SLURRY AND POLISHING METHOD
    12.
    发明申请

    公开(公告)号:US20200299545A1

    公开(公告)日:2020-09-24

    申请号:US16642120

    申请日:2018-08-30

    IPC分类号: C09G1/02 C09K3/14 H01L21/3105

    摘要: A slurry containing abrasive grains, a liquid medium, and a salt of a compound represented by formula (1) below, in which the abrasive grains include first particles and second particles in contact with the first particles, the first particles contain cerium oxide, and the second particles contain a hydroxide of a tetravalent metal element. [In formula (1), R represents a hydroxyl group or a monovalent organic group.]

    ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE
    15.
    发明申请
    ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE 审中-公开
    磨料磨具,以及抛光底板的方法

    公开(公告)号:US20160319159A1

    公开(公告)日:2016-11-03

    申请号:US15108001

    申请日:2014-09-10

    摘要: A polishing agent comprises: a fluid medium; an abrasive grain containing a hydroxide of a tetravalent metal element; a first additive; a second additive; and a third additive, wherein: the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer; the second additive is a cationic polymer; and the third additive is an amino group-containing sulfonic acid compound.

    摘要翻译: 抛光剂包括:流体介质; 包含四价金属元素的氢氧化物的磨料颗粒; 第一种添加剂; 第二种添加剂; 和第三添加剂,其中:所述第一添加剂为选自具有聚氧化烯链和乙烯醇聚合物的化合物中的至少一种; 第二种添加剂是阳离子聚合物; 并且第三添加剂是含氨基的磺酸化合物。