Abstract:
A delay circuit that can be implemented in a monolithic integrated circuit includes a plurality of capacitor/laser-fusible link series pairs. Delay of a binary output signal of the circuit with respect to an input transition is directly proportional to the amount of capacitance connected into the circuit. Because the laser-fusible links can selectively be opened with a laser, the amount of capacitance connected into the circuit can incrementally be reduced; thus, the delay of the circuit is reducibly adjustable to a desired value. By including a plurality of conductive element/laser-fusible link series pairs in the delay circuit, the delay of the circuit is also increasingly adjustable. A method for economically adjusting the delay of each of many like delay circuits embodied in a semiconductor wafer includes measuring a sample of the delays of the delay circuits, calculating an average delay, determining the difference between a desired delay and the average delay to determine an incremental amount of delay to eliminate or to add, determining from predetermined data which fusible links should be opened, and using a laser beam to open the appropriate links.
Abstract:
A compact memory cell combines a volatile dynamic storage section with a shadow nonvolatile section in two vertically stacked element arrays.
Abstract:
A clocking system for a self-refreshed dynamic memory (10) for reading data stored in a memory cell (30) and including clocking circuitry (68) includes detecting changes in an address signal (60). The method further includes generating a memory refresh signal (64, 66) in response to detecting changes in the address signal (60). The memory refresh signal (66) is applied to the semiconductor memory circuit (30) for refreshing data stored in the memory cells of the semiconductor memory circuit (30). After the application of the memory refresh signal (66) to the semiconductor memory circuit (30) the address signal (16) is applied to the semiconductor memory circuit (30) for accessing the addressed memory cell to thereby read the data stored therein. The clocking circuitry (68) is reset and precharged during the application of the refresh signal (66) to the semiconductor memory circuit (30).
Abstract:
A content addressable memory is provided that includes a memory cell and a first plurality of lines connected directly to the gates of access transistors to this memory cell. These access transistors are further connected to a second plurality of lines. The first and second plurality of lines each perform different functions during read, write, and comparison modes. In another embodiment of the present invention, p-channel transistors are used for a match transistor and its associated pass transistors.
Abstract:
A dual storage cell memory includes an array of dual storage cells, each of the dual storage cells containing a first memory cell and a second memory cell. The first and second memory cells are well known six-transistor static memory cells with the addition of transfer circuitry for transferring data directly from the internal data nodes of each of the memory cells to its corresponding complementary memory cell without requiring the use of the enable transistors or the bit lines associated with each of the dual storage cells.
Abstract:
A low-power crystal-controlled CMOS oscillator wherein a long and wide additional transistor is provided in the first stage of the output amplifier. This prevents the output amplifier from diverting too much current from the primary amplifier stage during start-up.
Abstract:
A low-power crystal-controlled CMOS oscillator wherein a long and wide additional transistor is provided in the first stage of the output amplifier. This prevents the output amplifier from diverting too much current from the primary amplifier stage during start-up.
Abstract:
A nonvolatile static random access memory cell (10) includes a pair of cross-coupled transistors (12, 14) which function as a bistable circuit to store data states. Variable threshold transistors (36, 41) are respectively connected in series between the driver transistors (12, 14) and load devices (48, 50). A control node (40) is driven to a high voltage state to cause one of the variable threshold transistors (36, 41) to be driven to have a higher threshold voltage and thereby store the data state held in the cross-coupled transistors (12, 14). The data state is thus stored in nonvolatile form. Upon recall the memory cell (10) is reactivated and the threshold differential between the variable threshold transistors (36, 41) causes the driver transistors (12, 14) to be set at the stored data state. The data recalled by the memory cell (10) is in true rather than in complementary form. The variable threshold transistors (36, 41) are reset by driving the power terminal V.sub.cc to a high voltage state to reestablish common threshold voltages for the variable threshold voltage transistors (36, 41).
Abstract:
An integrated circuit memory cell (10) having a bit line (12), a word line (14) and a cell voltage supply (26) is provided. The integrated circuit memory cell (10) includes a first clock line (34) and a second clock line (36). A first transistor (20) is interconnected to the bit line (12) and the word line (14) for providing access to the memory cell (10). A second transistor (22) is interconnected to the cell voltage supply source (26) and to the first transistor (20) thereby defining a first node (S). The second transistor (22) provides a charging path from the cell voltage supply source (26) to the first node (S). A capacitor (30) is provided and interconnects the first clock line (34) and the second transistor (22). The interconnection between the capacitor (30) and the second transistor (22) defines a second node (K). The capacitor (30) provides a coupling path between the first clock line (34) and the second node (K) for conditionally supplying a voltage from the first clock line (34) to the second node (K) to render voltage at the second node (K) higher than the cell voltage supply source (26). A third transistor is provided for the memory cell (10) and is interconnected to the first node (S) and the second node (K) and the second clock line (36). The third transistor (24) provides a charging path between the second clock line (36) and the second node (K) for conditionally maintaining a voltage at the second node (K).
Abstract:
A dual storage cell memory includes an array of dual storage cells, each of the dual storage cells containing a first memory cell and a second memory cell. The first and second memory cells are well known six-transistor static memory cells with the addition of transfer circuitry for transferring data directly from the internal data nodes of each of the memory cells to its corresponding complementary memory cell without requiring the use of the enable transistors or the bit lines associated with each of the dual storage cells.