摘要:
In the manufacture of integrated circuits on a wafer, it is necessary to monitor the manufacturing process by inspecting the ICs as to whether errors or defects have occurred during production. It is already known to use a scattered-light device (32) to determine whether a defect is present on the wafer. According to the present invention, defect examination is now improved in that defect-suspected regions (33) are identified using the scattered-light device (32). With a further examination system (30, 28) different from the scattered-light device (32), a determination is then made as to whether the defect-suspected regions (33) are defects. The latter can then also be classified.
摘要:
The invention refers to a setting module for an illumination apparatus (2) of an optical instrument (1), in particular of a microscope, in which the illumination apparatus (2) comprises a light source (4), an illuminating optical system, and positioning elements (7, 8, 9, 16) with which the position of the light source (4) and/or of the illuminating optical system within the illumination apparatus (2) can be modified. The setting module (17) comprises a module housing (18) having at least one drive device (19, 20, 21, 22) and coupling members (27, 28, 29, 30) for the transfer of a drive motion to the positioning elements (7, 8, 9, 16).Also described is an illumination system comprising the illumination apparatus and the setting module. The result is to create an alignment capability with excellent functionality and user-friendliness, thereby making possible rapid positional adjustment of the light source and/or the illuminating optical system in the context of use under clean-room conditions.
摘要:
An apparatus for inspecting a disk-like object comprising at least one first module for inspecting a surface of the disk-like object and at least one second module insertable in the apparatus. The at least one second module is arranged to inspect a different element of the disk-like object than the surface of the disk-like object.
摘要:
A sample P is illuminated by a measurement light beam with an incidence angle differing from 0°; light reflected therefrom is detected; intensity values are recorded and evaluated; and the opening of a field stop is imaged onto a receiving surface, thereby generating an image. In such a method, a value of “light” or “dark” is allocated to each intensity value as a function of a brightness threshold; the smallest rectangle that encloses all “light” positions on the receiving surface is determined; the geometric center point of that rectangle is determined; the position of that point is compared with the position on the receiving surface that corresponds to the geometric center point of the image generated by the field stop in the focused state; and a change in the distance between the sample and the imaging optical system corresponding to the distance between the two points is effected.
摘要:
A method and a measuring instrument for determining the position of an edge to be measured on a pattern on a substrate are described. A complete, nonlinear model intensity profile, which identifies the edge to be measured, of a model edge is ascertained and stored, and a desired edge position xk is defined therein with subpixel accuracy. A camera image of the substrate having the edge to be measured is acquired, and a one-dimensional measured intensity profile of the edge to be measured is determined therefrom. The model intensity profile is identified in the measured intensity profile with an indication of its location xm relative to a reference point. The desired position p of the edge to be measured is determined with subpixel accuracy as p=xm+xk.
摘要翻译:描述了一种用于确定待测量边缘在基板上的图案上的位置的方法和测量仪器。 确定并存储识别模型边缘的待测量边缘的完整的非线性模型强度分布,并且在其中以子像素精度来定义期望的边缘位置x k。 获取具有待测边缘的基板的相机图像,并从其确定待测边缘的一维测量强度分布。 模型强度分布在测量的强度分布中被识别,并具有相对于参考点的位置x m的指示。 要测量的边缘的期望位置p由子像素精度确定为p = x m + x k k。
摘要:
A method for focusing on disk-shaped objects with patterned and unpatterned surfaces includes imaging of the patterned and unpatterned surfaces on a disk-shaped object for defect detection and defect classification by using various preset values of a focus regulation system to acquire the image sequence. At least one preset value is learned on the basis of an image sequence at least at one position in a substantially flat reference region of the surface of the disk-shaped object. A regulated adjustment is provided of a measurable distance from a carrier plane to a reference plane, wherein the carrier plane serves as a support for the disk-shaped objects. The distance is adjusted by applying the at least one preset value, which is overlaid on the regulation system, a focus state is evaluated by an image processor according to at least one rule, and the at least one preset value is ascertained therefrom.
摘要:
In a method for monitoring the measurement light emitted from an illumination apparatus for an optical measuring instrument, a continuous sensing of measurement light parameters is performed. The sensed measurement light parameters are compared to predefined setpoints. Any deviation from the predefined parameter ranges associated with the setpoints is signaled. This signal is used to initiate a lamp exchange on the illumination apparatus, which has multiple lamps that can be selectively switched on and off individually or in groups. Also described is a corresponding illumination apparatus that preferably performs a lamp exchange automatically. The result is to identify a point in time for a lamp change that is optimal with regard to measurement accuracy and the longest possible utilization of the lamps, so that a measurement light quality that remains consistent during continuous operation can reliably be maintained within predefined tolerance ranges.
摘要:
The object of a method for detecting defects in the inspection of structured surfaces is to ensure a detection of defects which is not dependent on the number of structuring planes and includes structure features in real-time operation for separating defects from good structures. From image point classification in which zones of a recorded image which have similar image point features are assembled, a gray-value intermediate image containing edge structures and corner structures is generated from the image and the behavior of the image point features of every image point in the intermediate image is analyzed with respect to its neighboring image points. The method is used predominantly in statistical process control in the production process of masks, LCD's, printed circuit boards and semiconductor wafers.
摘要:
The invention concerns an arrangement (1) for inspecting preferably unpatterned wafers, and comprises: a first optical inspection device (2) for examining reference wafers (R), which operates using image data processing methods and thereby recognizes defects on the reference wafers; a scattered-light measuring instrument (3) that is calibrated with the reference wafers (R) by defining at least one threshold value for the recognition of defects on wafers (W) to be inspected, and that comprises means (6) for recording the locations of threshold value exceedances for the wafers (W) to be inspected; and a second optical inspection device (4) for examination, only at those locations at which a threshold value exceedance is identified, of the wafers (W) to be inspected, which also comprises a classification device. The scattered-light measuring instrument (3) and the second optical inspection device (4) are arranged in one production line (P) as sequentially located stations. The first optical inspection device (2), on the other hand, is arranged outside the production line (P). A corresponding method is also described.
摘要:
The invention concerns a method for evaluating pattern defects on a wafer surface, comprising the following steps: acquiring the surface data of a plurality of individual image fields (4) of a series-produced wafer (1); storing the data in a reference data set and making it available as reference data for the inspection of further wafers of the same series; inspecting, successively in time, the individual image fields (4) on the surface of a wafer (1) presently being examined; retrieving from the reference data set a reference datum corresponding to the respective individual image field (4) presently being inspected; comparing the surface of each individual image field (4) currently being inspected to the corresponding reference datum; if one or more deviations are identified, subsequently classifying the deviations into critical and noncritical defects in terms of the functionality of the chip; and simultaneously updating or adding to the reference data set.