Method and apparatus for high-resolution defect location and classification
    11.
    发明授权
    Method and apparatus for high-resolution defect location and classification 有权
    用于高分辨率缺陷位置和分类的方法和装置

    公开(公告)号:US07242467B2

    公开(公告)日:2007-07-10

    申请号:US10840730

    申请日:2004-05-06

    申请人: Joachim Wienecke

    发明人: Joachim Wienecke

    IPC分类号: G01N21/00 G02B27/40 G06K9/00

    摘要: In the manufacture of integrated circuits on a wafer, it is necessary to monitor the manufacturing process by inspecting the ICs as to whether errors or defects have occurred during production. It is already known to use a scattered-light device (32) to determine whether a defect is present on the wafer. According to the present invention, defect examination is now improved in that defect-suspected regions (33) are identified using the scattered-light device (32). With a further examination system (30, 28) different from the scattered-light device (32), a determination is then made as to whether the defect-suspected regions (33) are defects. The latter can then also be classified.

    摘要翻译: 在晶圆上集成电路的制造中,有必要通过检查IC来确定生产过程中是否发生错误或缺陷。 已知使用散射光装置(32)来确定晶片上是否存在缺陷。 根据本发明,现在通过使用散射光装置(32)识别缺陷可疑区域(33)来改进缺陷检查。 通过与散射光装置(32)不同的另外的检查系统(30,28),判断缺陷可疑区域(33)是否是缺陷。 后者也可以分类。

    Setting module for the illumination of an optical instrument
    12.
    发明授权
    Setting module for the illumination of an optical instrument 失效
    用于照明光学仪器的设置模块

    公开(公告)号:US07002740B2

    公开(公告)日:2006-02-21

    申请号:US10192874

    申请日:2002-07-11

    IPC分类号: G02B21/06

    CPC分类号: G02B21/06

    摘要: The invention refers to a setting module for an illumination apparatus (2) of an optical instrument (1), in particular of a microscope, in which the illumination apparatus (2) comprises a light source (4), an illuminating optical system, and positioning elements (7, 8, 9, 16) with which the position of the light source (4) and/or of the illuminating optical system within the illumination apparatus (2) can be modified. The setting module (17) comprises a module housing (18) having at least one drive device (19, 20, 21, 22) and coupling members (27, 28, 29, 30) for the transfer of a drive motion to the positioning elements (7, 8, 9, 16).Also described is an illumination system comprising the illumination apparatus and the setting module. The result is to create an alignment capability with excellent functionality and user-friendliness, thereby making possible rapid positional adjustment of the light source and/or the illuminating optical system in the context of use under clean-room conditions.

    摘要翻译: 本发明涉及一种用于光学仪器(1)的照明装置(2)的设置模块,特别是显微镜,其中照明装置(2)包括光源(4),照明光学系统和 能够改变照明装置(2)内的光源(4)和/或照明光学系统的位置的定位元件(7,8,9,16)。 设置模块(17)包括具有至少一个驱动装置(19,20,21,22)和联接构件(27,28,29,30)的模块壳体(18),用于将驱动运动传递到定位 元素(7,8,9,16)。

    Method for automatic focusing an imaging optical system on the surface of a sample
    14.
    发明授权
    Method for automatic focusing an imaging optical system on the surface of a sample 失效
    将成像光学系统自动聚焦在样品表面上的方法

    公开(公告)号:US07041952B2

    公开(公告)日:2006-05-09

    申请号:US10777137

    申请日:2004-02-13

    IPC分类号: G02B27/64

    CPC分类号: G02B21/244

    摘要: A sample P is illuminated by a measurement light beam with an incidence angle differing from 0°; light reflected therefrom is detected; intensity values are recorded and evaluated; and the opening of a field stop is imaged onto a receiving surface, thereby generating an image. In such a method, a value of “light” or “dark” is allocated to each intensity value as a function of a brightness threshold; the smallest rectangle that encloses all “light” positions on the receiving surface is determined; the geometric center point of that rectangle is determined; the position of that point is compared with the position on the receiving surface that corresponds to the geometric center point of the image generated by the field stop in the focused state; and a change in the distance between the sample and the imaging optical system corresponding to the distance between the two points is effected.

    摘要翻译: 样品P被入射角不同于0°的测量光束照射; 检测出反射的光; 记录和评估强度值; 并且将场停止件的打开成像到接收表面上,从而生成图像。 在这种方法中,根据亮度阈值对每个强度值分配“亮”或“暗”的值; 确定在接收表面上包围所有“轻”位置的最小矩形; 确定该矩形的几何中心点; 将该点的位置与在聚焦状态下由场停止产生的图像的几何中心点对应的接收表面上的位置进行比较; 并且实现与两点之间的距离相对应的样本与成像光学系统之间的距离的变化。

    Method and measuring instrument for determining the position of an edge of a pattern element on a substrate
    15.
    发明授权
    Method and measuring instrument for determining the position of an edge of a pattern element on a substrate 有权
    用于确定图案元件在基底上的边缘的位置的方法和测量仪器

    公开(公告)号:US06920249B2

    公开(公告)日:2005-07-19

    申请号:US09960734

    申请日:2001-09-24

    摘要: A method and a measuring instrument for determining the position of an edge to be measured on a pattern on a substrate are described. A complete, nonlinear model intensity profile, which identifies the edge to be measured, of a model edge is ascertained and stored, and a desired edge position xk is defined therein with subpixel accuracy. A camera image of the substrate having the edge to be measured is acquired, and a one-dimensional measured intensity profile of the edge to be measured is determined therefrom. The model intensity profile is identified in the measured intensity profile with an indication of its location xm relative to a reference point. The desired position p of the edge to be measured is determined with subpixel accuracy as p=xm+xk.

