公开(公告)号：US20230073958A1

公开(公告)日：2023-03-09

申请号：US18055576

申请日：2022-11-15

Applicant: GlobalFoundries U.S. Inc.

Inventor： Michal Rakowski ,  Petar I. Todorov ,  Yusheng Bian ,  Won Suk Lee ,  Asif J. Chowdhury ,  Kenneth J. Giewont

IPC: G02B6/125 ,  G02F1/01

Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide. Thus, the heating element is usable for thermally tuning the closed-curve waveguide via the closed-curve thermal coupler to minimize any temperature-dependent resonance shift (TDRS).

公开(公告)号：US11543606B2

公开(公告)日：2023-01-03

申请号：US17196428

申请日：2021-03-09

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Frank Kuechenmeister ,  John J. Ellis-Monaghan ,  Michal Rakowski

IPC: G02B6/42 ,  G02B6/122 ,  G02B6/13 ,  F21V8/00

Abstract: Structures including an edge coupler and a crackstop, as well as methods of forming a structure including an edge coupler and a crackstop. A waveguide core and a crackstop are located over a top surface of a dielectric layer. A communication passageway is either optically coupled or electrically coupled to the waveguide core. The communication passageway, which may include an electric conductor or a buried waveguide core, extends laterally beneath the crackstop.

公开(公告)号：US20220252910A1

公开(公告)日：2022-08-11

申请号：US17170237

申请日：2021-02-08

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Michal Rakowski ,  Abdelsalam Aboketaf ,  Kevin K. Dezfulian ,  Massimo Sorbara

IPC: G02F1/025 ,  G02F1/015

Abstract: Structures for an optical power modulator and methods of fabricating a structure for an optical power modulator. A first waveguide core includes first and second sections. A second waveguide core includes a first section laterally adjacent to the first section of the first waveguide core and a second section laterally adjacent to the second section of the first waveguide core. An interconnect structure is formed over the first waveguide core and the second waveguide core. The interconnect structure includes first and second transmission lines. The first transmission line is physically connected within the interconnect structure to the first section of the first waveguide core. The second transmission line includes a first section physically connected within the interconnect structure to the second section of the first waveguide core and a second section adjacent to the first transmission line.

公开(公告)号：US20220244457A1

公开(公告)日：2022-08-04

申请号：US17162303

申请日：2021-01-29

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Alec Hammond ,  Yusheng Bian ,  Michal Rakowski ,  Won Suk Lee ,  Asif J. Chowdhury ,  Roderick A. Augur

IPC: G02B6/124 ,  G02B6/13

Abstract: Structures including a grating coupler and methods of forming a structure that includes a grating coupler. The grating coupler includes segments that are spaced along a longitudinal axis. Each segment is inclined relative to the longitudinal axis. Each segment includes a first curved section having a first curvature and a second curved section having a second curvature that is inverted relative to the first curvature.

公开(公告)号：US20220187676A1

公开(公告)日：2022-06-16

申请号：US17119042

申请日：2020-12-11

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Michal Rakowski ,  Yusheng Bian ,  Won Suk Lee ,  Roderick A. Augur

IPC: G02F1/225

Abstract: Embodiments of the disclosure provide an optical ring modulator. The optical ring modulator includes waveguide with a first semiconductor material of a first doping type, and a second semiconductor material having a second doping type adjacent the first semiconductor material. A P-N junction is between the first semiconductor material and the second semiconductor material. A plurality of photonic crystal layers, each embedded within the first semiconductor material or the second semiconductor material, has an upper surface that is substantially coplanar with an upper surface of the waveguide structure.

公开(公告)号：US11243350B2

公开(公告)日：2022-02-08

申请号：US16817582

申请日：2020-03-12

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Yusheng Bian ,  Bo Peng ,  Michal Rakowski

IPC: G02B6/122 ,  G02B6/12

Abstract: The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to semiconductor devices having a reflector and a photonic component and a method of forming the same. The present disclosure provides a semiconductor device having a substrate, a photonic component arranged above the substrate, a bottom reflector arranged above the substrate and positioned below the photonic component, in which the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component, and a top reflector arranged above the photonic component, in which the top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.

公开(公告)号：US11002916B1

公开(公告)日：2021-05-11

申请号：US16682502

申请日：2019-11-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Ajey Poovannummoottil Jacob ,  Michal Rakowski ,  Bo Peng

IPC: G02B6/34

Abstract: Structures including a grating coupler and methods of fabricating such structures. The structure includes a waveguide core, a bend, and a grating coupler coupled to the waveguide core by the bend. The grating coupler includes grating structures that are positioned with a spaced relationship in a layer stack above the bend.

公开(公告)号：US12222589B2

公开(公告)日：2025-02-11

申请号：US17729031

申请日：2022-04-26

Applicant: GlobalFoundries U.S. Inc.

Inventor： Michal Rakowski ,  Vaibhav A. Ruparelia ,  Riddhi Nandi ,  Prateek K. Sharma ,  Avijit Chatterjee ,  Vasudeva Reddy KuppiReddy ,  Indranil Som

IPC: G02B6/293 ,  G02B6/12 ,  G02F1/01 ,  H01S3/083

Abstract: Disclosed is a thermal stabilization circuit including a heater, which is adjacent and thermally coupled to a closed-curve waveguide of an optical ring resonator, and an analog feedback circuit, which includes a fully autonomous analog feedback loop from a drop port of a bus waveguide of the optical ring resonator to the heater. This analog feedback circuit is configured to dynamically control the electrical power provided to the heater and, thereby to dynamically control the thermal output of the heater in order to tune the ring resonance wavelength to the operating laser wavelength. The analog feedback circuit is further configured to be independent of input power, to be power efficient, to have a relatively small footprint, to have a tunable time constant and to facilitate adjustable wavelength locking. Also disclosed is a device (e.g., a ring-based transceiver or the like), which includes multiple optical ring resonators and corresponding thermal stabilization circuits.

公开(公告)号：US11803012B2

公开(公告)日：2023-10-31

申请号：US18055576

申请日：2022-11-15

Applicant: GlobalFoundries U.S. Inc.

Inventor： Michal Rakowski ,  Petar I. Todorov ,  Yusheng Bian ,  Won Suk Lee ,  Asif J. Chowdhury ,  Kenneth J. Giewont

IPC: G02B6/125 ,  G02F1/01 ,  G02B6/136 ,  G02B6/12

CPC classification number: G02B6/125 ,  G02F1/0147 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12147

Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide. Thus, the heating element is usable for thermally tuning the closed-curve waveguide via the closed-curve thermal coupler to minimize any temperature-dependent resonance shift (TDRS).

公开(公告)号：US20220308297A1

公开(公告)日：2022-09-29

申请号：US17209416

申请日：2021-03-23

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  John J. Ellis-Monaghan ,  Frank G. Kuechenmeister ,  Jae Kyu Cho ,  Michal Rakowski

IPC: G02B6/42 ,  H01L23/00

Abstract: Embodiments of the disclosure provide a photonic integrated circuit (PIC) structure with a passage for a waveguide through a barrier structure. The PIC structure includes a barrier structure on a substrate, having a first sidewall and a second sidewall opposite the first sidewall. A passage is within the barrier structure, and extends from a first end at the first sidewall of the barrier structure to a second end at the second sidewall of the barrier structure. A shape of the passage includes a reversal segment between the first end and the second end. A waveguide within the passage and extends from the first end to the second end of the barrier structure.