11932950B2
公开(公告)日:2024-03-19
申请号:US18097152
申请日:2023-01-13
Applicant: Applied Materials, Inc.
Inventor: Yuanhong Guo , Sheng Michael Guo , Marek W. Radko , Steven Victor Sansoni , Nagendra Madiwal , Matvey Farber , Pingping Gou , Song-Moon Suh , Jeffrey C. Hudgens , Yuji Murayama , Anurag Bansal , Shaofeng Chen , Michael Kuchar
CPC classification number: C23F17/00 , B08B3/04 , B23C3/00 , C23C14/5873 , C23F1/16 , C23F1/20 , H01L21/67184
Abstract: A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.
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公开(公告)号:US20240075617A1
公开(公告)日:2024-03-07
申请号:US17903916
申请日:2022-09-06
Applicant: Applied Materials, Inc.
Inventor: Pei-Chen Wu , Rajkumar Thanu , Matvey Farber
IPC: B25J9/16
CPC classification number: B25J9/1664 , G05B2219/39001 , G05B2219/40519
Abstract: A method includes identifying a sequence of robot configurations associated with processing a plurality of substrates. The method further includes generating motion planning data comprising corresponding velocity data and corresponding acceleration data for each portion of a trajectory associated with the processing of the plurality of substrates. The method further includes causing a robot arm to be actuated based on the motion planning data.
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公开(公告)号:US11770049B2
公开(公告)日:2023-09-26
申请号:US17030094
申请日:2020-09-23
Applicant: Applied Materials, Inc.
Inventor: Alexander Berger , Paul Lawrence Korff , William Paul Laceky , Jeffrey C. Hudgens , Rajkumar Thanu , Damon K. Cox , Matvey Farber
IPC: B25J19/00 , H02K7/18 , B25J17/00 , B25J13/08 , B25J9/10 , H02K1/278 , H02K17/44 , H02K16/00 , H02K21/28 , H02K7/11 , B25J11/00
CPC classification number: H02K7/1807 , B25J9/108 , B25J13/088 , B25J17/00 , B25J19/0029 , H02K1/278 , H02K7/11 , H02K16/005 , H02K17/44 , H02K21/28 , B25J11/0095 , B25J19/005
Abstract: A robot device includes a first link and a second link coupled to the first link via an elbow. One or more of the first link or the second link rotates about an axis of the elbow. The robot device further includes a generator disposed in the elbow. The generator is configured to generate electrical power based on relative angular mechanical movement associated with the elbow. The robot device further includes an end effector configured to transport a substrate within a substrate processing system. The end effector is disposed at a distal end of the second link. The end effector is to receive the electrical power generated by the generator.
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公开(公告)号:US20230151497A1
公开(公告)日:2023-05-18
申请号:US18097152
申请日:2023-01-13
Applicant: Applied Materials, Inc.
Inventor: Yuanhong Guo , Sheng Michael Guo , Marek W. Radko , Steven Victor Sansoni , Nagendra Madiwal , Matvey Farber , Pingping Gou , Song-Moon Suh , Jeffrey C. Hudgens , Yuji Murayama , Anurag Bansal , Shaofeng Chen , Michael Kuchar
Abstract: A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.
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