公开(公告)号：US20240363599A1

公开(公告)日：2024-10-31

申请号：US18681521

申请日：2022-08-17

申请人： BOE Technology Group Co., Ltd.

发明人： Can WANG ,  Qi QI ,  Wei LI ,  Can ZHANG ,  Minghua XUAN ,  Jinfei NIU ,  Jingjing ZHANG

IPC分类号： H01L25/075 ,  H01L21/683 ,  H01L33/00 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L21/6835 ,  H01L33/0093 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68386 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091

摘要： A method for preparing the display substrate includes: providing a first substrate, and forming a light emitting chip layer on the first substrate to form a first backplane, wherein the light emitting chip layer includes: light emitting chips arranged in array, which are configured to emit light of a first color and include N sub-pixels, and N is a positive integer greater than or equal to 1; providing a second substrate, and forming a drive circuit layer on the second substrate to form a second backplane, wherein the drive circuit layer includes: connection electrodes arranged in an array, and the light emitting chips correspond to the connection electrodes one-by-one; transferring the first backplane from which the first substrate is peeled off to the second backplane; forming an optical film layer on a side of the light emitting chip layer away from the second backplane.