中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

26 records (took 0.015 seconds)

    METHOD AND DEVICE FOR SENDING A BUFFER STATUS REPORT
    13.
    发明申请
    METHOD AND DEVICE FOR SENDING A BUFFER STATUS REPORT 审中-公开
    发送缓冲区状态报告的方法和设备

    公开(公告)号：US20140314025A1

    公开(公告)日：2014-10-23

    申请号：US14322543

    申请日：2014-07-02

    Applicant: Huawei Technologies Co., LTD.

    Inventor： Xiaodong Zhang ,  Johan Johansson

    IPC: H04W24/10 ,  H04W74/08

    CPC classification number: H04W24/10 ,  H04W72/04 ,  H04W72/1242 ,  H04W72/1284 ,  H04W74/0833

    Abstract: A method and device of sending Buffer Status Reports (BSRs) includes determining the type priority sequence of BSR by a user terminal, and selecting and processing one BSR based on the type priority. A user device is also provided. In the process of implementing the provided method and device, the terminal may select and process one BSR when the sum of the BSR qualified for triggering the sending and the BSR marked as pending is greater than one.

    Abstract translation: 发送缓冲状态报告（BSR）的方法和装置包括：由用户终端确定BSR的类型优先顺序，并根据类型优先级选择和处理一个BSR。 还提供了用户设备。 在实现所提供的方法和设备的过程中，当符合触发发送的BSR和标记为待处理的BSR之和大于1时，终端可以选择和处理一个BSR。

    Method and device for sending a buffer status report
    15.
    发明授权
    Method and device for sending a buffer status report 有权
    用于发送缓冲状态报告的方法和设备

    公开(公告)号：US09143974B2

    公开(公告)日：2015-09-22

    申请号：US14322543

    申请日：2014-07-02

    Applicant: Huawei Technologies Co., LTD.

    Inventor： Xiaodong Zhang ,  Johan Johansson

    IPC: H04W24/10 ,  H04W74/08 ,  H04W72/12 ,  H04W72/04

    CPC classification number: H04W24/10 ,  H04W72/04 ,  H04W72/1242 ,  H04W72/1284 ,  H04W74/0833

    Abstract: A method and device of sending Buffer Status Reports (BSRs) includes determining the type priority sequence of BSR by a user terminal, and selecting and processing one BSR based on the type priority. A user device is also provided. In the process of implementing the provided method and device, the terminal may select and process one BSR when the sum of the BSR qualified for triggering the sending and the BSR marked as pending is greater than one.

    Abstract translation: 发送缓冲状态报告（BSR）的方法和装置包括：由用户终端确定BSR的类型优先顺序，并根据类型优先级选择和处理一个BSR。 还提供了用户设备。 在实现所提供的方法和设备的过程中，当符合触发发送的BSR和标记为待处理的BSR之和大于1时，终端可以选择和处理一个BSR。

    Multi-band multi-path receiving and transmitting device and method, and base station system
    16.
    发明授权
    Multi-band multi-path receiving and transmitting device and method, and base station system 有权
    多频段多路径接收和发射装置及方法，以及基站系统

    公开(公告)号：US09124311B2

    公开(公告)日：2015-09-01

    申请号：US14466835

    申请日：2014-08-22

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Wangjun Wu ,  Yulin Li ,  Fengqing Yan ,  Xiaodong Zhang ,  Xiwen Zhang

    IPC: H04B1/38 ,  H04B1/00 ,  H04B1/50

    CPC classification number: H04B1/40 ,  H04B1/005 ,  H04B1/0057 ,  H04B1/50

    Abstract: A multi-band multi-path receiving and transmitting device and method are provided. The multi-band multi-path receiving and transmitting device includes at least two multi-frequency couplers, a multi-band transceiver, and a signal processing module. The multi-band transceiver includes at least two first frequency band receiving branches and at least two second frequency band receiving branches, and the multi-band transceiver is adopted to decrease the number of the transceivers, thereby reducing the material cost and the mounting cost of the base station system.

