摘要:
A turbo decoder system utilizing a MAP decoding algorithm has a predetermined number of turbo decoder modules for decoding segments of a turbo code component code word in parallel, thereby expanding the block-length and data rate capability of the turbo decoder. Upon completion of any half iteration of the MAP decoding algorithm, the a posteriori bit probability estimates are provided to an interleave/de-interleave-and-convert-data function block wherein they are re-ordered, segmented, used to modify the original received data samples, and provided back to the respective turbo decoder modules as input data samples for the systematic bits. Decoding continues in this manner until a predetermined number of half iterations is performed, and data decisions are made on the final a posteriori estimates.
摘要:
A transceiver for use in an ultrasound system is provided. The transceiver is configured to operate in a transmit mode and a receive mode. The transceiver comprises a high voltage switch, a low voltage switch and a resistor coupled to the high voltage switch and the low voltage switch.
摘要:
An ultrasound transducer probe is disclosed comprising: an array of ultrasound transducer elements, each ultrasound transducer element associated with a corresponding unit transducer cell for providing transmit and receive functions, each unit transducer cell including a cell transmit/receive switch connected to a low voltage switch matrix via a low voltage transmit path; and a plurality of microelectronic cross-point switches for switching an externally generated analog transmit signal to one or more of the low voltage transmit paths.
摘要:
A method for dynamically reconfiguring elements in an ultrasound transducer array is provided. The method includes defining two or more groups of the elements in the array, wherein each element individually comprises a first switch, and a second switch; providing boundary definitions information to the elements in the array to define boundaries for the two or more groups; and locally determining switch configuration state within the array for the first and second switch of one or more elements based on the boundary definitions. Further, a switch matrix configured to locally determine switch settings is provided. Furthermore, a system comprising an array of ultrasonic transducer subelements is provided.
摘要:
A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
摘要:
A reconfigurable linear array of sensors (e.g., optical, thermal, pressure, ultrasonic). The reconfigurability allows the size and spacing of the sensor elements to be a function of the distance from the beam center. This feature improves performance for imaging systems having a limited channel count. The improved performance, for applications in which multiple transmit focal zones are employed, arises from the ability to adjust the aperture for a particular depth.
摘要:
A scanning architecture that makes it possible to update only those ultrasonic transducer subelements of a mosaic transducer array that change from view to view. The configuration of the switch matrix is fully programmable. The switch matrix includes access switches that connect subelements to bus lines and matrix switches that connect subelements to subelements. Each subelement has a unit switch cell associated therewith, each unit switch cell comprising at least one access switch, at least one matrix switch, and addressing and control logic. Optionally, each unit switch cell also includes latches for storing the future switch states of the switches to be programmed. The switches themselves have memory for storing their current switch states.
摘要:
An integrated high-voltage switching circuit includes a switch having ON and OFF states and having a parasitic gate capacitance. The switch consists of a pair of DMOS transistors integrated back to back and having a shared gate terminal, the drains of the DMOS transistors being connected to the input and output terminals of the switch respectively. The switching circuit further includes a turn-on circuit comprising a PMOS transistor having its drain connected to the shared gate terminal of the switch via a first diode, having its source connected to a global switch gate bias voltage terminal from which the PMOS transistor draws current, and having its gate electrically coupled to a switch gate control terminal that receives a switch gate control voltage input. The switch transitions from the OFF state to the ON state in response to a first transition of the switch gate control voltage input that causes the PMOS transistor to turn on, and the switch remains in the ON state in response to a second transition of the switch gate control voltage input that causes the PMOS transistor to turn off. The DMOS transistors turn on in response to the shared gate being coupled to the switch gate bias voltage when the PMOS transistor turns on.
摘要:
A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要:
An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.