    摘要翻译: 描述了一种用于确定待测量边缘在基板上的图案上的位置的方法和测量仪器。 确定并存储识别模型边缘的待测量边缘的完整的非线性模型强度分布,并且在其中以子像素精度来定义期望的边缘位置x k。 获取具有待测边缘的基板的相机图像,并从其确定待测边缘的一维测量强度分布。 模型强度分布在测量的强度分布中被识别,并具有相对于参考点的位置x m的指示。 要测量的边缘的期望位置p由子像素精度确定为p = x m + x k k。

    Method for focusing of disk-shaped objects with patterned surfaces during imaging
    16.
    发明授权
    Method for focusing of disk-shaped objects with patterned surfaces during imaging 失效
    在成像期间用盘状物体聚焦图案化表面的方法

    公开(公告)号:US06696679B1

    公开(公告)日:2004-02-24

    申请号:US09446463

    申请日:2000-04-12

    IPC分类号: G02B2740

    摘要: A method for focusing on disk-shaped objects with patterned and unpatterned surfaces includes imaging of the patterned and unpatterned surfaces on a disk-shaped object for defect detection and defect classification by using various preset values of a focus regulation system to acquire the image sequence. At least one preset value is learned on the basis of an image sequence at least at one position in a substantially flat reference region of the surface of the disk-shaped object. A regulated adjustment is provided of a measurable distance from a carrier plane to a reference plane, wherein the carrier plane serves as a support for the disk-shaped objects. The distance is adjusted by applying the at least one preset value, which is overlaid on the regulation system, a focus state is evaluated by an image processor according to at least one rule, and the at least one preset value is ascertained therefrom.

    摘要翻译: 用于聚焦在具有图案化和未图案化表面的盘形物体的方法包括通过使用聚焦调节系统的各种预设值来获取图像序列,将用于缺陷检测和缺陷分类的图案化和未图案化表面成像在盘形物体上。 基于至少在盘状物体的表面的基本上平坦的参考区域的一个位置处的图像序列来学习至少一个预设值。 提供了从载体平面到参考平面的可测量距离的调节调节,其中载体平面用作盘形物体的支撑。 通过应用覆盖在调节系统上的至少一个预设值来调整距离,根据至少一个规则由图像处理器评估聚焦状态,并且从其确定至少一个预设值。

    Method and apparatus for monitoring the light emitted from an illumination apparatus for an optical measuring instrument
    17.
    发明授权
    Method and apparatus for monitoring the light emitted from an illumination apparatus for an optical measuring instrument 有权
    用于监测从光学测量仪器的照明装置发射的光的方法和装置

    公开(公告)号:US06456373B1

    公开(公告)日:2002-09-24

    申请号:US09705931

    申请日:2000-11-06

    IPC分类号: G01J142

    CPC分类号: H05B37/03

    摘要: In a method for monitoring the measurement light emitted from an illumination apparatus for an optical measuring instrument, a continuous sensing of measurement light parameters is performed. The sensed measurement light parameters are compared to predefined setpoints. Any deviation from the predefined parameter ranges associated with the setpoints is signaled. This signal is used to initiate a lamp exchange on the illumination apparatus, which has multiple lamps that can be selectively switched on and off individually or in groups. Also described is a corresponding illumination apparatus that preferably performs a lamp exchange automatically. The result is to identify a point in time for a lamp change that is optimal with regard to measurement accuracy and the longest possible utilization of the lamps, so that a measurement light quality that remains consistent during continuous operation can reliably be maintained within predefined tolerance ranges.

    摘要翻译: 在用于监测从光学测量仪器的照明装置发射的测量光的方法中,执行测量光参数的连续感测。 将感测的测量光参数与预定义的设定值进行比较。 发出与设定值相关联的预定义参数范围的任何偏差。 该信号用于在照明装置上启动灯交换,其具有可以单独或分组地选择性地打开和关闭的多个灯。 还描述了一种相应的照明装置,其优选地自动执行灯交换。 其结果是识别关于测量精度和灯的最长可能利用最佳的灯变化的时间点,使得在连续操作期间保持一致的测量光质量可以可靠地保持在预定义的公差范围内 。

    Method for detection of defects in the inspection of structured surfaces
    18.
    发明授权
    Method for detection of defects in the inspection of structured surfaces 失效
    检测结构化表面缺陷的方法

    公开(公告)号:US6075880A

    公开(公告)日:2000-06-13

    申请号:US395668

    申请日:1995-02-28

    摘要: The object of a method for detecting defects in the inspection of structured surfaces is to ensure a detection of defects which is not dependent on the number of structuring planes and includes structure features in real-time operation for separating defects from good structures. From image point classification in which zones of a recorded image which have similar image point features are assembled, a gray-value intermediate image containing edge structures and corner structures is generated from the image and the behavior of the image point features of every image point in the intermediate image is analyzed with respect to its neighboring image points. The method is used predominantly in statistical process control in the production process of masks, LCD's, printed circuit boards and semiconductor wafers.

