公开(公告)号：US20060139039A1

公开(公告)日：2006-06-29

申请号：US11020337

申请日：2004-12-23

Applicant: David Dutton ,  Gloria Hofler ,  Michael Nystrom

Inventor： David Dutton ,  Gloria Hofler ,  Michael Nystrom

IPC: G01R31/02

CPC classification number: G01R1/072 ,  G01R31/305 ,  G09G3/006 ,  G09G3/3208

Abstract: There is disclosed a contactless test probe using an ionized gas discharge for making electrical contact with the device under test (DUT). In one embodiment the ionized gas discharge is at or below atmospheric pressure thereby reducing the complexity of the control environment. In one embodiment, the atmospheric gas discharge, i.e. the electrical probing medium, is created and controlled by a micro-hollow cathode. In a further embodiment an extension gate is used to extend/retard the range of the high-density discharge.

Abstract translation: 公开了一种使用电离气体放电与被测器件（DUT）进行电接触的非接触式测试探针。 在一个实施例中，电离气体放电处于或低于大气压，从而降低了控制环境的复杂性。 在一个实施例中，大气气体放电，即电探测介质，由微空心阴极产生和控制。 在另一实施例中，延伸门用于延伸/延迟高密度放电的范围。

公开(公告)号：US20050112883A1

公开(公告)日：2005-05-26

申请号：US10958866

申请日：2004-10-04

Applicant: Stephen Savas ,  Songlin Xu ,  David Dutton ,  Andreas Kadavanich ,  Rene George

Inventor： Stephen Savas ,  Songlin Xu ,  David Dutton ,  Andreas Kadavanich ,  Rene George

IPC: H01L20060101 ,  H01L21/00 ,  H01L21/02 ,  H01L21/302 ,  H01L21/311 ,  H01L21/461

CPC classification number: H01L21/31138 ,  H01L21/02063 ,  H01L21/02071 ,  H01L21/67207

Abstract: In a technique for fabricating an integrated circuit to include an active device structure which supports an electrical interconnect structure, a photoresist layer is used prior to forming an electrical interconnect structure on the active device structure. The photoresist and related residues are removed by exposing the photoresist and exposed regions of the active device structure to one or more reactive species that are generated using a gas mixture including hydrogen gas, as a predominant source of the reactive species, in a plasma source such that the photoresist and residues are continuously exposed to hydrogen-based reactive species. An associated system architecture is described which provides for a substantial flow of hydrogen gas in the process chamber.

Abstract translation: 在用于制造集成电路以包括支持电互连结构的有源器件结构的技术中，在有源器件结构上形成电互连结构之前，使用光致抗蚀剂层。 通过将活性器件结构的光致抗蚀剂和暴露区域暴露于一种或多种使用包含作为反应性物质的主要来源的氢气的气体混合物在等离子体源中产生的反应性物质来除去光致抗蚀剂和相关残余物，例如 光致抗蚀剂和残留物连续暴露于基于氢的反应物种。 描述了相关联的系统架构，其提供了处理室中的大量氢气流。

公开(公告)号：US20070170371A1

公开(公告)日：2007-07-26

申请号：US11485063

申请日：2006-07-11

Applicant: David Dutton ,  Randall Urdahl ,  Arthur Schleifer ,  Karen Seward

Inventor： David Dutton ,  Randall Urdahl ,  Arthur Schleifer ,  Karen Seward

IPC: H01J27/00

CPC classification number: H01J37/32366

Abstract: Aspects of the invention include sample ionizing devices and methods of use thereof. Embodiments of the sample ionizing devices include a microplasma generation source with a plasma generation region, a sample input port for delivering a sample to the plasma generation region, and a gas flow element configured to flow gas through the microplasma generation source independently of the sample input port. The devices and methods of the invention find use in a variety of different applications, including analyte detection applications.

Abstract translation: 本发明的方面包括样品电离装置及其使用方法。 样品离子化装置的实施例包括具有等离子体产生区域的微血浆发生源，用于将样品输送到等离子体产生区域的样品输入端口以及气体流动元件，其被配置成独立于样品输入流动气体通过微血浆发生源 港口。 本发明的装置和方法可用于各种不同的应用，包括分析物检测应用。

公开(公告)号：US20070075402A1

公开(公告)日：2007-04-05

申请号：US11243569

申请日：2005-10-05

Applicant: Frank Geefay ,  David Dutton ,  Qing Bai

Inventor： Frank Geefay ,  David Dutton ,  Qing Bai

IPC: H01L29/40

CPC classification number: B81C1/00269 ,  B81C2203/019 ,  H01L23/10 ,  H01L23/3142 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the recess and extends above the surface. The second structure adheres to the first structure at a boundary of the recess.

Abstract translation: 附件系统。 附件系统包括第一结构和第二结构。 第一结构在表面具有表面和凹部。 第二结构被模制成凹槽并在表面上方延伸。 第二结构在凹槽的边界附着于第一结构。

公开(公告)号：US3955393A

公开(公告)日：1976-05-11

申请号：US523154

申请日：1974-11-12

Applicant: James Moss ,  David Dutton

Inventor： James Moss ,  David Dutton

IPC: B21C1/12 ,  C23D5/00 ,  B21C1/04

CPC classification number: B21C1/12 ,  C23D5/00

Abstract: A wire-drawing machine, suitable for use in-line with an enamelling machine, comprises a plurality of individual wire-drawing capstans mounted in individual bearings, at least one for each capstan. The capstans are arranged in a substantially planar rectangular array (comprising rows and columns of the capstans) with their axes aligned with the rows thereof. A series of parallel drive shafts, each serve all the capstans of one row or one column of the array. The capstans of one column are associated with a single wire line whereas the capstans of any one row are associated with a corresponding drawing stage for all the wires lines.

Abstract translation: 一种适于与搪瓷机一起使用的拉丝机包括安装在各个轴承中的多个单独的拉丝绞盘，至少一个用于每个绞盘。 绞盘被布置成基本上平面的矩形阵列（包括绞盘的行和列），其轴线与其行对齐。 一系列平行驱动轴，分别为阵列的一列或一列的所有绞盘提供服务。 一列的绞盘与单根线线相关联，而任何一行的绞盘与所有电线线的对应绘图级相关联。