POLISHING COMPOSITION
    11.
    发明申请
    POLISHING COMPOSITION 有权
    抛光组合物

    公开(公告)号:US20150344738A1

    公开(公告)日:2015-12-03

    申请号:US14440208

    申请日:2013-10-29

    Abstract: [Problem] Provided is a polishing composition which is suitable for polishing a polishing object having a metal wiring layer and capable of diminishing the step defect while maintaining a high polishing rate.[Solution] Provided is a polishing composition used in polishing a polishing object having a metal wiring layer, which contains a metal corrosion inhibitor, a complexing agent, a surfactant, and water and in which the solid surface energy of the polishing object surface after polishing the polishing object using the polishing composition is 30 mN/m or less, and the surfactant is preferably an anionic surfactant.

    Abstract translation: [问题]提供一种抛光组合物,其适用于抛光具有金属布线层的抛光对象,并且能够在保持高抛光速率的同时减少台阶缺陷。 [解决方案]提供一种抛光组合物,其用于抛光具有金属布线层的抛光对象,该金属布线层含有金属腐蚀抑制剂,络合剂,表面活性剂和水,并且其中抛光后抛光对象表面的固体表面能 使用研磨用组合物的研磨对象为30mN / m以下,表面活性剂优选为阴离子表面活性剂。

    POLISHING COMPOSITION
    15.
    发明申请

    公开(公告)号:US20200308449A1

    公开(公告)日:2020-10-01

    申请号:US16797177

    申请日:2020-02-21

    Abstract: An object of the present invention is to provide a new polishing composition that contributes to improving the quality of a device.There is provided a polishing composition containing: an abrasive grain having an organic acid immobilized on a surface thereof; a first water-soluble polymer having a sulfonic acid group or a group having a salt thereof, or a carboxyl group or a group having a salt thereof; a second water-soluble polymer different from the first water-soluble polymer; a nonionic surfactant; and an aqueous carrier, wherein the polishing composition is used for polishing an object to be polished.

    POLISHING COMPOSITION
    16.
    发明申请

    公开(公告)号:US20200299543A1

    公开(公告)日:2020-09-24

    申请号:US16086191

    申请日:2017-03-09

    Inventor: Yasuto ISHIDA

    Abstract: Provided is a polishing composition which can sufficiently remove defects remaining on the surface of a polished object and which can make the polishing speeds of the respective materials substantially equal to each other when polishing the object to be polished containing a plurality of materials.A polishing composition used for polishing an object to be polished containing a material having a silicon-silicon bond, a material having a silicon-nitrogen bond, and a material having a silicon-oxygen bond, the polishing composition including: organic acid surface-immobilized silica particles; a wetting agent; and a polishing speed inhibitor for the material having a silicon-silicon bond, wherein the polishing composition has a pH of less than 7.

Patent Agency Ranking