公开(公告)号：US20240154384A1

公开(公告)日：2024-05-09

申请号：US17982606

申请日：2022-11-08

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Koushik Ramachandran ,  Yusheng Bian

IPC: H01S5/0236 ,  H01S5/02251 ,  H01S5/024

CPC classification number: H01S5/0236 ,  H01S5/02251 ,  H01S5/024

Abstract: Structures for a cavity-mounted chip and methods of fabricating a structure for a cavity-mounted chip. The structure comprises a laser chip including a body attached to a substrate. The laser chip has an output, and the body of the laser chip has a bottom surface spaced from the substrate by a gap. The structure further comprises a first adhesive in the first gap and a second adhesive positioned in the first gap between the first adhesive and the output of the laser chip. The first adhesive has a first thermal conductivity, the second adhesive has a second thermal conductivity, and the first thermal conductivity of the first adhesive is greater than the second thermal conductivity of the second adhesive.

公开(公告)号：US12265048B2

公开(公告)日：2025-04-01

申请号：US18058349

申请日：2022-11-23

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu

IPC: G01N27/22 ,  G02B6/12

Abstract: An integrated circuit (IC) structure includes a substrate; and a plurality of moisture sensors along an edge of an optical input/output (I/O) opening in the substrate. The plurality of moisture sensors are positioned between a primary guard ring and a moisture barrier. The moisture sensors may detect moisture in a sequential manner to monitor moisture ingress and predict when remedial action is necessary. The teachings of the disclosure may be applicable to any IC structure including an I/O opening, and in particular, IC structures that have elongated I/O openings such as photonic integrated structures (PICs) with optical I/O openings for photonics components, e.g., an optical fiber or an external laser. The moisture sensors provide an early and definitive alarm for moisture, with no false alarms. The system accurately predicts time to failure and allows adjustment based on real time field data input.

公开(公告)号：US20240347652A1

公开(公告)日：2024-10-17

申请号：US18134100

申请日：2023-04-13

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Yusheng Bian ,  Judson R. Holt

IPC: H01L31/0232 ,  H01L31/0224 ,  H01L31/18

CPC classification number: H01L31/02327 ,  H01L31/022408 ,  H01L31/1808

Abstract: Structures including a photodetector and methods of forming a structure including a photodetector. The structure comprises a semiconductor layer comprising a crystalline semiconductor material, a waveguide core including a first sidewall and a second sidewall, and a photodetector including a light-absorbing layer, an anode, and a cathode. The light-absorbing layer includes a first portion and a second portion that are disposed on the semiconductor layer. The first portion of the light-absorbing layer is adjacent to the first sidewall of the waveguide core, and the second portion of the light-absorbing layer is adjacent to the second sidewall of the waveguide core.

公开(公告)号：US20240264374A1

公开(公告)日：2024-08-08

申请号：US18105304

申请日：2023-02-03

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu

IPC: G02B6/122 ,  G02B6/136 ,  H01L23/38 ,  H01L23/48

CPC classification number: G02B6/1228 ,  G02B6/136 ,  H01L23/38 ,  H01L23/481 ,  G02B2006/12121

Abstract: Structures for a cavity-mounted chip and methods of fabricating a structure for a cavity-mounted chip. The structure comprises a substrate including a cavity, a thermoelectric device inside the cavity, and a chip disposed inside the cavity adjacent to the thermoelectric device. The thermoelectric device includes a first plurality of pillars and a second plurality of pillars that alternate with the first plurality of pillars in a series circuit, the first plurality of pillars comprising an n-type semiconductor material, and the second plurality of pillars comprising a p-type semiconductor material.

公开(公告)号：US20240103237A1

公开(公告)日：2024-03-28

申请号：US17933199

申请日：2022-09-19

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Seungman Choi

IPC: G02B6/42

CPC classification number: G02B6/423 ,  G02B6/4206 ,  G02B6/424 ,  G02B6/4274

Abstract: A photonic integrated circuit (PIC) structure includes a substrate, and a cavity defined in the substrate, the cavity including a shoulder at a side of the cavity. A plurality of z-stop supports for an optical device are also included. Each z-stop support of the plurality of z-stop supports is on a support portion of the shoulder. A wire extends over the side of the cavity and between at least two z-stop supports of the plurality of z-stop supports. An optical device is positioned on the plurality of z-stop supports in the cavity and electrically coupled to the wire. Electrical connections between z-stop supports allows larger sized electrical connections to the optical device to mitigate electromigration issues, and increased options for electrical connections.

