Abstract:
Provide is a curable composition for imprints capable of keeping a good pattern and heat resistance. A curable composition for imprints comprising a polymerizable compound (Ax-1) having maleimide structure(s), or a compound (Ax-2) having a partial structure represented by formula (I) below. Formula (I)
Abstract:
Provided are a composition for forming a pattern for imprinting, including (A) a polymerizable compound which contains an aromatic ring and does not contain a hydroxyl group, (B) a photopolymerization initiator which contains an aromatic ring and does not contain a hydroxyl group, and (C) a photopolymerization initiator which has a specific structure containing a hydroxyl group, in which a viscosity of components excluding a solvent from the composition for forming a pattern at 23° C. is 300 mPa·s or lower; a cured film to which the composition for forming a pattern is applied; a laminate; a pattern producing method; and a method for manufacturing a semiconductor element.
Abstract:
Provided are: a composition for forming an underlayer film in an imprinting method, which includes a high-molecular-weight compound having a polymerizable functional group and a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group, and in which a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.0 or less, and regarding the two crosslinking functional groups among the plurality of crosslinking functional groups, the number of atoms, which constitute a shortest atom chain mutually linking crosslinking points in the respective crosslinking functional groups, is 7 or more; a laminate including a layer formed of the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, in which a semiconductor element is manufactured using a pattern obtained by a pattern producing method.
Abstract:
An object of the present invention is to improve wettability of a curable composition for imprinting on a substrate. There is provided a novel composition for forming a primer layer for imprinting, a primer layer in which the above-described composition for forming a primer layer is used, and a laminate. Provided is a composition for forming a primer layer for imprinting which satisfies at least one of A and B. A: A component having a surface tension of greater than or equal to 40 mN/m at 25° C. is contained. B: A critical surface tension of a primer layer formed of the composition for forming a primer layer for imprinting is greater than or equal to 46 mN/m at 25° C.
Abstract:
Provided are a curable composition for imprints which is capable of both improving releasability and suppressing occurrence of waviness during etching, as well as a cured product, a pattern forming method, a lithography method, a pattern, and a lithography mask, each of which uses the curable composition for imprints. The curable composition for imprints includes a monofunctional polymerizable compound, a polyfunctional polymerizable compound containing at least one of an alicyclic structure or an aromatic ring structure and having a viscosity at 25° C. of 150 mPa·s or less, and a photopolymerization initiator, in which the monofunctional polymerizable compound is contained in an amount of 5 to 30 mass % with respect to the total polymerizable compound in the curable composition for imprints, and the cured film of the curable composition for imprints has a modulus of elasticity of 3.5 GPa or less and a glass transition temperature of 90° C. or higher.
Abstract:
Provided are a photocurable composition for imprints, having good releasability and temporal stability of the releasability, a pattern forming method, and a method for manufacturing a device.This photocurable composition for imprints includes a monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom, a bifunctional or higher polyfunctional (meth)acrylate (A2) not containing a fluorine atom, a monofunctional (meth)acrylate (B) containing a fluorine atom, and a photopolymerization initiator (C), in which the monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom has a boiling point of 100° C. to 200° C. at a pressure of 0.67 kPa, and the monofunctional (meth)acrylate (B) containing a fluorine atom has a boiling point of 100° C. to 200° C. at a pressure of 0.67 kPa.
Abstract:
Provided is a curable composition for photo imprints excellent in the mold releasability and the ink jettability. THe curable composition for photo imprints, comprising: a polymerizable compound (A); a photo-polymerization initiator (B); and a mold releasing agent (C), the mold releasing agent (C) being represented by the formula (I) below. Rf represents a C1-8 fluorine-containing alkyl group having two or more fluorine atoms; m represents 1 or 2; L represents a single bond or divalent linking group; n represents 1 or 2; X represents a single bond, oxygen atom, sulfur atom, or nitrogen atom; R1 represents a C1-8 substituent being free from a polymerizable group; R2 represents a hydrogen atom, C1-8 substituent, or divalent linking group; p represents 1 or 2, q represents 0 or 1, and r represents 1 or 2; R1 and R2 may combine with each other to form a ring.
Abstract:
Provided are: a composition for forming a pattern for imprinting, which contains a polymerizable compound, a photopolymerization initiator, and an organic halogen compound containing at least one atom selected from the group consisting of a chlorine atom, a bromine atom, and an iodine atom, in which the organic halogen compound is a compound which is stable to light of a mercury lamp, and a content of the organic halogen compound is 0.001% to 1.0% by mass with respect to a total solid content in the composition for forming a pattern; a kit including the composition for forming a pattern; a pattern producing method; a pattern; and a method for manufacturing a semiconductor element.
Abstract:
Provided are a curable composition for imprinting including a polymerizable compound, a photopolymerization initiator, and a particulate metal which has a particle diameter of 1 nm or larger, as measured by a single particle ICP-MASS method, and includes at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 100 ppt by mass to 30 ppb by mass with respect to a solid content of the composition; a method for producing the curable composition for imprinting; a cured product using the curable composition for imprinting; a pattern producing method; and a method for manufacturing a semiconductor element.
Abstract:
Provided are a composition for forming an underlayer film for imprinting, including a curable component, and a particulate metal which has a particle diameter of 10 nm or larger, as measured by a single particle ICP-MASS method, and contains at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 50 ppt by mass to 10 ppb by mass with respect to the composition; a method for producing a composition for forming an underlayer film for imprinting; a pattern producing method; a method for manufacturing a semiconductor element; a cured product; and a kit.