公开(公告)号：US07919150B2

公开(公告)日：2011-04-05

申请号：US10580798

申请日：2004-11-24

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

IPC分类号： B05D5/00 ,  B05D1/38 ,  B05D3/10

CPC分类号： C08J7/047 ,  C08J2383/04 ,  C08J2483/00 ,  C08K5/56 ,  C09D183/04 ,  Y10T428/31663 ,  C08L83/00

摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。

公开(公告)号：US07282270B2

公开(公告)日：2007-10-16

申请号：US10530693

申请日：2003-09-08

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Atsushi Togashi ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Atsushi Togashi ,  Hiroji Enami

IPC分类号： B32B9/04

CPC分类号： C08K5/5419 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/04 ,  C08L2205/02 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

摘要翻译： 可固化的有机聚硅氧烷组合物包括：（A）每分子具有至少两个硅键合的烯基和至少一个与硅键合的芳基的直链有机聚硅氧烷; （B）具有由以下通式表示的硅氧烷单元的支链有机聚硅氧烷：其中R是取代或未取代的单价烃基，并且每分子具有至少一个硅 - 键合的烯基和至少一个与硅键合的芳基; （C）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 以及具有涂覆有上述组成的固化体的半导体元件的半导体器件。

公开(公告)号：US20070216021A1

公开(公告)日：2007-09-20

申请号：US10584032

申请日：2004-12-07

申请人： Yoshitsugu Morita ,  Katsutoshi Mine ,  Junji Nakanishi ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Katsutoshi Mine ,  Junji Nakanishi ,  Hiroji Enami

IPC分类号： H01L21/56 ,  H01L23/053

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04 ,  H01L21/566 ,  H01L23/3128 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  C08L83/00 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85

摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.

摘要翻译： 一种制造半导体器件的方法，其通过将半导体器件放置在模具中并对填充所述模具和所述半导体器件之间的空间的可固化硅氧烷组合物进行压塑而密封在固化的硅氧烷体中，其中所述可固化有机硅组合物包含以下 组分：（A）每分子具有至少两个烯基的有机聚硅氧烷; （B）每分子具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）铂型催化剂; 和（D）填料，其中组分（A）和（B）中的至少一种含有T单元硅氧烷和/或Q-单元硅氧烷。 通过利用该方法，密封半导体器件在密封材料中没有空隙，并且可以控制固化的硅氧烷体的厚度。

公开(公告)号：US06265480B1

公开(公告)日：2001-07-24

申请号：US09548861

申请日：2000-04-13

申请人： Hiroji Enami ,  Akihiro Nakamura

发明人： Hiroji Enami ,  Akihiro Nakamura

IPC分类号： C08L8304

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/00 ,  C08L2666/28

摘要： A silicone gel composition comprising (A) 100 parts by weight of an organopolysiloxane comprising 80 to 98 mole % of R(CH3)SiO2/2 units, 0.1 to 10.0 mole % of RSiO3/2 units, and 0.1 to 10 mole % of R(CH3)2SiO1/2 units, wherein R is methyl, phenyl, or alkenyl, and provided 0.25 to 4.0 mole % the R groups in the organopolysiloxane are alkenyl; (B) an organopolysiloxane having an average of at least 2 silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from 0.1 to 5 silicon-bonded hydrogen atoms per alkenyl group in component (A); (C) a platinum catalyst; (D) 0.01 to 10 parts by weight of a silica powder; and (E) 0.01 to 5 parts by weight of a thixotropic agent selected from at least one epoxy compound, at least one polyhydric alcohol, and mixtures thereof; wherein the silicone gel composition has an apparent viscosity ratio of 2.0 to 10.0 and cures to form a silicone gel having a ¼ consistency of 10 to 200.