公开(公告)号：US11587888B2

公开(公告)日：2023-02-21

申请号：US16713709

申请日：2019-12-13

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Asli Sahin ,  Thomas F. Houghton ,  Jennifer A. Oakley ,  Jeremy S. Alderman ,  Karen A. Nummy ,  Zhuojie Wu

IPC: G02B6/42 ,  H01L23/00 ,  G02B6/12

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.

公开(公告)号：US20210356684A1

公开(公告)日：2021-11-18

申请号：US15930876

申请日：2020-05-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Zhuojie Wu ,  Bo Peng

IPC: G02B6/42 ,  G02B6/293 ,  G02B6/43 ,  G01J3/18

Abstract: Structures for a photonics chip, testing methods for a photonics chip, and methods of forming a structure for a photonics chip. A photonics chip includes a first waveguide, a second waveguide, an optical tap coupling the first waveguide to the second waveguide, and a photodetector coupled to the second waveguide. A laser is attached to the photonics chip. The laser is configured to generate laser light directed by the first waveguide to the optical tap.

公开(公告)号：US20240280632A1

公开(公告)日：2024-08-22

申请号：US18172488

申请日：2023-02-22

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu ,  Yunyao Jiang

IPC: G01R31/28 ,  G02B6/12

CPC classification number: G01R31/2884 ,  G02B6/12004

Abstract: A structure provides a defect sensor for a cavity in an integrated circuit (IC). The structure includes a cavity defined in a substrate. A boundary is located where the cavity meets with a cavity-free area of the substrate. A metal line is arranged in a serpentine path in both a vertical and a horizontal direction and crosses the boundary. A controller may be provided that is configured to, in response to a change in an electrical characteristic of a signal through the metal line, generate an indication of the presence of a defect and/or change operation of at least one component of the IC. The structure may find application relative to a photonics integrated circuit (PIC) structure including an optical waveguide with a cavity under the optical waveguide.

公开(公告)号：US20240243078A1

公开(公告)日：2024-07-18

申请号：US18154143

申请日：2023-01-13

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu

IPC: H01L23/00 ,  G02B6/122 ,  G02B6/30 ,  G02B6/36 ,  H01L23/58

CPC classification number: H01L23/564 ,  G02B6/122 ,  G02B6/30 ,  G02B6/3652 ,  H01L23/585 ,  G02B2006/12166

Abstract: A structure includes an integrated circuit chip in a substrate, and an I/O opening extending inwardly from an edge of the integrated circuit chip. A dielectric moisture barrier includes a first portion extending along a side of the I/O opening, a second portion extending along the edge of the integrated circuit chip, and a third portion coupling the first moisture barrier portion to the second moisture barrier portion to complete the moisture barrier between the edge of the integrated circuit chip and the I/O opening. The third portion is distanced from the corner of the integrated circuit chip where the I/O opening meets the edge of the chip to prevent damage to the moisture barrier from fabrication processes, such as chip dicing, chip handling or other processes. Various crack stop configurations are also provided to further protect the moisture barrier from damage.

公开(公告)号：US20240167974A1

公开(公告)日：2024-05-23

申请号：US18058349

申请日：2022-11-23

Applicant: GlobalFoundries U.S. Inc.

Inventor： Zhuojie Wu

IPC: G01N27/22 ,  G02B6/12

CPC classification number: G01N27/223 ,  G02B6/12004 ,  G02B2006/12138

Abstract: An integrated circuit (IC) structure includes a substrate; and a plurality of moisture sensors along an edge of an optical input/output (I/O) opening in the substrate. The plurality of moisture sensors are positioned between a primary guard ring and a moisture barrier. The moisture sensors may detect moisture in a sequential manner to monitor moisture ingress and predict when remedial action is necessary. The teachings of the disclosure may be applicable to any IC structure including an I/O opening, and in particular, IC structures that have elongated I/O openings such as photonic integrated structures (PICs) with optical I/O openings for photonics components, e.g., an optical fiber or an external laser. The moisture sensors provide an early and definitive alarm for moisture, with no false alarms. The system accurately predicts time to failure and allows adjustment based on real time field data input.