Apparatus and method for repairing a semiconductor memory

    公开(公告)号:US20070002646A1

    公开(公告)日:2007-01-04

    申请号:US11170260

    申请日:2005-06-29

    IPC分类号: G11C29/00

    摘要: An apparatus and method for repairing a semiconductor memory device includes a first memory cell array, a first redundant cell array and a repair circuit configured to nonvolatilely store a first address designating at least one defective memory cell in the first memory cell array. A first volatile cache stores a first cached address corresponding to the first address designating the at least one defective memory cell. The repair circuit distributes the first address designating the at least one defective memory cell of the first memory cell array to the first volatile cache. Match circuitry substitutes at least one redundant memory cell from the first redundant cell array for the at least one defective memory cell in the first memory cell array when a first memory access corresponds to the first cached address.

    Memory device and method having data path with multiple prefetch I/O configurations
    12.
    发明申请
    Memory device and method having data path with multiple prefetch I/O configurations 失效
    具有多个预取I / O配置的数据路径的存储器件和方法

    公开(公告)号:US20080089158A1

    公开(公告)日:2008-04-17

    申请号:US11999383

    申请日:2007-12-04

    IPC分类号: G11C7/00

    摘要: A memory device is operable in either a high mode or a low speed mode. In either mode, 32 bits of data from each of two memory arrays are prefetched into respective sets of 32 flip-flops. In the high-speed mode, the prefetched data bits are transferred in parallel to 4 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 4 data bus terminals. In the low speed mode, two sets of prefetched data bits are transferred in parallel to 8 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 8 data bus terminals.

    摘要翻译: 存储器件可以在高模式或低速模式下操作。 在任一模式中,来自两个存储器阵列中的每一个的32位数据被预取到相应的32个触发器组中。 在高速模式下,预取数据位并行传输到4个并行到串行转换器,它们将并行数据位转换为8个串行数据位的脉冲串,并将该脉冲串应用于4个数据总线 终端。 在低速模式下,两组预取数据位并行传送到8个并行到串行转换器,它们将并行数据位转换为8个串行数据位的脉冲串,并将该脉冲串应用于8个数据中的相应一个 巴士总站。

    Memory device and method having data path with multiple prefetch I/O configurations
    15.
    发明申请
    Memory device and method having data path with multiple prefetch I/O configurations 有权
    具有多个预取I / O配置的数据路径的存储器件和方法

    公开(公告)号:US20070058469A1

    公开(公告)日:2007-03-15

    申请号:US11595515

    申请日:2006-11-08

    IPC分类号: G11C7/00

    摘要: A memory device is operable in either a high mode or a low speed mode. In either mode 32 bits of data from each of two memory arrays are prefetched into respective sets of 32 flip-flops. In the high-speed mode, the prefetched data bits are transferred in parallel to 4 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 4 data bus terminals. In the low speed mode, two sets of prefetched data bits are transferred in parallel to 8 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 8 data bus terminals.

    摘要翻译: 存储器件可以在高模式或低速模式下操作。 在任一模式中,来自两个存储器阵列中的每一个的32位数据被预取到相应的32个触发器组中。 在高速模式下,预取数据位并行传输到4个并行到串行转换器,它们将并行数据位转换为8个串行数据位的脉冲串,并将该脉冲串应用于4个数据总线 终端。 在低速模式下,两组预取数据位并行传送到8个并行到串行转换器,它们将并行数据位转换为8个串行数据位的脉冲串,并将该脉冲串应用于8个数据中的相应一个 巴士总站。

    Memory device and method having data path with multiple prefetch I/O configurations
    18.
    发明申请
    Memory device and method having data path with multiple prefetch I/O configurations 失效
    具有多个预取I / O配置的数据路径的存储器件和方法

    公开(公告)号:US20050122789A1

    公开(公告)日:2005-06-09

    申请号:US11031437

    申请日:2005-01-07

    摘要: A memory device is operable in either a high mode or a low speed mode. In either mode 32 bits of data from each of two memory arrays are prefetched into respective sets of 32 flip-flops. In the high-speed mode, the prefetched data bits are transferred in parallel to 4 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 4 data bus terminals. In the low speed mode, two sets of prefetched data bits are transferred in parallel to 8 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 8 data bus terminals.

    摘要翻译: 存储器件可以在高模式或低速模式下操作。 在任一模式中,来自两个存储器阵列中的每一个的32位数据被预取到相应的32个触发器组中。 在高速模式下,预取数据位并行传输到4个并行到串行转换器,它们将并行数据位转换为8个串行数据位的脉冲串,并将该脉冲串应用于4个数据总线 终端。 在低速模式下,两组预取数据位并行传送到8个并行到串行转换器,它们将并行数据位转换为8个串行数据位的脉冲串,并将该脉冲串应用于8个数据中的相应一个 巴士总站。

    Apparatus and method for mounting microelectronic devices on a mirrored board assembly
    19.
    发明申请
    Apparatus and method for mounting microelectronic devices on a mirrored board assembly 有权
    将微电子器件安装在镜像板组件上的装置和方法

    公开(公告)号:US20050007806A1

    公开(公告)日:2005-01-13

    申请号:US10910979

    申请日:2004-08-03

    IPC分类号: G11C5/00 H05K1/18 G11C7/00

    摘要: The present invention is directed to a system, a module, and an apparatus and method for forming a microelectronic memory device. In one embodiment, a system includes a processor and a controller coupled to the processor with at least one memory module coupled to the controller, the module including a pair of memory devices oppositely positioned on respective surfaces of a substrate and interconnected by members extending through the substrate that couple terminals of the devices, the terminals being selected to include a group of terminals that are configured to communicate functionally compatible signals.

    摘要翻译: 本发明涉及一种用于形成微电子存储器件的系统,模块以及装置和方法。 在一个实施例中,系统包括处理器和耦合到处理器的控制器,其中至少一个存储器模块耦合到控制器,该模块包括一对存储器件,其相对地定位在衬底的相应表面上并且通过延伸穿过 耦合器件的端子的基板,所述端子被选择为包括被配置为传送功能兼容的信号的一组端子。

    Apparatus and method for mounting microelectronic devices on a mirrored board assembly
    20.
    发明申请
    Apparatus and method for mounting microelectronic devices on a mirrored board assembly 审中-公开
    将微电子器件安装在镜像板组件上的装置和方法

    公开(公告)号:US20070115712A1

    公开(公告)日:2007-05-24

    申请号:US11654435

    申请日:2007-01-16

    IPC分类号: G11C5/06

    摘要: The present invention is directed to a system, a module, and an apparatus and method for forming a microelectronic memory device. In one embodiment, a system includes a processor and a controller coupled to the processor with at least one memory module coupled to the controller, the module including a pair of memory devices oppositely positioned on respective surfaces of a substrate and interconnected by members extending through the substrate that couple terminals of the devices, the terminals being selected to include a group of terminals that are configured to communicate functionally compatible signals.

    摘要翻译: 本发明涉及一种用于形成微电子存储器件的系统,模块以及装置和方法。 在一个实施例中,系统包括处理器和耦合到处理器的控制器,其中至少一个存储器模块耦合到控制器,该模块包括一对存储器件,其相对地定位在衬底的相应表面上并且通过延伸穿过 耦合器件的端子的基板,所述端子被选择为包括被配置为传送功能兼容的信号的一组端子。