    Abstract translation: 提供了一种多频带多径接收和发送装置和方法。 多频带多路径接收和发送装置包括至少两个多频率耦合器，多频带收发器和信号处理模块。 多频带收发机包括至少两个第一频带接收分支和至少两个第二频带接收分支，并且采用多频带收发机来减少收发机的数量，从而降低材料成本和安装成本 基站系统。

    Processing iterative query constructs in relational databases
    17.
    发明授权
    Processing iterative query constructs in relational databases 有权

    公开(公告)号：US11960479B2

    公开(公告)日：2024-04-16

    申请号：US18050913

    申请日：2022-10-28

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Yang Sun ,  Sofoklis Floratos ,  Ahmad Ghazal ,  Jianjun Chen ,  Xiaodong Zhang

    IPC: G06F16/242 ,  G06F11/34 ,  G06F16/22 ,  G06F16/2453

    CPC classification number: G06F16/2425 ,  G06F11/3409 ,  G06F16/2282 ,  G06F16/24544

    Abstract: A method for functionally rewriting iterative queries for a relational database management system (RDBMS) is provided. The method comprises receiving a first iterative query, the first iterative query having a first non-iterative part that defines a first main table and a first iterative part that generates values in rows of a first working table based on values in rows of the first main table, determining that the first iterative part modifies all of the rows of the first working table, and rewriting the first iterative part, including: adding a renaming operation to rename the first working table to a new first main table and to rename the first main table to a new first working table, adding a first Delete operation to delete each row of the new first working table, and adding a first loop operation to repeat the first iterative part until a first termination condition is met.

    CHIP PACKAGING APPARATUS AND PREPARATION METHOD THEREOF
    18.
    发明申请
    CHIP PACKAGING APPARATUS AND PREPARATION METHOD THEREOF 有权

    公开(公告)号：US20220077018A1

    公开(公告)日：2022-03-10

    申请号：US17526966

    申请日：2021-11-15

    Applicant: HUAWEI TECHNOLOGIES CO.,LTD.

    Inventor： Mao Guo ,  Yiwei Ren ,  Xiaodong Zhang

    IPC: H01L23/31 ,  H01L21/66 ,  H01L21/56

    Abstract: A chip packaging apparatus and a preparation method thereof are provided, to modulate warpage of a chip, thereby resolving a problem of mismatch between a warpage degree of the chip and a warpage degree of a substrate. The chip packaging apparatus includes a chip, a substrate, and a warpage modulation structure, where a surface that is of the chip and that faces the substrate is electrically connected to the substrate, the warpage modulation structure is disposed on a surface that is of the chip and that is opposite to the substrate, and a coefficient of thermal expansion of the warpage modulation structure is greater than a coefficient of thermal expansion of the chip.

    CHIP
    19.
    发明申请
    CHIP 审中-公开

    公开(公告)号：US20180025973A1

    公开(公告)日：2018-01-25

    申请号：US15715654

    申请日：2017-09-26

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： HuiLi Fu ,  Xiaodong Zhang ,  Jyh Rong Lin ,  Zhiqiang Ma

    IPC: H01L23/528 ,  H01L23/49

    Abstract: The present embodiments provides a chip, including a carrier, a redistribution structure, and multiple packaging function modules, where the multiple packaging function modules each have at least a part wrapped by a colloid, and are fastened to the redistribution structure side by side; the redistribution structure is fastened to the carrier, and the redistribution structure includes one or more redistribution metal layers; the redistribution metal layer communicatively connects the multiple packaging function modules and the carrier. The redistribution structure further includes one or more interconnect metal layers, and the interconnect metal layer is communicatively connected to at least two packaging function modules so as to provide a signal path between the at least two packaging function modules. In the chip, two packaging function modules are placed on the carrier side by side, and a signal path is established between the two packaging function modules by using the redistribution structure.

Patent Agency Ranking