公开(公告)号：US20210175219A1

公开(公告)日：2021-06-10

申请号：US16771488

申请日：2018-12-10

Applicant: Corning Incorporated

Inventor： Jiangwei Feng ,  Jen-Chieh Lin ,  Lu Zhang

IPC: H01L25/13 ,  C03C17/04 ,  C03C23/00 ,  C03C17/25 ,  C03C17/32 ,  H01L33/00

Abstract: A method of making a display area and a glass tile as well as a display area that includes the glass tile. Prior to assembling the glass tile into the array, an edge treatment is performed on the glass tile, the edge treatment increasing an edge strength of the glass tile, as measured by the four point bend test, to at least about 200 MPa. The edge treatment can, for example, include at least one of plasma jet treatment and protective material application.

公开(公告)号：US20210159076A1

公开(公告)日：2021-05-27

申请号：US17104723

申请日：2020-11-25

Applicant: CORNING INCORPORATED

Inventor： Ya-Huei Chang ,  Karl William Koch, III ,  Jen-Chieh Lin ,  Jian-Zhi Jay Zhang

IPC: H01L21/02 ,  H01L29/16

Abstract: Embodiments of a glass wafer for semiconductor fabrication processes are described herein. In some embodiments, a glass wafer includes: a glass substrate comprising: a top surface, a bottom surface opposing the top surface, and an edge surface between the top surface and the bottom surface; a first coating disposed atop the glass substrate, wherein the first coating is a doped crystalline silicon coating having a sheet-resistance of 100 to 1,000,000 ohm per square; and a second coating having one or more layers disposed atop the glass substrate, wherein the second coating comprises a silicon containing coating, wherein the glass wafer has an average transmittance (T) of less than 50% over an entire wavelength range of 400 nm to 1000 nm.

公开(公告)号：US20180108868A1

公开(公告)日：2018-04-19

申请号：US15784676

申请日：2017-10-16

Applicant: Corning Incorporated

Inventor： Kuan-Ting Kuo ,  Jen-Chieh Lin ,  Lu Zhang

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5262 ,  B05D3/067 ,  H01L51/0097 ,  H01L51/5268 ,  H01L51/56 ,  H01L2251/303 ,  H01L2251/5338 ,  H01L2251/5369 ,  Y02E10/549

Abstract: A process includes providing a base substrate and disposing a precursor on the base substrate. The precursor includes powdered particles of a first material and an organic binder. The process includes photo-thermally treating the precursor to form a light extraction layer. The photo-thermal treatment includes exposing the precursor to a flash lamp that is energized in pulses. The process further includes disposing an organic light emitting diode adjacent to the light extraction layer.

公开(公告)号：US20170254930A1

公开(公告)日：2017-09-07

申请号：US15448022

申请日：2017-03-02

Applicant: Corning Incorporated

Inventor： Shandon Dee Hart ,  Karl William Koch, III ,  Jen-Chieh Lin ,  Mark Alejandro Quesada ,  James Andrew West

IPC: G02B5/02 ,  H01L51/52 ,  C03C17/00

CPC classification number: G02B5/0221 ,  C03C17/007 ,  C03C19/00 ,  G02B5/0236 ,  G02B5/0278

Abstract: Disclosed herein are methods for forming light-transmitting articles comprising depositing a layer comprising a second material on a substrate comprising a first material, and forming a patterned surface on the second material. The first and second materials can have different glass transition temperatures Tg and/or refractive indices n. Additional layers comprising a third material can also be formed over the patterned surface, the third material having a glass transition temperature Tg and refractive index n that may be the same or different from those of the first and second material. Light-transmitting articles formed by such methods, as well as display devices comprising such light-transmitting articles are also disclosed herein.

公开(公告)号：US20170215270A1

公开(公告)日：2017-07-27

申请号：US15416663

申请日：2017-01-26

Applicant: Corning Incorporated

Inventor： Daniel Warren Hawtof ,  Archit Lal ,  Jen-Chieh Lin ,  Gary Richard Trott

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H01Q9/04 ,  H01Q1/12

CPC classification number: H05K1/024 ,  H01Q1/12 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q9/285 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/381 ,  H05K2201/068 ,  H05K2201/10098

Abstract: A high silica content substrate, such as for a device, is provided. The substrate has a high silica content and is thin. The substrate may include a surface with a topography or profile that facilitates bonding with a conductive metal layer, such as a metal layer for a circuit or antenna. The substrate may be flexible, have high temperature resistance, very low CTE, high strength and/or be non-reactive. The substrate may be suitable for use in circuits intended for use in high temperature environments, low temperature environments, reactive environments, or other harsh environments. The substrate may be suitable for high frequency antenna applications.