摘要翻译： 一种硅凝胶组合物，其包含（A）100重量份的包含80至98摩尔％的R（CH 3）SiO 2/2单元，0.1至10.0摩尔％的RSiO 3/2单元和0.1至10摩尔％的R （CH 3）2 SiO 1/2单元，其中R为甲基，苯基或烯基，并且所述有机聚硅氧烷中的R基团为0.25〜4.0摩尔％为链烯基; （B）每分子平均具有至少2个硅键合的氢原子的有机聚硅氧烷，其量足以在组分（A）中每个烯基提供0.1至5个与硅键合的氢原子; （C）铂催化剂; （D）0.01〜10重量份二氧化硅粉末; 和（E）0.01至5重量份的选自至少一种环氧化合物，至少一种多元醇及其混合物的触变剂; 其中所述硅凝胶组合物的表观粘度比为2.0至10.0，并且固化以形成¼稠度为10至200的硅凝胶。

公开(公告)号：US6001943A

公开(公告)日：1999-12-14

申请号：US14557

申请日：1998-01-28

申请人： Hiroji Enami ,  Yuji Hamada ,  Akihiro Nakamura ,  Takeaki Saiki

发明人： Hiroji Enami ,  Yuji Hamada ,  Akihiro Nakamura ,  Takeaki Saiki

IPC分类号： C08L83/05 ,  C08L83/04 ,  C08L83/07 ,  H01L23/29 ,  H01L23/31 ,  C08G77/08

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20

摘要： The present invention provides a silicone gel composition for use in sealing and filling of electrical and electronic parts, which are characterized by the fact that when said composition is cured, said composition forms a silicone gel in which the loss elastic modulus at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and in which the complex elastic modulus is 1.0.times.10.sup.5 Pa or less, and a silicone gel which is characterized by the fact that in a silicone gel which seals or fills electrical or electronic parts, the loss elastic modulus of this silicone gel at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and the complex elastic modulus is 1.0.times.10.sup.5 Pa or less.

摘要翻译： 本发明提供一种用于密封和填充电气和电子部件的硅凝胶组合物，其特征在于当所述组合物固化时，所述组合物形成硅凝胶，其中在25℃的温度下的损耗弹性模量 ℃，0.1Hz的剪切频率为1.0×10 2〜1.0×10 4 Pa，复数弹性模量为1.0×10 5 Pa以下，硅胶凝胶的特征在于，在硅凝胶中密封或 填充电气或电子部件，该硅酮凝胶在25℃的温度和0.1Hz的剪切频率下的损耗弹性模量为1.0×10 2至1.0×10 4 Pa，复数弹性模量为1.0×10 5 Pa以下。

公开(公告)号：US08080614B2

公开(公告)日：2011-12-20

申请号：US12306049

申请日：2007-06-18

申请人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Makoto Yoshitake

发明人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Makoto Yoshitake

IPC分类号： C08L83/04

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  H01L2224/48091 ,  H01L2924/1301 ,  C08L83/00 ,  C08L2666/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.

摘要翻译： 可固化的有机聚硅氧烷组合物至少包含以下组分：由以下通式表示的有机聚硅氧烷（A）：R13SiO（R12SiO）mSiR13（其中R1是一价烃基，“m”是0-100的整数）; 由下列平均单元式表示的有机聚硅氧烷（B）：（R2SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（其中R2是一价烃基，“a”，“b”和 “c”是具体数字）; 在一个分子中平均具有至少两个与硅键合的芳基和平均至少两个与硅键合的氢原子的有机聚硅氧烷（C）; 和氢化硅烷化反应催化剂（D）; 其特征在于良好的填充性和固化性，并且当固化时，形成具有高折射率，高透光率和对各种基材的强粘附性的固化体。

公开(公告)号：US20090118441A1

公开(公告)日：2009-05-07

申请号：US12093053

申请日：2006-11-08

申请人： Shinichi Yamamoto ,  Tomoko Kato ,  Hiroji Enami ,  Yoshitsugu Morita

发明人： Shinichi Yamamoto ,  Tomoko Kato ,  Hiroji Enami ,  Yoshitsugu Morita

IPC分类号： C08L83/05

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08L83/00 ,  C08K5/56

摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.

