公开(公告)号：US07728507B2

公开(公告)日：2010-06-01

申请号：US11518401

申请日：2006-09-08

申请人： Matthias Winter ,  Harald Jäger

发明人： Matthias Winter ,  Harald Jäger

IPC分类号： H01L23/495

CPC分类号： B22F3/225 ,  B22F7/062 ,  B22F2998/00 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01068 ,  H01L2924/12044 ,  B22F3/1021 ,  H01L2924/00014 ,  H01L2924/00

摘要： A process is specified for producing a radiation-emitting component comprising a housing body and a carrier for a radiation-emitting semiconductor body, in which the carrier is produced in an injection molding process from a molding compound containing a metal.

摘要翻译： 规定了一种用于制造辐射发射部件的方法，该辐射发射部件包括用于辐射发射半导体主体的外壳主体和载体，其中载体由注射成型工艺从含有金属的模塑料制成。

公开(公告)号：US07098588B2

公开(公告)日：2006-08-29

申请号：US10186661

申请日：2002-07-01

申请人： Harald Jäger ,  Klaus Höhn ,  Reinhold Brunner

发明人： Harald Jäger ,  Klaus Höhn ,  Reinhold Brunner

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A surface-mountable light-emitting diode light source is described, in which the leadframe-bends toward the rear side of the package that are required for surface mounting lie within a transparent plastic molded body. Also described is a method of producing a mixed-light, preferably white-light source on the basis of a UV- or blue-emitting semiconductor LED. The LED is mounted on a leadframe, a transparent plastics molding composition is mixed with a conversion substance and possibly further fillers to form a molding composition. The leadframe is encapsulated, preferably by the injection-molding process, with the molding composition in such a way that the LED is surrounded on its light-exiting sides by the molding composition.

公开(公告)号：US07030491B2

公开(公告)日：2006-04-18

申请号：US10897719

申请日：2004-07-23

申请人： Yvonne Manz ,  Jürgen Steger ,  Harald Jäger ,  Herbert Rüger ,  Jürgen Matthes

发明人： Yvonne Manz ,  Jürgen Steger ,  Harald Jäger ,  Herbert Rüger ,  Jürgen Matthes

IPC分类号： H01L23/34

CPC分类号： H01L23/3735 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H05K1/0271 ,  H05K1/0306 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module, having a metal base plate for mounting on a heat sink. The module comprises a framelike housing, a cover, terminal elements, leading to the outside of the housing, for load contacts and auxiliary contacts, and having at least one electrically insulating substrate, disposed inside the housing. The substrate includes an insulating body and a plurality of metal connecting tracks, electrically insulated from one another. Power semiconductor components are located on the connecting tracks and connected to these connecting tracks via appropriate circuitry. The base plate has a stiffening structure, which extends near and along a side of the base plate, and in the longitudinal direction of the base plate. The stiffening structure is formed of the base plate material itself by deformation and protrudes out of the upper surface of the base plate.

摘要翻译： 一种功率半导体模块，具有用于安装在散热器上的金属基板。 模块包括框架式壳体，盖子，通向壳体外部的端子元件，用于负载触点和辅助触点，并且具有设置在壳体内部的至少一个电绝缘基板。 基板包括彼此电绝缘的绝缘体和多个金属连接轨道。 功率半导体元件位于连接轨道上，并通过适当的电路连接到这些连接轨道。 基板具有沿基板的一侧和沿着基板的纵向方向延伸的加强结构。 加强结构由基板材料本身通过变形形成并突出到基板的上表面之外。

公开(公告)号：US08735928B2

公开(公告)日：2014-05-27

申请号：US13807342

申请日：2011-06-27

申请人： Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

发明人： Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

摘要： A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places, the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary carrier; and producing individual surface-mountable semiconductor components by severing the molding.

摘要翻译： 一种制造可表面安装的半导体部件的方法，包括提供由塑料材料制成的辅助载体; 将至少一个插入件和至少一个光电子部件施加到辅助载体的安装表面; 将光电子部件和插入件封装在共同的模制件中，其中模制件至少在一些地方覆盖光电子部件和插入件，光电子部件和插入件彼此不直接接触，并且光电子部件和 插入件通过模制机械连接在一起; 移除辅助载体; 并通过切割模制件来生产单个的可表面安装的半导体部件。

公开(公告)号：US07534634B2

公开(公告)日：2009-05-19

申请号：US11456301

申请日：2006-07-10

申请人： Harald Jäger ,  Klaus Höhn ,  Reinhold Brunner

发明人： Harald Jäger ,  Klaus Höhn ,  Reinhold Brunner

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L33/501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A surface-mountable light-emitting diode light source is described, in which the leadframe-bends toward the rear side of the package that are required for surface mounting lie within a transparent plastic molded body. Also described is a method of producing a mixed-light, preferably white-light source on the basis of a UV- or blue-emitting semiconductor LED. The LED is mounted on a leadframe, a transparent plastics molding composition is mixed with a conversion substance and possibly further fillers to form a molding composition. The leadframe is encapsulated, preferably by the injection-molding process, with the molding composition in such a way that the LED is surrounded on its light-exiting sides by the molding composition.