公开(公告)号：US07534634B2

公开(公告)日：2009-05-19

申请号：US11456301

申请日：2006-07-10

申请人： Harald Jäger ,  Klaus Höhn ,  Reinhold Brunner

发明人： Harald Jäger ,  Klaus Höhn ,  Reinhold Brunner

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L33/501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A surface-mountable light-emitting diode light source is described, in which the leadframe-bends toward the rear side of the package that are required for surface mounting lie within a transparent plastic molded body. Also described is a method of producing a mixed-light, preferably white-light source on the basis of a UV- or blue-emitting semiconductor LED. The LED is mounted on a leadframe, a transparent plastics molding composition is mixed with a conversion substance and possibly further fillers to form a molding composition. The leadframe is encapsulated, preferably by the injection-molding process, with the molding composition in such a way that the LED is surrounded on its light-exiting sides by the molding composition.

公开(公告)号：US07098588B2

公开(公告)日：2006-08-29

申请号：US10186661

申请日：2002-07-01

申请人： Harald Jäger ,  Klaus Höhn ,  Reinhold Brunner

发明人： Harald Jäger ,  Klaus Höhn ,  Reinhold Brunner

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A surface-mountable light-emitting diode light source is described, in which the leadframe-bends toward the rear side of the package that are required for surface mounting lie within a transparent plastic molded body. Also described is a method of producing a mixed-light, preferably white-light source on the basis of a UV- or blue-emitting semiconductor LED. The LED is mounted on a leadframe, a transparent plastics molding composition is mixed with a conversion substance and possibly further fillers to form a molding composition. The leadframe is encapsulated, preferably by the injection-molding process, with the molding composition in such a way that the LED is surrounded on its light-exiting sides by the molding composition.

公开(公告)号：US07436002B2

公开(公告)日：2008-10-14

申请号：US10747703

申请日：2003-12-29

申请人： Herbert Brunner ,  Klaus Höhn ,  Harald Jäger ,  Josef Schmid

发明人： Herbert Brunner ,  Klaus Höhn ,  Harald Jäger ,  Josef Schmid

IPC分类号： H01L33/00 ,  H05K3/34

CPC分类号： H01L33/486 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip.

摘要翻译： 辐射发射表面可安装部件具有安装在引线框架上的发光二极管芯片。 成型材料封装引线框和发光二极管芯片。

公开(公告)号：US09281453B2

公开(公告)日：2016-03-08

申请号：US13995847

申请日：2011-12-07

申请人： Markus Pindl ,  Harald Jäger ,  Stephan Preuβ ,  Herbert Brunner

发明人： Markus Pindl ,  Harald Jäger ,  Stephan Preuβ ,  Herbert Brunner

IPC分类号： H01L21/00 ,  H01L33/50 ,  H01L33/54

CPC分类号： H01L33/50 ,  H01L33/508 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip.

摘要翻译： 制造光电子部件的方法包括提供空腔; 将其中分布有荧光体颗粒的液体基质材料引入所述空腔中; 将半导体芯片引入基体材料中; 沉淀基体材料中的荧光体颗粒; 并固化所述基体材料，其中产生包含荧光体颗粒的转换层，所述转换层布置在所述半导体芯片上。

公开(公告)号：US20130240935A1

公开(公告)日：2013-09-19

申请号：US13807342

申请日：2011-06-27

申请人： Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

发明人： Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

IPC分类号： H01L33/60 ,  H01L31/0232 ,  H01L31/18

CPC分类号： H01L33/60 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

摘要： A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing, the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary earner; and producing individual surface-mountable semiconductor components by severing the molding.

摘要翻译： 一种制造可表面安装的半导体部件的方法，包括提供由塑料材料制成的辅助载体; 将至少一个插入件和至少一个光电子部件施加到辅助载体的安装表面; 将光电子部件和插入件封装在共同的模制件中，其中模制件至少在光电部件和插入件彼此不直接接触的位置处适配地覆盖光电子部件和插入件，并且光电子部件和 插入件通过模制机械连接在一起; 移除辅助工具; 并通过切割模制件来生产单个的可表面安装的半导体部件。

公开(公告)号：US07666715B2

公开(公告)日：2010-02-23

申请号：US10578854

申请日：2004-12-14

申请人： Herbert Brunner ,  Harald Jäger ,  Jörg Erich Sorg

发明人： Herbert Brunner ,  Harald Jäger ,  Jörg Erich Sorg

IPC分类号： H01L23/31

CPC分类号： H01L33/56 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/501 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00014

摘要： A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.

