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    Additive manufactured resistivity
    13.
    发明授权
    Additive manufactured resistivity 有权

    公开(公告)号：US11465360B2

    公开(公告)日：2022-10-11

    申请号：US16607536

    申请日：2018-04-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Greg Scott Long ,  Jake Wright ,  Phil D Matlock ,  David L Erickson

    IPC: B33Y50/02 ,  B29C64/393 ,  B33Y80/00 ,  B29C64/165 ,  B29C64/205 ,  B33Y10/00 ,  B33Y30/00 ,  B29L31/34

    Abstract: Some examples include an additive manufacturing build object including an electrical component and a build object body. The electrical component having a varying electrical resistivity within a resistivity range of 109 ohms per square to 105 ohms per square, the resistivity range obtained by an application and fusing of a fusing component of a printing agent and build material, the printing agent applied to the build material at a predetermined saturation dosage range corresponding to the resistivity range. The build object body having a second electrical resistivity obtained by an application and fusing of the fusing component of the printing agent and the build material, the printing agent applied at a dosage below the predetermined saturation dosage range, the build object body being electrically non-conductive.

    Additive manufacturing object conductivity
    14.
    发明授权
    Additive manufacturing object conductivity 有权

    公开(公告)号：US11440247B2

    公开(公告)日：2022-09-13

    申请号：US16605064

    申请日：2018-01-31

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Greg Scott Long ,  Phil D Matlock ,  Jake Wright ,  David L Erickson

    IPC: B29C64/165 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y70/00

    Abstract: Some examples include an additive manufacturing method for controlling electrostatic discharge of a build object. The method includes receiving data related to a build object, the data including conductivity data, selectively depositing a first portion of a printing agent onto a build material layer in a pattern of an object layer of a build object, the printing agent being electrically conductive at a predetermined dosage, the first portion deposited at less than the predetermined dosage, selectively depositing a second portion of the printing agent onto the build material layer at an area of the pattern, the printing agent at the area deposited at or above the predetermined dosage, and applying fusing energy to form the object layer, the object layer of the build object including a shell formed at the area and a core, the shell being electrically conductive and the core being electrically non-conductive.

    ADDITIVE MANUFACTURED RESISTIVITY
    15.
    发明申请
    ADDITIVE MANUFACTURED RESISTIVITY 有权

    公开(公告)号：US20210331408A1

    公开(公告)日：2021-10-28

    申请号：US16607536

    申请日：2018-04-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Greg Scott Long ,  Jake Wright ,  Phil D Matlock ,  David L Erickson

    IPC: B29C64/393 ,  B29C64/205 ,  B29C64/165 ,  B33Y50/02 ,  B33Y80/00

    Abstract: Some examples include an additive manufacturing build object including an electrical component and a build object body. The electrical component having a varying electrical resistivity within a resistivity range of 109 ohms per square to 105 ohms per square, the resistivity range obtained by an application and fusing of a fusing component of a printing agent and build material, the printing agent applied to the build material at a predetermined saturation dosage range corresponding to the resistivity range. The build object body having a second electrical resistivity obtained by an application and fusing of the fusing component of the printing agent and the build material, the printing agent applied at a dosage below the predetermined saturation dosage range, the build object body being electrically non-conductive.

    Fluid property sensing with electrodes
    17.
    发明授权
    Fluid property sensing with electrodes 有权

    公开(公告)号：US11009383B2

    公开(公告)日：2021-05-18

    申请号：US16092572

    申请日：2016-04-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Michael W. Cumbie ,  Chien-Hua Chen ,  Greg Scott Long

    IPC: G01F23/26 ,  B41J2/195 ,  B41J2/175 ,  G01N27/22 ,  G01N33/32 ,  G01F23/24

    Abstract: In one example in accordance with the present disclosure a fluid property sensing device is described. The fluid property sensing device includes a substrate having a trench formed therein. The trench includes a bottom surface and opposite side surfaces. A first electrode is disposed on a first side surface of the trench and a second electrode is disposed on a second side surface of the trench. The first electrode and second electrode form a capacitor to measure a complex impedance of a fluid that fills a space between the first electrode and the second electrode. This complex impedance indicates a property of the fluid. A fluid level sensing die, having a number of fluid level sensing components disposed thereon, may be attached to the substrate, preferably in such a way that the fluid level sensing die is surrounded by the trench. In this way the surface area of the electrodes provided in the trench can be increased. The number of level sensing components may be thermal sensing components.

    FLUID PROPERTY SENSING WITH ELECTRODES
    18.
    发明申请
    FLUID PROPERTY SENSING WITH ELECTRODES 审中-公开

    公开(公告)号：US20190120678A1

    公开(公告)日：2019-04-25

    申请号：US16092572

    申请日：2016-04-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Michael W. Cumbie ,  Chien-Hua Chen ,  Greg Scott Long

    IPC: G01F23/24 ,  B41J2/175 ,  B41J2/195 ,  G01F23/26 ,  G01N27/22

    Abstract: In one example in accordance with the present disclosure a fluid property sensing device is described. The fluid property sensing device includes a substrate having a trench formed therein. The trench includes a bottom surface and opposite side surfaces. A first electrode is disposed on a first side surface of the trench and a second electrode is disposed on a second side surface of the trench. The first electrode and second electrode form a capacitor to measure a complex impedance of a fluid that fills a space between the first electrode and the second electrode. This complex impedance indicates a property of the fluid. A fluid level sensing die, having a number of fluid level sensing components disposed thereon, may be attached to the substrate, preferably in such a way that the fluid level sensing die is surrounded by the trench. In this way the surface area of the electrodes provided in the trench can be increased. The number of level sensing components may be thermal sensing components.

    Thermal inkjet printhead stack with amorphous thin metal protective layer
    20.
    发明授权
    Thermal inkjet printhead stack with amorphous thin metal protective layer 有权
    热喷墨打印头堆叠与非晶薄金属保护层

    公开(公告)号：US09511585B2

    公开(公告)日：2016-12-06

    申请号：US14787711

    申请日：2013-07-12

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： James Elmer Abbott, Jr. ,  Arun K. Agarwal ,  Roberto A. Pugliese ,  Greg Scott Long ,  Stephen Horvath ,  Douglas A. Keszler ,  John Wager ,  Kristopher Olsen ,  John McGlone

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14112 ,  B41J2/14016 ,  B41J2/14088 ,  B41J2/14129 ,  B41J2/164 ,  B41J2/1646 ,  B41J2/1648 ,  B41J2202/03 ,  B41J2202/11

    Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising an insulated substrate, a resistor applied to the insulated substrate, a resistor passivation layer applied to the resistor, and an amorphous thin metal protective layer applied to the resistor passivation layer. The amorphous thin metal protective layer can comprise from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron. The film can also include a first and second metal, each comprising from 5 atomic % to 90 atomic % of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum. The second metal is different than the first metal, and the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.

    Abstract translation: 本公开涉及具有非晶金属保护层的热喷墨打印头堆叠，其包括绝缘基板，施加到绝缘基板的电阻器，施加到电阻器的电阻器钝化层以及施加到电阻器的非晶薄金属保护层 电阻钝化层。 非晶态金属保护层可以包含5原子％至90原子％的碳，硅或硼准金属。 该膜还可以包括第一和第二金属，每个包含5原子％至90原子％的钛，钒，铬，钴，镍，锆，铌，钼，铑，钯，铪，钽，钨，铱， 或铂金。 第二金属与第一金属不同，并且准金属，第一金属和第二金属占非晶金属保护层的至少70原子％。

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