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11.发明授权
公开(公告)号：US5882455A
公开(公告)日：1999-03-16
申请号：US937190
申请日：1997-09-25
CPC分类号： B32B37/18 , B32B37/26 , H01L21/4807 , H05K3/4629 , B32B2315/02 , H05K1/0306 , H05K2203/068 , H05K2203/074
摘要： Disclosed is an apparatus for laminating a plurality of ceramic greensheets which includes a frame, a bottom plate at one end of the frame, a punch at a second end of the frame, and a non-metallic pad within the frame and between the bottom plate and punch. In operation, a plurality of ceramic greensheets are placed within the frame, the non-metallic pad is placed underneath of, or on top of, the plurality of ceramic greensheets, and pressure is applied to the non-metallic pad and the plurality of ceramic greensheets wherein the non-metallic pad causes the lamination pressure to be uniformly distributed across the plurality of ceramic greensheets. Also disclosed is a method for laminating a plurality of ceramic greensheets using the non-metallic pad.
摘要翻译： 公开了一种用于层叠多个陶瓷片材的装置，其包括框架，框架的一端处的底板，框架的第二端处的冲头和框架内的非金属垫片以及底板之间的非金属垫片 和打孔。 在操作中，将多个陶瓷刮板放置在框架内，将非金属垫放置在多个陶瓷刮板的下方或顶部，并且将压力施加到非金属垫和多个陶瓷 其中非金属垫使得层压压力均匀地分布在多个陶瓷刮板上。 还公开了使用非金属垫层压多个陶瓷片材的方法。
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公开(公告)号：US07536870B2
公开(公告)日：2009-05-26
申请号：US11308504
申请日：2006-03-30
IPC分类号： F28D5/00
CPC分类号： H01L23/4735 , F28F3/12 , F28F13/02 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.
摘要翻译： 一种用于热控制的分配设备，系统和方法，其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征，以增强组件的冷却能力。 板的预定表面特征延迟了撞击板表面的流体的速度衰减，同时还增加了暴露于冲击液体的板的表面积，这进而使整体的可靠性和热性能最大化 热系统在给定的最大工作压力。
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公开(公告)号：US07708856B2
公开(公告)日：2010-05-04
申请号：US10595550
申请日：2003-12-05
CPC分类号： B32B18/00 , C04B35/645 , C04B2237/32 , C04B2237/343 , C04B2237/366 , C04B2237/561 , C04B2237/562 , C04B2237/565 , C04B2237/567 , C04B2237/62 , C04B2237/64 , C04B2237/66 , C04B2237/702 , H01L21/4857 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K2201/09781 , Y10T156/108 , Y10T428/24926
摘要： A method to control the post sinter distortion of hot pressing sintered multilayer ceramic laminate by placing a non-densifying structure in the green ceramic laminate prior to sintering. One or more non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the non-densifying structure will control the dimensions of the hot pressed multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the non-densifying structure in the kerf area between the individual product ups prior to sintering.
摘要翻译： 一种通过在烧结之前在生坯陶瓷层压板中放置非致密化结构来控制热压烧结多层陶瓷层压体的烧结后变形的方法。 将一个或多个非致密结构放置在一个或多个陶瓷刮板上，然后将其堆叠并层压以形成生坯陶瓷层压板。 然后将层压体烧结，并且非致密化结构将控制热压多层陶瓷基板的尺寸。 该方法可用于控制通过在烧结之前将非致密化结构放置在各个产品之间的切口区域中，将MLC衬底中的烧结后尺寸制作为单层或多层衬底。
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公开(公告)号：US20090095444A1
公开(公告)日：2009-04-16
申请号：US12338092
申请日：2008-12-18
IPC分类号： F28F7/00
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.
摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体，并在垂直于目标表面的方向上去除废热流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。
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15.发明授权Method and structure to reduce low force pin pull failures in ceramic substrates 失效降低陶瓷衬底中低引脚拉拔故障的方法和结构公开(公告)号：US06284079B1
公开(公告)日：2001-09-04
申请号：US09261344
申请日：1999-03-03
IPC分类号： B32B3126
CPC分类号： H05K3/381 , H01L21/481 , H01L21/4853 , H05K1/0306 , H05K3/4629 , Y10T156/1023 , Y10T428/24917 , Y10T428/24926
摘要： The surface metallurgy of a green sheet may be controlled during processing to provide an increased resistance to low strength structural failure of the metal-ceramic interface under an input-output pad structure and increased pin-pull strength of input-output pads on alumina multilayer ceramic substrates. The surface area on a green sheet in the region where an input-output pad is to be screened is roughened in order to increase the contact surface area between the green sheet and the input-output pad. The mechanical interlock between the metal-ceramic interface is strengthened by the increased number of bonding points between the green sheet and the input-output metallurgy and the use of different screening materials.