公开(公告)号：US20240239275A1

公开(公告)日：2024-07-18

申请号：US18289822

申请日：2022-05-13

Applicant: Corning Incorporated

Inventor： Jen-Chieh Lin ,  Arlin Lee Weikel

IPC: B60R13/02 ,  B60K35/50 ,  C03B23/00 ,  C03B23/035 ,  C03C17/00

CPC classification number: B60R13/0262 ,  B60K35/50 ,  C03B23/006 ,  C03B23/0357 ,  C03C17/005 ,  B60K2360/693 ,  B60R2013/0287 ,  C03C2218/119

Abstract: Disclosed is a method of forming a vehicle interior component. In the method, a glass article is arranged on a forming surface of a forming surface. The glass article has a first major surface and a second major surface. The first major surface faces the forming surface, and the second major surface is opposite to the first major surface. The second major surface includes a region having a surface free energy of at least 35 mN/m. An adhesive is applied to the region of the second major surface of the glass article. The adhesive is contacted with a frame to attach the frame to the glass article.

公开(公告)号：US20230341986A1

公开(公告)日：2023-10-26

申请号：US17763353

申请日：2020-09-23

Applicant: CORNING INCORPORATED

Inventor： Ya-Huei Chang ,  Daniel Wayne Levesque, JR. ,  Jen-Chieh Lin ,  Lu Zhang

IPC: G06F3/044 ,  G06F3/041

CPC classification number: G06F3/0448 ,  G06F3/0446 ,  G06F3/0412 ,  G06F2203/04103

Abstract: Embodiments are related generally to display devices, and more particularly to displays or display tiles having electrodes that extend from a first surface to a second surface of a substrate.

公开(公告)号：US11328950B2

公开(公告)日：2022-05-10

申请号：US17153041

申请日：2021-01-20

Applicant: CORNING INCORPORATED

Inventor： Ya-Huei Chang ,  Jen-Chieh Lin ,  Jian-Zhi Jay Zhang

IPC: H01L21/762 ,  H01L29/24 ,  H01L21/304 ,  H01L21/02 ,  H01L21/48

Abstract: Embodiments of the disclosure relate to a method for fabricating semiconductor-on-insulator (SemOI) electronic components. In the method, a device wafer is bonded to a handling wafer. The device wafer includes a semiconductor device layer and a buried oxide layer. A substrate is adhered to the handling wafer. The substrate is a glass or a ceramic, and bonding occurs at an interface between the semiconductor device layer and the substrate. Material is removed from the device wafer to expose the buried oxide layer. The substrate is debonded from the handling wafer so as to provide an SemOI electronic component including the substrate, the semiconductor device layer, and the buried oxide layer.

公开(公告)号：US20210225693A1

公开(公告)日：2021-07-22

申请号：US17153041

申请日：2021-01-20

Applicant: CORNING INCORPORATED

Inventor： Ya-Huei Chang ,  Jen-Chieh Lin ,  Jian-Zhi Jay Zhang

IPC: H01L21/762 ,  H01L29/24 ,  H01L21/48 ,  H01L21/02 ,  H01L21/304

Abstract: Embodiments of the disclosure relate to a method for fabricating semiconductor-on-insulator (SemOI) electronic components. In the method, a device wafer is bonded to a handling wafer. The device wafer includes a semiconductor device layer and a buried oxide layer. A substrate is adhered to the handling wafer. The substrate is a glass or a ceramic, and bonding occurs at an interface between the semiconductor device layer and the substrate. Material is removed from the device wafer to expose the buried oxide layer. The substrate is debonded from the handling wafer so as to provide an SemOI electronic component including the substrate, the semiconductor device layer, and the buried oxide layer.

公开(公告)号：US20180166353A1

公开(公告)日：2018-06-14

申请号：US15753889

申请日：2016-08-19

Applicant: Corning Incorporated

Inventor： Sean Matthew Garner ,  Jen-Chieh Lin ,  Michael Lesley Sorensen

IPC: H01L23/15 ,  C03B33/02 ,  C03C17/00 ,  C03C23/00 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K3/0029 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/002 ,  C03C17/008 ,  C03C23/0025 ,  C03C23/007 ,  C03C2217/445 ,  C03C2217/70 ,  H01L21/4807 ,  H01L23/15 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/036 ,  H05K1/115 ,  H05K3/002 ,  H05K3/107 ,  H05K3/388 ,  H05K3/4038 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2203/0143 ,  H05K2203/0743 ,  H05K2203/075 ,  H05K2203/0776 ,  H05K2203/0789 ,  H05K2203/107 ,  H05K2203/1194 ,  H05K2203/1545 ,  Y02P40/57

Abstract: Glass substrate assemblies having low dielectric properties, electronic assemblies incorporating glass substrate assemblies, and methods of fabricating glass substrate assemblies are disclosed. In one embodiment, a substrate assembly includes a glass layer 110 having a first surface and a second surface, and a thickness of less than about 300 μm. The substrate assembly further includes a dielectric layer 120 disposed on at least one of the first surface or the second surface of the glass layer. The dielectric layer has a dielectric constant value of less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz. In some embodiments, the glass layer is made of annealed glass such that the glass layer has a dielectric constant value of less than about 5.0 and a dissipation factor value of less than about 0.003 in response to electromagnetic radiation having a frequency of 10 GHz. An electrically conductive layer 142 is disposed on a surface of the dielectric layer, within the dielectric layer or under the dielectric layer.