Abstract:
A structure for the protection of a high-voltage pad includes a lateral bipolar transistor, an N-type diffusion of which, connected to the pad to be protected, is made in an N-type tub with a zone that extends laterally outside the tub in the base. A P-type implantation is made on the entire substrate outside the N-type tub except in the region in which the zone extends.
Abstract:
An integrated circuit chip formed inside and on top of a semiconductor substrate and including: in the upper portion of the substrate, an active portion in which components are formed; and under the active portion and at a depth ranging between 5 and 50 μm from the upper surface of the substrate, an area comprising sites for gettering metal impurities and containing metal atoms at a concentration ranging between 1017 and 1018 atoms/cm3.
Abstract:
A method for protecting a key used, by an electronic circuit, in a symmetrical algorithm for ciphering or deciphering a message, including the steps of complementing to one the key and the message; executing the algorithm twice, respectively with the key and the message and with the key and the message complemented to one, the selection between that of the executions which processes the key and the message and that which processes the key and the message complemented to one being random; and checking the consistency between the two executions.
Abstract:
A circuit for detecting attacks by contacting an integrated circuit chip comprising means for applying a random signal to a first terminal of at least one conductive path formed in at least one first metallization level of the chip, means for comparing the applied signal with a signal present on a second terminal of the path, and means for delaying the comparison time with respect to the application time, of a duration longer than or equal to the propagation delay through the first path.
Abstract:
A random signal generator uses a folded MOS transistor, whose drain-source current includes a random component, as an electronic noise source. The random signal generator generates a random binary signal from the random component. The invention may be applied, in particular, to smart cards.
Abstract:
An integrated temperature sensor delivers threshold detection signals when temperature thresholds have been exceeded. The temperature sensor includes a circuit for detecting a first temperature threshold having a first detection threshold, and for detecting a second temperature threshold having a second detection threshold. The circuit also detects a third temperature threshold between the first and second temperature thresholds, and detects a fourth temperature threshold between the first and second temperature thresholds. The third temperature threshold has a third detection threshold linked with the first detection threshold so that a deviation of the first detection threshold causes a corresponding deviation of the third detection threshold. Similarly, the fourth temperature has a fourth detection threshold linked with the second detection threshold so that a deviation of the second detection threshold causes a corresponding deviation of the fourth detection threshold. The third and fourth temperature thresholds define a temperature window to test the temperature sensor for detecting a deviation of the first and second detection thresholds.
Abstract:
A memory cell in an integrated circuit using CMOS technology includes the following in series: an N type selection MOS transistor and a PN semiconductor junction. The source of the transistor is connected to the N type zone of the junction by a metal contact made on at least a part of the N type zone. The method of control includes, in the programming mode, the application to the integrated circuit of a level of supply voltage greater than a nominal value, within an upper limit that is permissible for the integrated circuit, and the application of this level to the drain and the gate of the selection transistor. The selection transistor is made with a channel having a length smaller than or equal to the minimum length in the technology considered. Accordingly, the selection transistor is biased in the snap-back mode. The memory cell may be used in a memory circuit in matrix form.
Abstract:
The component comprises a first memory (MM) comprising a first portion (P1) having a content modified with a first modification entity (K1) and a second portion (P2) having a content modified with a second entity (K2), a storage means (MS) configured to store the first entity (K1) secretly, a non-volatile memory (NVM) storing an item of entity information representative of the second entity (K2) in a location (END) designated by a first indication (INDK2) contained in the said first portion of the first memory.
Abstract:
An integrated circuit including a substrate of a semiconductor material and first metal portions of a first metallization level or of a first via level defining pixels of an image. The pixels are distributed in first pixels, for each of which the first metal portion is connected to the substrate, and in second pixels, for each of which the first metal portion is separated from the substrate by at least one insulating portion.
Abstract:
The disclosure relates to a method of fabricating an integrated circuit on a semiconductor chip, the method comprising: designing an architecture of the integrated circuit comprising at least first and second standard cells implementing a same basic function; designing for the standard cell at least first and second cell layouts presenting random differences; designing an integrated circuit layout corresponding to the integrated circuit architecture; fabricating the integrated circuit according to the integrated circuit layout; using the first cell layout to implement the first standard cell in the integrated circuit layout; and using the second cell layout to implement the second standard cell in the integrated circuit layout. The method can be used for protection of an integrated circuit against reverse engineering.