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公开(公告)号：US10427269B2
公开(公告)日：2019-10-01
申请号：US15478459
申请日：2017-04-04
Applicant: EBARA CORPORATION
Inventor： Makoto Kashiwagi , Michiyoshi Yamashita
Abstract: A polishing apparatus which can maintain a polishing load within an appropriate range is disclosed. The polishing apparatus includes: a pressing member for pressing a polishing tool against the substrate; an actuator configured to control a pressing force of the pressing member; a positioning member which is movable together with the pressing member; a stopper arranged to restrict movement of the pressing member and the positioning member; a stopper moving mechanism configured to move the stopper in a predetermined direction; a polishing-load detector configured to obtain a load feedback value which varies according to a polishing load applied to the pressing member; and a stopper-speed determining device configured to determine a movement speed of the stopper which can allow the load feedback value to fall within a set range.
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公开(公告)号：US20230249313A9
公开(公告)日：2023-08-10
申请号：US17099571
申请日：2020-11-16
Applicant: EBARA CORPORATION
Inventor： Yu Ishii , Hirotaka Satori , Makoto Kashiwagi , Manato Furusawa
IPC: B24B37/32 , H01L21/683
CPC classification number: B24B37/32 , H01L21/6838
Abstract: Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.
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公开(公告)号：US11335588B2
公开(公告)日：2022-05-17
申请号：US16898771
申请日：2020-06-11
Applicant: EBARA CORPORATION
Inventor： Makoto Kashiwagi
IPC: H01L21/687 , H01L21/67
Abstract: A substrate holding apparatus which can stably hold a substrate, such as a wafer, while causing the substrate to make a circular motion and rotating the substrate about its axis is disclosed. The substrate holding apparatus includes: rollers; electric motors configured to rotate the rollers; eccentric shafts arranged around a central axis; and actuators. The eccentric shafts include movable shafts and reference shafts, the actuators are coupled to the movable shafts, respectively, and the actuators are configured to move the movable shafts in a direction closer to the reference shafts and in a direction away from the reference shafts.
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公开(公告)号：US11331768B2
公开(公告)日：2022-05-17
申请号：US16222779
申请日：2018-12-17
Applicant: EBARA CORPORATION
Inventor： Makoto Kashiwagi , Fong-Jie Du , Manao Hoshina
Abstract: A polishing head having a simple construction and a compact size is disclosed. The polishing head includes: a polishing-tool pressing member for supporting a polishing tool; a movable shaft coupled to the polishing-tool pressing member; a housing which houses the movable shaft therein; and a diaphragm which forms a pressure chamber between an end portion of the movable shaft and the housing, the diaphragm including a central portion in contact with the end portion of the movable shaft, an inner wall portion connecting with the central portion and extending along a side surface of the movable shaft, a folded-back portion connecting with the inner wall portion and having a curved cross section, and an outer wall portion connecting with the folded-back portion and located outside the inner wall portion.
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公开(公告)号：USD890825S1
公开(公告)日：2020-07-21
申请号：US29676944
申请日：2019-01-16
Applicant: EBARA CORPORATION
Designer： Kenichi Kobayashi , Asagi Matsugu , Makoto Kashiwagi , Manao Hoshina
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Patent Agency Ranking
公开(公告)号：US20150000870A1
公开(公告)日：2015-01-01
申请号：US14312265
申请日：2014-06-23
Applicant: Ebara Corporation
Inventor： Kazumasa Hosotani , Makoto Kashiwagi , Toyoji Shinohara , Kohtaro Kawamura
IPC: F02C7/08
CPC classification number: F02C7/08 , B01D53/005 , B01D53/18 , B01D53/70 , B01D53/78 , B01D2252/103 , B01D2257/2045 , B01D2257/2047 , B01D2257/2066 , B01D2257/553 , B01D2258/0216 , F23G7/065 , F23J15/04 , F23J2219/40 , F28C3/06 , F28D1/0213 , F28D1/05316 , F28D7/082 , F28D7/16 , Y02P80/156
Abstract: An exhaust gas abatement system includes an exhaust gas abatement section configured to abate exhaust gases by utilizing thermal energy and to cool the abated gases by using a liquid, a circulating section configured to circulate the liquid within a circulation path as a circulating liquid, a heat exchange tube configured to cool the circulating liquid and to executes a heat exchange between a cooling liquid which flows in an interior of the heat exchange tube and the circulating liquid which flows outside the heat exchange tube, and a circulating liquid storage portion configured to store the circulating liquid. The heat exchange tube is disposed in a heat exchange tube installation space which is in at least part of an interior of the circulating liquid storage portion.
Abstract translation: 废气消除系统包括：排气消除部，其构造为通过利用热能消除废气，并且通过使用液体来冷却排出的气体;循环部，其构造成使循环路径内的液体循环为循环液;热量 配置为冷却循环液体并在流过热交换管内部的冷却液与流过热交换管的循环液体之间进行热交换的交换管;以及循环液储存部， 循环液体。 换热管设置在至少部分循环液储存部内部的热交换管安装空间内。
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17.发明授权公开(公告)号：US12237194B2
公开(公告)日：2025-02-25
申请号：US17258916
申请日：2019-07-09
Applicant: EBARA CORPORATION
Inventor： Akihiro Yazawa , Takashi Koba , Kenichi Kobayashi , Kenichi Akazawa , Fong-Jie Du , Makoto Kashiwagi , Asagi Matsugu , Takahiro Nanjo , Hideharu Aoyama , Takashi Mitsuya , Tetsuji Togawa
IPC: B24B37/14 , B24B37/26 , B24B37/30 , B65G13/02 , H01L21/304 , H01L21/677 , B24B41/06 , B24B57/02 , B65G39/04 , H01L21/67
Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.
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公开(公告)号：US11697184B2
公开(公告)日：2023-07-11
申请号：US16748606
申请日：2020-01-21
Applicant: EBARA CORPORATION
Inventor： Makoto Kashiwagi , Manao Hoshina
CPC classification number: B24B49/12 , B24B7/228 , B24B41/005 , B24B41/06
Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.
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公开(公告)号：US11511389B2
公开(公告)日：2022-11-29
申请号：US16575844
申请日：2019-09-19
Applicant: EBARA CORPORATION
Inventor： Kenichi Akazawa , Makoto Kashiwagi , Yu Ishii , Atsushi Yoshida , Kenichi Kobayashi , Tetsuji Togawa , Hozumi Yasuda
Abstract: Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.
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公开(公告)号：US11370080B2
公开(公告)日：2022-06-28
申请号：US16821281
申请日：2020-03-17
Applicant: EBARA CORPORATION
Inventor： Kenichi Kobayashi , Makoto Kashiwagi
IPC: B24B37/32
Abstract: To reduce a risk generated at a time of collision of a substrate with a retainer. According to one embodiment, a head for holding a polygonal substrate as a polishing object of a polishing apparatus is provided. The head includes a substrate holding surface configured to hold a substrate and a retainer positioned outside the substrate holding surface. The retainer has an end region. The end region is arranged adjacent to a corner portion of the substrate held onto the head. The end region has an end surface on a side of the substrate holding surface. The end surface is configured to increase in distance from the substrate holding surface with approaching an end portion in a longitudinal direction of the retainer.
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