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公开(公告)号：US20070216021A1
公开(公告)日：2007-09-20
申请号：US10584032
申请日：2004-12-07
IPC分类号： H01L21/56 , H01L23/053
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08L83/04 , H01L21/566 , H01L23/3128 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/97 , H01L2924/01029 , H01L2924/12042 , H01L2924/181 , C08L83/00 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/85
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.
摘要翻译： 一种制造半导体器件的方法，其通过将半导体器件放置在模具中并对填充所述模具和所述半导体器件之间的空间的可固化硅氧烷组合物进行压塑而密封在固化的硅氧烷体中，其中所述可固化有机硅组合物包含以下 组分：（A）每分子具有至少两个烯基的有机聚硅氧烷; （B）每分子具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）铂型催化剂; 和（D）填料，其中组分（A）和（B）中的至少一种含有T单元硅氧烷和/或Q-单元硅氧烷。 通过利用该方法，密封半导体器件在密封材料中没有空隙，并且可以控制固化的硅氧烷体的厚度。
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公开(公告)号：US07651958B2
公开(公告)日：2010-01-26
申请号：US10584032
申请日：2004-12-07
IPC分类号： H01L21/31
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08L83/04 , H01L21/566 , H01L23/3128 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/97 , H01L2924/01029 , H01L2924/12042 , H01L2924/181 , C08L83/00 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/85
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.
摘要翻译： 一种制造半导体器件的方法，其通过将半导体器件放置在模具中并对填充所述模具和所述半导体器件之间的空间的可固化硅氧烷组合物进行压塑而密封在固化的硅氧烷体中，其中所述可固化有机硅组合物包含以下 组分：（A）每分子具有至少两个烯基的有机聚硅氧烷; （B）每分子具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）铂型催化剂; 和（D）填料，其中组分（A）和（B）中的至少一种含有T单元硅氧烷和/或Q-单元硅氧烷。 通过利用该方法，密封半导体器件在密封材料中没有空隙，并且可以控制固化的硅氧烷体的厚度。
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3.发明申请Light Emitting Device Encapsulated with Silicones and Curable Silicone Compositions for Preparing the Silicones 有权用硅酮封装的发光装置和用于制备硅氧烷的可固化硅酮组合物公开(公告)号：US20100276721A1
公开(公告)日：2010-11-04
申请号：US12223133
申请日：2007-02-01
申请人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
发明人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
摘要翻译： 组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。 通过将组合物施加到光源上然后固化来制造发光器件。 组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。
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公开(公告)号：US20070134425A1
公开(公告)日：2007-06-14
申请号：US10580798
申请日：2004-11-24
申请人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
CPC分类号： C08J7/047 , C08J2383/04 , C08J2483/00 , C08K5/56 , C09D183/04 , Y10T428/31663 , C08L83/00
摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.
摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。
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5.发明申请Curable organopolysiloxane composition and a semiconductor device made with the use of this composition 有权可固化的有机聚硅氧烷组合物和使用该组合物制成的半导体器件公开(公告)号：US20060073347A1
公开(公告)日：2006-04-06
申请号：US10530693
申请日：2003-09-08
申请人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
CPC分类号： C08K5/5419 , C08G77/12 , C08G77/20 , C08G77/70 , C08K5/56 , C08L83/04 , C08L2205/02 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/1301 , H01L2924/181 , H01L2924/3025 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.
摘要翻译： 可固化的有机聚硅氧烷组合物包括：（A）每分子具有至少两个硅键合的烯基和至少一个与硅键合的芳基的直链有机聚硅氧烷; （B）具有由以下通式表示的硅氧烷单元的支链有机聚硅氧烷：其中R是取代或未取代的单价烃基，并且每分子具有至少一个硅 - 键合的烯基和至少一个与硅键合的芳基; （C）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 以及具有涂覆有上述组成的固化体的半导体元件的半导体器件。
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公开(公告)号：US07919150B2
公开(公告)日：2011-04-05
申请号：US10580798
申请日：2004-11-24
申请人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
CPC分类号： C08J7/047 , C08J2383/04 , C08J2483/00 , C08K5/56 , C09D183/04 , Y10T428/31663 , C08L83/00
摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.
摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。
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7.发明授权Curable organopolysiloxane composition and a semiconductor device made with the use of this composition 有权可固化的有机聚硅氧烷组合物和使用该组合物制成的半导体器件公开(公告)号：US07282270B2
公开(公告)日：2007-10-16
申请号：US10530693
申请日：2003-09-08
申请人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
IPC分类号： B32B9/04
CPC分类号： C08K5/5419 , C08G77/12 , C08G77/20 , C08G77/70 , C08K5/56 , C08L83/04 , C08L2205/02 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/1301 , H01L2924/181 , H01L2924/3025 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.
摘要翻译： 可固化的有机聚硅氧烷组合物包括：（A）每分子具有至少两个硅键合的烯基和至少一个与硅键合的芳基的直链有机聚硅氧烷; （B）具有由以下通式表示的硅氧烷单元的支链有机聚硅氧烷：其中R是取代或未取代的单价烃基，并且每分子具有至少一个硅 - 键合的烯基和至少一个与硅键合的芳基; （C）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 以及具有涂覆有上述组成的固化体的半导体元件的半导体器件。
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8.发明授权Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones 有权用硅氧烷封装的发光器件和用于制备硅氧烷的可固化硅氧烷组合物公开(公告)号：US08258502B2
公开(公告)日：2012-09-04
申请号：US12223133
申请日：2007-02-01
申请人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
发明人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
IPC分类号： H01L35/24
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
摘要翻译： 组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。 通过将组合物施加到光源上然后固化来制造发光器件。 组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。
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公开(公告)号：US08153202B2
公开(公告)日：2012-04-10
申请号：US13009982
申请日：2011-01-20
申请人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
CPC分类号： C08J7/047 , C08J2383/04 , C08J2483/00 , C08K5/56 , C09D183/04 , Y10T428/31663 , C08L83/00
摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.
摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。
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公开(公告)号：US08044153B2
公开(公告)日：2011-10-25
申请号：US12093053
申请日：2006-11-08
摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.
摘要翻译： 至少包含以下组分的可固化的硅氧烷组合物：（A）在一个分子中具有至少两个烯基的二有机聚硅氧烷; （B）将至少两种具有不同质均分子量的树脂状有机聚硅氧烷降低成标准聚苯乙烯测量的凝胶渗透色谱法，并由SiO 4/2单元，R 12 R 2 SiO 1/2单元和R 13 SiO 1/2单元组成，其中R 1 是不含脂族不饱和键的任意取代的一价烃基，R 2是烯基; （C）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 具有优异的流动性和填充能力，并且即使组合物含有形成具有适当强度和硬度的固化的硅氧烷体所需的树脂状有机聚硅氧烷，也可以制备而不具有极高的粘度。
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