Apparatus and method for managing thermally induced motion of a probe card assembly
    11.
    发明授权
    Apparatus and method for managing thermally induced motion of a probe card assembly 有权
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号:US07592821B2

    公开(公告)日:2009-09-22

    申请号:US11877466

    申请日:2007-10-23

    CPC classification number: G01R31/2874 G01R31/2863 G01R31/2889 Y10T29/5313

    Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接,并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度,并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间,使得布线基板能够相对于加强板膨胀和收缩。

    METHOD AND APPARATUS FOR ADJUSTING A MULTI-SUBSTRATE PROBE STRUCTURE
    12.
    发明申请
    METHOD AND APPARATUS FOR ADJUSTING A MULTI-SUBSTRATE PROBE STRUCTURE 失效
    用于调整多基底探针结构的方法和装置

    公开(公告)号:US20090158586A1

    公开(公告)日:2009-06-25

    申请号:US12343260

    申请日:2008-12-23

    Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

    Abstract translation: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针,并且每个探针衬底上的探针组合在一起组成一组探针,用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”,“y”和/或“z”方向,并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此,探针可以相对于要测试的装置上的触点对准和/或平坦化。

    Component assembly and alignment
    13.
    发明授权
    Component assembly and alignment 失效
    组件组装和对齐

    公开(公告)号:US07808259B2

    公开(公告)日:2010-10-05

    申请号:US11861559

    申请日:2007-09-26

    Abstract: A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

    Abstract translation: 用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。 该方法还可以包括在第一平面中约束相对于第二结构的第一结构,使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。 第二特征可以在通常平行于第一平面的第二平面中。 第一和第二结构可以是第一和第二电子部件,其可以是探针卡组件的部件。

    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY
    14.
    发明申请
    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 审中-公开
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号:US20100000080A1

    公开(公告)日:2010-01-07

    申请号:US12477748

    申请日:2009-06-03

    CPC classification number: G01R31/2874 G01R31/2863 G01R31/2889 Y10T29/5313

    Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接,并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度,并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间,使得布线基板能够相对于加强板膨胀和收缩。

    Apparatus and method for managing thermally induced motion of a probe card assembly
    15.
    发明授权
    Apparatus and method for managing thermally induced motion of a probe card assembly 有权
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号:US07285968B2

    公开(公告)日:2007-10-23

    申请号:US11306515

    申请日:2005-12-30

    CPC classification number: G01R31/2874 G01R31/2863 G01R31/2889 Y10T29/5313

    Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接,并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度,并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间,使得布线基板能够相对于加强板膨胀和收缩。

    PROBE CARD STIFFENER WITH DECOUPLING
    17.
    发明申请
    PROBE CARD STIFFENER WITH DECOUPLING 有权
    探头卡头加强器

    公开(公告)号:US20120146679A1

    公开(公告)日:2012-06-14

    申请号:US12967302

    申请日:2010-12-14

    CPC classification number: G01R1/07378 G01R31/2891

    Abstract: A stiffener for a probe card assembly can include decoupling mechanisms disposed within radial arms of the stiffener. The decoupling mechanisms can be compliant in a direction along a radial direction of said radial arm and rigid in a direction perpendicular to said radial arm. The decoupling mechanisms can decouple the stiffener from thermally induced differential radial contraction and expansion of the stiffener relative to the cardholder to which the stiffener is mounted. This can reduce thermally-induced vertical translation of the probe card assembly.

    Abstract translation: 用于探针卡组件的加强件可以包括设置在加强件的径向臂内的去耦机构。 去耦机构可以沿着所述径向臂的径向的方向并且在垂直于所述径向臂的方向上是刚性的。 解耦机构可以将加强件与加热元件相对于加强件安装到的卡座上的热引起的差分径向收缩和膨胀相分离。 这可以减少探针卡组件的热诱导垂直平移。

    STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES
    18.
    发明申请
    STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 有权
    强化装置与测试装置一起使用

    公开(公告)号:US20110128029A1

    公开(公告)日:2011-06-02

    申请号:US13022443

    申请日:2011-02-07

    CPC classification number: G01R1/07378

    Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.

    Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中,用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分,其可以包括加强件组件,该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底,所述加强件组件限制所述衬底的非平面弯曲,同时促进所述衬底相对于所述加强件组件的径向移动。

    Stiffener assembly for use with testing devices
    19.
    发明授权
    Stiffener assembly for use with testing devices 有权
    用于测试装置的加强装置

    公开(公告)号:US07884627B2

    公开(公告)日:2011-02-08

    申请号:US11860406

    申请日:2007-09-24

    CPC classification number: G01R1/07378

    Abstract: A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.

    Abstract translation: 本文提供了一种与测试装置一起使用的加强装置。 在一些实施例中,用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分,其可以包括加强件组件,该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底,所述加强件组件限制所述衬底的非平面弯曲,同时促进所述衬底相对于所述加强件组件的径向移动。

    FLEXURE BAND AND USE THEREOF IN A PROBE CARD ASSEMBLY
    20.
    发明申请
    FLEXURE BAND AND USE THEREOF IN A PROBE CARD ASSEMBLY 审中-公开
    柔性带及其在探针卡组件中的应用

    公开(公告)号:US20100264949A1

    公开(公告)日:2010-10-21

    申请号:US12423927

    申请日:2009-04-15

    Applicant: Eric D. Hobbs

    Inventor: Eric D. Hobbs

    CPC classification number: G01R31/2889 G01R31/2891

    Abstract: A flexure band can comprise structures configured to have elastic properties. Such a band can be stretched but will return generally to its original shape after forces that stretched the band are removed. The flexure band can hold one or more temperature control devices against a peripheral edge of a stiffening frame in a probe card assembly, or the flexure band can itself be a temperature control device. The band can be made of a metal that can be selected to impart one or more of the following properties: low thermal conductivity, high specific heat, generates little to no appreciable contamination, and/or usable over a wide range of temperatures. A material can be added to the band as a full or partial coating that enhances or adds one or more of the above-mentioned possible properties of the metal band.

    Abstract translation: 弯曲带可以包括构造成具有弹性特性的结构。 这样的带可以被拉伸,但是在拉伸带的力被去除之后通常将返回到其原始形状。 挠曲带可以将一个或多个温度控制装置保持在探针卡组件中的加强框架的周边边缘上,或者挠曲带本身可以是温度控制装置。 带可以由可以选择以赋予以下特性中的一种或多种的金属制成:低导热性,高比热,几乎不产生明显的污染,和/或可在宽的温度范围内使用。 可以将材料作为增强或增加金属带的上述可能性质中的一种或多种的全部或部分涂层添加到带中。

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