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11.发明申请公开(公告)号：US20160075552A1
公开(公告)日：2016-03-17
申请号：US14787551
申请日：2014-03-21
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
CPC classification number: B81B7/007 , B81B7/0064 , B81B7/008 , B81B2201/0257 , B81C1/00238 , B81C1/00301 , B81C2203/0785 , H01L23/552 , H01L24/06 , H01L24/17 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/06102 , H01L2224/1403 , H01L2224/1703 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/1461 , H01L2924/00 , H01L2224/81
Abstract: A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.
Abstract translation: 可以在晶片级生产的部件具有与其连接的第一芯片和第二芯片。 （至少部分地）通过第二连接结构和第二芯片的第一和第二接触结构建立连接。 第一芯片和第一连接结构之间的适配结构使第一和第二接触结构之间的高度差相等。
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12.发明申请ENCAPSULATED COMPONENT COMPRISING A MEMS COMPONENT AND METHOD FOR THE PRODUCTION THEREOF 有权包含MEMS组件的封装组件及其生产方法公开(公告)号：US20150344296A1
公开(公告)日：2015-12-03
申请号：US14759602
申请日：2013-10-23
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
CPC classification number: B81B7/0058 , B81B7/0054 , B81B7/0061 , B81B7/007 , B81B2201/0257 , B81B2201/0264 , B81B2207/012 , B81C1/0023 , B81C1/00301 , B81C3/001 , B81C2201/034 , B81C2203/0154 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48472 , H01L2924/1461 , H01L2924/19107 , H04R23/00 , H04R2201/003 , H01L2924/00014 , H01L2924/00
Abstract: A component comprising a carrier, a chip component and a MEMS component is proposed, wherein the mechanically sensitive MEMS component is mounted below a half-shell on the carrier. The component is encapsulated with a molding compound in a transfer molding process.
Abstract translation: 提出了包括载体，芯片部件和MEMS部件的部件，其中机械敏感的MEMS部件安装在载体上的半壳下方。 该组分在传递模塑过程中用模塑料封装。
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公开(公告)号：US20170070825A1
公开(公告)日：2017-03-09
申请号：US15307814
申请日：2015-04-22
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
CPC classification number: H04R19/04 , B81B7/0048 , B81B2201/0257 , B81C1/00134 , H04R1/2892 , H04R19/005 , H04R31/00 , H04R2410/03 , H04R2499/11
Abstract: A microphone and a method for producing a microphone are disclosed. The microphone includes a substrate, a spring element plastically elongated in a direction perpendicular to the substrate, a transducer element in electrical contact with the substrate by way of the spring element and a cover to which the transducer element is fastened, the cover is arranged in such a way that the transducer element is arranged between the cover and the substrate.
Abstract translation: 公开了麦克风和麦克风的制造方法。 麦克风包括基板，沿着垂直于基板的方向塑性伸长的弹簧元件，通过弹簧元件与基板电接触的换能器元件和换能器元件紧固到的盖，盖被布置在 换能器元件布置在盖和基板之间的方式。
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公开(公告)号：US20160345106A1
公开(公告)日：2016-11-24
申请号：US15111224
申请日：2014-12-04
Applicant: EPCOS AG
Inventor： Wolfgang Pahl , Gregor Feiertag
CPC classification number: H04R19/04 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/07 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2924/10158 , H01L2924/15192 , H01L2924/16153 , H04R1/04 , H04R1/406 , H04R5/027 , H04R19/005 , H04R2201/003 , H04R2410/03 , H01L2924/00014 , H01L2924/00
Abstract: A multi-MEMS module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first MEMS chip and a second MEMS chip. The first MEMS chip is acoustically coupled to the first opening. The second MEMS chip is acoustically coupled to the second opening.
Abstract translation: 指定了可以方便生产并实现更小设计的多MEMS模块。 模块包括具有内部和第一和第二开口的壳体，第一MEMS芯片和第二MEMS芯片。 第一个MEMS芯片声耦合到第一个开口。 第二MEMS芯片声耦合到第二开口。
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公开(公告)号：US20160297671A1
公开(公告)日：2016-10-13
申请号：US14685259
申请日：2015-04-13
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
IPC: B81B7/00
CPC classification number: B81B7/0048 , B81B2201/0257 , B81B2201/0264 , B81B2207/012 , B81B2207/07 , H01L2224/16225 , H01L2224/73253 , H01L2924/15151 , H01L2924/16152
Abstract: A MEMS sensor component with a reduced sensitivity to internal or external stress and small spatial dimensions is provided. The component comprises a MEMS chip arranged in a cavity below a cap and elastically mounted to a carrier substrate by a connection element in a flip-chip configuration.
Abstract translation: 提供了对内部或外部应力和小空间尺寸的灵敏度降低的MEMS传感器部件。 该组件包括布置在盖下方的空腔中的MEMS芯片，并且通过倒装芯片配置的连接元件弹性地安装到载体基板。
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Patent Agency Ranking
公开(公告)号：US10544035B2
公开(公告)日：2020-01-28
申请号：US15302128
申请日：2015-04-23
Applicant: Epcos AG
Inventor： Wolfgang Pahl
IPC: H01L41/053 , B81B7/02 , H01L41/113
Abstract: A sensor component having a MEMS sensor and an ASIC for one sensor function each. A base element, a wall element in the form of a frame and a cover together enclose a cavity of a housing. The MEMS sensor is mounted inside the cavity on the base element of the housing. The ASIC has an active sensor surface and is mounted on or under the cover or is embedded in the cover. Electrical external contacts for the MEMS sensor and ASIC are provided on an external surface of the housing. The cavity has at least one opening or bushing.
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17.发明授权公开(公告)号：US10542630B2
公开(公告)日：2020-01-21
申请号：US15322089
申请日：2015-06-22
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
Abstract: A housing for an electric component and a method for producing a housing for an electric component are disclosed. In an embodiment the housing includes a first housing part and a second housing part, wherein the first housing part is connected to the second housing part in a joining region, and wherein the joining region is at least partially covered by a coating containing sprayed-on particles.
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公开(公告)号：US10136226B2
公开(公告)日：2018-11-20
申请号：US14653820
申请日：2012-12-18
Applicant: EPCOS AG
Inventor： Jan Tue Ravnkilde , Marcel Giesen , Kurt Rasmussen , Morten Ginnerup , Pirmin Hermann Otto Rombach , Wolfgang Pahl , Anton Leidl , Armin Schober , Jürgen Portmann
Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.
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公开(公告)号：US10117027B2
公开(公告)日：2018-10-30
申请号：US15307814
申请日：2015-04-22
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
Abstract: A microphone and a method for producing a microphone are disclosed. The microphone includes a substrate, a spring element plastically elongated in a direction perpendicular to the substrate, a transducer element in electrical contact with the substrate by way of the spring element and a cover to which the transducer element is fastened, the cover is arranged in such a way that the transducer element is arranged between the cover and the substrate.
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公开(公告)号：US10015600B2
公开(公告)日：2018-07-03
申请号：US15111224
申请日：2014-12-04
Applicant: Epcos AG
Inventor： Wolfgang Pahl , Gregor Feiertag
CPC classification number: H04R19/04 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/07 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2924/10158 , H01L2924/15192 , H01L2924/16153 , H04R1/04 , H04R1/406 , H04R5/027 , H04R19/005 , H04R2201/003 , H04R2410/03 , H01L2924/00014 , H01L2924/00
Abstract: A multi-MEMS module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first MEMS chip and a second MEMS chip. The first MEMS chip is acoustically coupled to the first opening. The second MEMS chip is acoustically coupled to the second opening.
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