MICRO-FEATURE METHODS FOR OVER-MOLDING SUBSTRATE
    16.
    发明申请
    MICRO-FEATURE METHODS FOR OVER-MOLDING SUBSTRATE 审中-公开
    用于超模底物的微特征方法

    公开(公告)号:US20150084217A1

    公开(公告)日:2015-03-26

    申请号:US14386193

    申请日:2013-03-26

    Abstract: A method of making a microplate, including: injection molding a resin to form a substrate (900) having a grating region feature on a surface of the substrate, and at least one micro-feature (910) in the vicinity of the grating region feature; waveguide treating (920) the resulting molded substrate; and over-molding the resulting waveguide treated molded substrate with a compatible resin to from the integral well plate (935) on the microplate. Also disclosed is a method of making a microplate, including: surface roughening to form a bonding area on a waveguide coated surface of a polymeric substrate having an integral grating region; and over-molding the resulting surface roughened substrate and a compatible resin to form the integral microplate, as defined herein.

    Abstract translation: 一种制造微孔板的方法,包括:注射成型树脂以形成在基底表面上具有光栅区域特征的基底(900),以及在光栅区域特征附近的至少一个微特征(910) ; 波导处理(920)所得模制基板; 并用相容的树脂将得到的波导处理的模制基材从模板上的整体孔板(935)上超模塑。 还公开了一种制造微板的方法,包括:表面粗糙化以在具有整体光栅区域的聚合物基板的波导涂覆表面上形成结合区域; 并且对所得的表面粗糙化基材和相容性树脂进行超模塑,以形成如本文所定义的整体微孔板。

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