摘要翻译： 可以在处理期间控制生片的表面冶金，以在输入 - 输出焊盘结构下提供对金属 - 陶瓷界面的低强度结构故障的增加的阻力，并且增加氧化铝多层陶瓷上的输入 - 输出焊盘的引脚强度 底物。 为了增加生片与输入输出垫之间的接触面积，粗筛在要输出输出垫的区域中的生片上的表面积变粗糙。 金属 - 陶瓷界面之间的机械互锁通过生片和投入产出冶金之间的粘合点数量的增加以及使用不同的筛选材料得到加强。
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公开(公告)号：US07802442B2
公开(公告)日：2010-09-28
申请号：US12182304
申请日：2008-07-30
IPC分类号： F25D23/12
CPC分类号： H01L23/4735 , F28F3/12 , F28F13/02 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.
摘要翻译： 一种用于热控制的分配设备，系统和方法，其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征，以增强组件的冷却能力。 板的预定表面特征延迟了撞击板表面的流体的速度衰减，同时还增加了暴露于冲击液体的板的表面积，这进而使整体的可靠性和热性能最大化 热系统在给定的最大工作压力。
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公开(公告)号：US07684194B2
公开(公告)日：2010-03-23
申请号：US12132882
申请日：2008-06-04
CPC分类号： H01L23/473 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.
摘要翻译： 提供了通过在将电子设备与散热器分隔开的间隙中的增强的热传导来冷却电子设备的系统和方法。 在一个实施例中，用于冷却电子设备的系统包括：通过间隙与集成电路隔开的散热器; 以及配置成将包含雾化液体和载气的混合物供给到所述间隙的起泡器和雾化器。
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18.发明授权Method and structure to reduce low force pin pull failures in ceramic substrates 失效降低陶瓷衬底中低引脚拉拔故障的方法和结构公开(公告)号：US06416849B2
公开(公告)日：2002-07-09
申请号：US09871083
申请日：2001-05-31
IPC分类号： B32B300
CPC分类号： H05K3/381 , H01L21/481 , H01L21/4853 , H05K1/0306 , H05K3/4629 , Y10T156/1023 , Y10T428/24917 , Y10T428/24926
摘要： The surface metallurgy of a green sheet may be controlled during processing to provide an increased resistance to low strength structural failure of the metal-ceramic interface under an input-output pad structure and increased pin-pull strength of input-output pads on alumina multilayer ceramic substrates. The surface area on a green sheet in the region where an input-output pad is to be screened is roughened in order to increase the contact surface area between the green sheet and the input-output pad. The mechanical interlock between the metal-ceramic interface is strengthened by the increased number of bonding points between the green sheet and the input-output metallurgy and the use of different screening materials.
摘要翻译： 可以在处理期间控制生片的表面冶金，以在输入 - 输出焊盘结构下提供对金属 - 陶瓷界面的低强度结构故障的增加的阻力，并且增加氧化铝多层陶瓷上的输入 - 输出焊盘的引脚强度 底物。 为了增加生片与输入输出垫之间的接触面积，粗筛在要输出输出垫的区域中的生片上的表面积变粗糙。 金属 - 陶瓷界面之间的机械互锁通过生片和投入产出冶金之间的粘合点数量的增加以及使用不同的筛选材料得到加强。
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公开(公告)号：US07992627B2
公开(公告)日：2011-08-09
申请号：US12338092
申请日：2008-12-18
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.
摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体并在与目标表面正交的方向上去除用过的热的流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。
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公开(公告)号：US20100200197A1
公开(公告)日：2010-08-12
申请号：US12698430
申请日：2010-02-02
IPC分类号： H01L23/473 , F28D15/00 , F28D11/06 , H01L23/433
CPC分类号： H01L23/4735 , F28D15/00 , F28F13/00 , F28F2013/006 , H01L23/3733 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.
摘要翻译： 本发明提供一种散热器及其使用方法，用于冷却集成电路（IC）芯片。 散热器包括歧管块，充满液体的冷却系统和固定到歧管块的柔性箔，并且由闭环冷却系统中的液体支撑。 由箔片后面的液体提供的压力导致箔片弯曲并符合IC芯片表面中的非平面性，从而减少了气隙并增加了IC芯片与散热片之间的热耦合。
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