    摘要翻译: 用于检测结构化表面检查中的缺陷的方法的目的是确保检测不依赖于结构平面数量的缺陷,并且包括用于将缺陷与良好结构分离的实时操作中的结构特征。 从具有类似图像点特征的记录图像的区域的图像点分类,从图像生成包含边缘结构和角结构的灰度值中间图像,并且从每个图像点的图像点特征的行为生成 相对于其相邻图像点分析中间图像。 该方法主要用于掩模,LCD,印刷电路板和半导体晶片的生产过程中的统计过程控制。

    Arrangement and method for inspecting unpatterned wafers
    19.
    发明授权
    Arrangement and method for inspecting unpatterned wafers 失效
    用于检查未图案化晶片的布置和方法

    公开(公告)号:US07084965B2

    公开(公告)日:2006-08-01

    申请号:US10224415

    申请日:2002-08-21

    CPC分类号: G01N21/9501

    摘要: The invention concerns an arrangement (1) for inspecting preferably unpatterned wafers, and comprises: a first optical inspection device (2) for examining reference wafers (R), which operates using image data processing methods and thereby recognizes defects on the reference wafers; a scattered-light measuring instrument (3) that is calibrated with the reference wafers (R) by defining at least one threshold value for the recognition of defects on wafers (W) to be inspected, and that comprises means (6) for recording the locations of threshold value exceedances for the wafers (W) to be inspected; and a second optical inspection device (4) for examination, only at those locations at which a threshold value exceedance is identified, of the wafers (W) to be inspected, which also comprises a classification device. The scattered-light measuring instrument (3) and the second optical inspection device (4) are arranged in one production line (P) as sequentially located stations. The first optical inspection device (2), on the other hand, is arranged outside the production line (P). A corresponding method is also described.

    摘要翻译: 本发明涉及一种用于检查优选未图案化晶片的装置(1),包括:用于检查参考晶片(R)的第一光学检查装置(2),其使用图像数据处理方法进行操作,从而识别参考晶片上的缺陷; 通过限定用于识别要检查的晶片(W)上的缺陷的至少一个阈值,通过用参考晶片(R)校准的散射光测量仪器(3),并且包括用于记录 要检查的晶片(W)的阈值超出位置; 以及第二光学检查装置(4),仅在识别要检查的晶片(W)的阈值超标的那些位置处进行检查,其也包括分类装置。 散射光测量仪器(3)和第二光学检测装置(4)以一个生产线(P)的形式排列成顺序定位的工位。 另一方面,第一光学检查装置(2)布置在生产线(P)的外侧。 还描述了相应的方法。

    Method for evaluating pattern defects on a water surface
    20.
    发明授权
    Method for evaluating pattern defects on a water surface 有权
    评估水面图案缺陷的方法

    公开(公告)号:US06941009B2

    公开(公告)日:2005-09-06

    申请号:US09797909

    申请日:2001-03-05

    申请人: Joachim Wienecke

    发明人: Joachim Wienecke

    摘要: The invention concerns a method for evaluating pattern defects on a wafer surface, comprising the following steps: acquiring the surface data of a plurality of individual image fields (4) of a series-produced wafer (1); storing the data in a reference data set and making it available as reference data for the inspection of further wafers of the same series; inspecting, successively in time, the individual image fields (4) on the surface of a wafer (1) presently being examined; retrieving from the reference data set a reference datum corresponding to the respective individual image field (4) presently being inspected; comparing the surface of each individual image field (4) currently being inspected to the corresponding reference datum; if one or more deviations are identified, subsequently classifying the deviations into critical and noncritical defects in terms of the functionality of the chip; and simultaneously updating or adding to the reference data set.

    摘要翻译: 本发明涉及一种用于评估晶片表面上的图案缺陷的方法,包括以下步骤:获取串联生产的晶片(1)的多个单独图像场(4)的表面数据; 将数据存储在参考数据集中并使其可用作用于检查相同系列的另外的晶片的参考数据; 在时间上连续检查当前正在检查的晶片(1)的表面上的各个图像场(4); 从参考数据集中检索与当前正在检查的各个图像字段(4)相对应的参考数据; 将当前被检查的每个单独图像场(4)的表面与对应的参考基准进行比较; 如果识别出一个或多个偏差,则随后在芯片的功能方面将偏差分类为关键和非临界缺陷; 并同时更新或添加到参考数据集。