摘要翻译： 至少包含以下组分的可固化的硅氧烷组合物：（A）在一个分子中具有至少两个烯基的二有机聚硅氧烷; （B）将至少两种具有不同质均分子量的树脂状有机聚硅氧烷降低成标准聚苯乙烯测量的凝胶渗透色谱法，并由SiO 4/2单元，R 12 R 2 SiO 1/2单元和R 13 SiO 1/2单元组成，其中R 1 是不含脂族不饱和键的任意取代的一价烃基，R 2是烯基; （C）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 具有优异的流动性和填充能力，并且即使组合物含有形成具有适当强度和硬度的固化的硅氧烷体所需的树脂状有机聚硅氧烷，也可以制备而不具有极高的粘度。

公开(公告)号：US20070282058A1

公开(公告)日：2007-12-06

申请号：US10584655

申请日：2004-12-20

申请人： Yoshitsugu Morita ,  Minoru Isshiki ,  Hiroshi Ueki ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Minoru Isshiki ,  Hiroshi Ueki ,  Hiroji Enami

IPC分类号： C08L83/00 ,  C08G77/04

CPC分类号： C08L63/00 ,  C08G59/306 ,  C08G59/3254 ,  C08L83/06 ,  C08L83/00

摘要： A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.

摘要翻译： 一种可固化有机硅组合物，其包含：（A）具有支链分子结构并在一个分子中含有至少两个具有酚羟基的一价烃基的有机聚硅氧烷; （B）具有至少两个不含芳环的环氧基的单价羟基的直链有机聚硅氧烷; 和（C）固化促进剂。

公开(公告)号：US6075112A

公开(公告)日：2000-06-13

申请号：US388707

申请日：1999-09-02

申请人： Masakazu Irie ,  Takahiro Sato ,  Hiroji Enami

发明人： Masakazu Irie ,  Takahiro Sato ,  Hiroji Enami

IPC分类号： E02D27/34 ,  C08K3/00 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  E02D31/08 ,  E04H9/02 ,  F16F15/04 ,  C08G77/06

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  E02D27/34 ,  E02D31/08

摘要： A curable silicone composition for a vibration-isolating laminate comprising (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule and a viscosity of 10-100,000 mPa.s at 25.degree. C.; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and a viscosity of 1-100,000 mPa.s at 25.degree. C. in an amount such that this component contains 0.2-5 mol of silicon atom-bonded hydrogen atoms per mole of alkenyl groups in component (A); (C) 1-300 parts by weight of an inorganic filler; and (D) a hydrosilylation catalyst in an amount sufficient to cure the composition, designed for forming a cured silicone product for a vibration-isolating laminate by laminating a metal layer and a cured silicone layer having a loss factor of 0.4 or greater and a storage modulus of 1.0.times.10.sup.5 dyne/cm.sup.2 or greater at 25.degree. C. and a shear frequency of 0.2 Hz.

摘要翻译： 一种用于隔振层压体的可固化硅氧烷组合物，其包含（A）每分子100重量份具有至少两个烯基的有机聚硅氧烷，在25℃下的粘度为10-100,000mPa.s。 （B）每分子具有至少两个硅原子键合的氢原子的有机聚硅氧烷，在25℃下的粘度为1-100,000mPa.s，其量使得该组分含有0.2-5mol硅原子键合的氢 成分（A）中每摩尔烯基的原子数; （C）1-300重量份的无机填料; 和（D）氢化硅烷化催化剂，其量足以固化组合物，其设计用于通过层压金属层和具有0.4或更大的损耗因子的固化的硅氧烷层形成用于隔振层压体的固化的硅氧烷产品和储存 在25℃下的模量为1.0×10 5达因/ cm 2或更高，剪切频率为0.2Hz。

公开(公告)号：US5548038A

公开(公告)日：1996-08-20

申请号：US404405

申请日：1995-03-14

申请人： Hiroji Enami ,  Takeaki Saiki

发明人： Hiroji Enami ,  Takeaki Saiki

IPC分类号： C08L83/05 ,  C08L83/04 ,  C08L83/07 ,  C08F283/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70

摘要： The present invention provides organosiloxane compositions that cure to optically transparent gels by a hydrosilation reaction and contain a) two types of alkenyl-substituted organopolysiloxanes, and b) a diorganopolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule that are located on non-terminal silicon atoms. The molar ratio of silicon-bonded hydrogen atoms to alkenyl radicals in the composition is from 0.1 to 1.2.

摘要翻译： 本发明提供了通过硅氢化反应固化成光学透明凝胶并含有a）两种烯基取代的有机聚硅氧烷的有机硅氧烷组合物，和b）每个分子平均含有至少两个与硅键合的氢原子的二有机聚硅氧烷，每个分子位于 在非端子硅原子上。 硅键合的氢原子与烯基的摩尔比在组合物中为0.1至1.2。