公开(公告)号：US20100173003A1

公开(公告)日：2010-07-08

申请号：US12601686

申请日：2008-05-27

Applicant: Ashoke K. SenGupta ,  Dave Kotloski ,  Vincent J. Losacco ,  David McGregor

Inventor： Ashoke K. SenGupta ,  Dave Kotloski ,  Vincent J. Losacco ,  David McGregor

IPC: A61K9/16

CPC classification number: A61K8/26 ,  A61K8/11 ,  A61K8/19 ,  A61K8/731 ,  A61K8/737 ,  A61Q5/12 ,  A61Q11/00 ,  A61Q17/005 ,  A61Q17/04 ,  A61Q19/00 ,  A61Q19/02 ,  A61Q19/04 ,  A61Q19/06

Abstract: A benefit agent encapsulated in a particulate-based encapsulant, and a method of manufacturing the encapsulated benefit agent, are disclosed.

Abstract translation: 公开了一种封装在基于颗粒的密封剂中的有益剂，以及制造封装的有益剂的方法。

公开(公告)号：US20090104134A1

公开(公告)日：2009-04-23

申请号：US12282377

申请日：2007-06-06

Applicant: Ashoke K. SenGupta ,  David McGregor ,  Ralph Spindler ,  Kevin Cureton

Inventor： Ashoke K. SenGupta ,  David McGregor ,  Ralph Spindler ,  Kevin Cureton

IPC: A61K47/30 ,  C08K3/34 ,  C08K3/26 ,  A61Q1/04 ,  A61Q3/02 ,  A61Q17/04 ,  A61Q1/10 ,  A61Q11/00 ,  C08K3/22

CPC classification number: A61K8/11 ,  A61K8/26 ,  A61K8/37 ,  A61K8/86 ,  A61K2800/412 ,  A61Q3/02 ,  C01B33/44

Abstract: An organophilic clay for thickening hydrophobic liquids comprising a layered silicate material, surfaces of said layered silicate material modified by an amphipathic copolymer prepared from a first comonomer that generates a hydrophilic homopolymer that is essentially insoluble in a hydrophobic liquid and a second comonomer that generates a hydrophobic homopolymer that is soluble in a hydrophobic liquid, said organophilic clay containing at least 10% by weight water, based on the dry weight of the layered silicate material.

Abstract translation: 一种用于增稠疏水性液体的亲有机粘土，其包含层状硅酸盐材料，所述层状硅酸盐材料的表面由由第一共聚单体制备的两亲共聚物改性，所述两性共聚物由基本不溶于疏水性液体的亲水均聚物和产生疏水性液体的第二共聚单体制备 可溶于疏水液体的均聚物，所述有机粘土含有至少10重量％的水，基于层状硅酸盐材料的干重。

公开(公告)号：US20060138591A1

公开(公告)日：2006-06-29

申请号：US11289994

申请日：2005-11-30

Applicant: Daniel Amey ,  Sounak Banerji ,  William Borland ,  Karl Dietz ,  David McGregor ,  Attiganal Sreeram

Inventor： Daniel Amey ,  Sounak Banerji ,  William Borland ,  Karl Dietz ,  David McGregor ,  Attiganal Sreeram

IPC: H01L29/00

CPC classification number: H01L23/66 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09763 ,  H01L2224/0401

Abstract: The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor; and at least one planar capacitor laminate; wherein said planar capacitor laminate serves as a low inductance path to supply a charge to said at least one embedded singulated capacitor; and wherein said at least one embedded singulated capacitor is connected in parallel to at least one of the said planar capacitor laminates; and wherein said power core is interconnected to at least one signal layer.

Abstract translation: 本发明涉及一种包括功率核心的器件，其中所述功率核心包括：至少一个嵌入的单个电容器层，其包含至少一个嵌入式单电容器; 和至少一个平面电容器层压板; 其中所述平面电容器层叠体用作低电感路径以向所述至少一个嵌入式分离电容器提供电荷; 并且其中所述至少一个嵌入式单电容器与所述平面电容器层压体中的至少一个并联连接; 并且其中所述功率核心与至少一个信号层相互连接。

公开(公告)号：US20060082982A1

公开(公告)日：2006-04-20

申请号：US10967781

申请日：2004-10-18

Applicant: William Borland ,  G. Cox ,  David McGregor

Inventor： William Borland ,  G. Cox ,  David McGregor

IPC: H05K1/16

CPC classification number: H01C17/06533 ,  H01C7/005 ,  H01C17/06586 ,  H01G4/40 ,  H05K1/162 ,  H05K1/167 ,  H05K3/429 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09763 ,  Y10T29/49155

Abstract: A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. Conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.

Abstract translation: 电容/电阻器件提供电阻和电容功能。 电容/电阻装置可以嵌入印刷电路板的层内。 嵌入电容/电阻器件节省了电路板表面的空间，并减少了焊接连接的数量，从而提高了可靠性。 节省板表面积，减少焊接数量，提高可靠性。

公开(公告)号：US6007612A

公开(公告)日：1999-12-28

申请号：US987901

申请日：1997-12-10

Applicant: Paul Kerwin ,  David McGregor ,  John Bryce Blackburn

Inventor： Paul Kerwin ,  David McGregor ,  John Bryce Blackburn

IPC: C09C3/10 ,  C09D11/02 ,  C09D11/08

CPC classification number: C09D11/037

Abstract: The present invention provides the use of a resinated pigment in which from 10 to 100% of the resinated proportion of the product is a resin ester, as colourant in a lithographic printing ink.

Abstract translation: 本发明提供树脂颜料的用途，其中10-100％的树脂比例的产品是树脂酯，作为平版印刷油墨中的着色剂。