摘要翻译： 包含辐射发射和/或辐射接收半导体芯片的辐射发射和/或辐射接收半导体部件，对半导体部件要发射和/或接收的电磁辐射透明的模制塑料部件 半导体芯片至少部分地包覆成型，以及电连接到半导体芯片的电接触区域的外部电引线。 模制塑料部件由反应固化硅树脂模塑料制成。 还规定了制造这种半导体部件的方法。

公开(公告)号：US07319245B2

公开(公告)日：2008-01-15

申请号：US11487742

申请日：2006-07-17

申请人： Herbert Brunner ,  Alexandra Debray ,  Harald Jäger ,  Günther Waitl

发明人： Herbert Brunner ,  Alexandra Debray ,  Harald Jäger ,  Günther Waitl

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A radiation-emitting semiconductor component, comprising a semiconductor body which emits a primary light, a luminescent conversion element which emits fluorescent light, in which the luminescent conversion element comprises a suspension of a luminous substance in a matrix material, wherein the luminescent conversion element is in direct contact with a part of the surface of said semiconductor body, and wherein the fluorescent light emitted from said luminescent conversion element is approximately half the total emission of the light of the radiation-emitting semiconductor component.

摘要翻译： 一种辐射发射半导体部件，包括发射一次光的半导体本体，发射荧光的发光转换元件，其中发光转换元件包括基质材料中的发光物质的悬浮液，其中发光转换元件为 与所述半导体本体的表面的一部分直接接触，并且其中从所述发光转换元件发射的荧光大约是辐射发射半导体部件的光的总发射的一半。

公开(公告)号：US20130334558A1

公开(公告)日：2013-12-19

申请号：US13995847

申请日：2011-12-07

申请人： Markus Pindl ,  Harald Jäger ,  Stephan Preuss ,  Herbert Brunner

发明人： Markus Pindl ,  Harald Jäger ,  Stephan Preuss ,  Herbert Brunner

IPC分类号： H01L33/50

CPC分类号： H01L33/50 ,  H01L33/508 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip.

摘要翻译： 制造光电子部件的方法包括提供空腔; 将其中分布有荧光体颗粒的液体基质材料引入所述空腔中; 将半导体芯片引入基体材料中; 沉淀基体材料中的荧光体颗粒; 并固化所述基体材料，其中产生包含荧光体颗粒的转换层，所述转换层布置在所述半导体芯片上。

公开(公告)号：US08247263B2

公开(公告)日：2012-08-21

申请号：US11885374

申请日：2006-02-28

申请人： Bert Braune ,  Herbert Brunner ,  Harald Jäger ,  Jörg Sorg

发明人： Bert Braune ,  Herbert Brunner ,  Harald Jäger ,  Jörg Sorg

IPC分类号： H01L51/40

CPC分类号： C08G59/4215 ,  B29C45/0001 ,  B29C45/02 ,  B29K2083/00 ,  B29K2105/0005 ,  B29L2011/00 ,  C08G59/3245 ,  C08G77/06 ,  C08G77/42 ,  C08G77/455 ,  C08L63/00 ,  C08L83/00 ,  C08L83/04 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/12044 ,  C08L2666/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to a method for producing an optical and a radiation-emitting component by a molding process, and to an optical and a radiation-emitting component having well-defined viscosity.

摘要翻译： 本发明涉及一种通过模制方法制造光学和辐射发射部件的方法，以及具有明确界定的粘度的光学和辐射发射部件的方法。

公开(公告)号：US07078253B2

公开(公告)日：2006-07-18

申请号：US10918100

申请日：2004-08-13

申请人： Herbert Brunner ,  Alexandra Debray ,  Harald Jäger ,  Günther Waitl

发明人： Herbert Brunner ,  Alexandra Debray ,  Harald Jäger ,  Günther Waitl

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The invention describes a radiation-emmitting semiconductor component with luminescence conversion element (7), in the case of which the semiconductor body (3) is arranged in a recess in the basic body (1). Within the recess, there is shaped around the semiconductor body a bowl-like region which contains the luminescence conversion element (7) and envelopes the semiconductor body (3). The bowl-like region is formed as a depression within the recess or as an annular enclosure (6) on the base of the recess.

摘要翻译： 本发明描述了一种具有发光转换元件（7）的辐射发射半导体部件，其中半导体本体（3）布置在基体（1）的凹部中。 在凹部内，围​​绕半导体本体形成包含发光转换元件（7）并包封半导体本体（3）的碗状区域。 碗状区域形成为在凹部内的凹陷或者形成为在凹部的基部上的环形外壳（6）。