公开(公告)号：US07378349B2

公开(公告)日：2008-05-27

申请号：US11102639

申请日：2005-04-11

申请人： Tomohisa Konno ,  Hirotaka Shida ,  Kiyonobu Kubota ,  Masayuki Hattori ,  Nobuo Kawahashi

发明人： Tomohisa Konno ,  Hirotaka Shida ,  Kiyonobu Kubota ,  Masayuki Hattori ,  Nobuo Kawahashi

IPC分类号： H01L21/461

CPC分类号： C09G1/02 ,  C09K3/1463 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76819

摘要： Disclosed is a chemical mechanical polishing aqueous dispersion comprising (A1) first fumed silica having a specific surface area of not less than 10 m2/g and less than 160 m2/g and an average secondary particle diameter of not less than 170 nm and not more than 250 nm and (A2) second fumed silica having a specific surface area of not less than 160 m2/g and an average secondary particle diameter of not less than 50 nm and less than 170 nm. Also disclosed is a chemical mechanical polishing method using the chemical mechanical polishing aqueous dispersion. According to the chemical mechanical polishing aqueous dispersion and the chemical mechanical polishing method, a chemical mechanical polishing process wherein a barrier metal layer and a cap layer can be efficiently removed by polishing and damage to an insulating film material of a low dielectric constant present in the underlying layer is reduced can be carried out.

摘要翻译： 公开了一种化学机械抛光水分散体，其包含（A1）比表面积不小于10m 2 / g且小于160m 2 / g的第一热解法二氧化硅， g，平均二次粒径为170nm以上250nm以下，（A2）比表面积为160m 2 / g以上的第二热解法二氧化硅，平均 二次粒径不小于50nm且小于170nm。 还公开了使用化学机械研磨水分散体的化学机械研磨方法。 根据化学机械抛光水分散体和化学机械抛光方法，化学机械抛光方法可以通过抛光和损坏存在于介质中的低介电常数的绝缘薄膜材料来有效地去除阻挡金属层和盖层 底层减少可以进行。

公开(公告)号：US20080274620A1

公开(公告)日：2008-11-06

申请号：US12164320

申请日：2008-06-30

申请人： Hirotaka SHIDA ,  Tomohisa Konno ,  Masayuki Hattori ,  Nobuo Kawahashi

发明人： Hirotaka SHIDA ,  Tomohisa Konno ,  Masayuki Hattori ,  Nobuo Kawahashi

IPC分类号： H01L21/302

CPC分类号： C09G1/02 ,  H01L21/3212

摘要： A chemical mechanical polishing method of the present invention comprises conducting polishing by the use of a chemical mechanical polishing aqueous dispersion (A) containing abrasive grains and then conducting polishing by the use of a chemical mechanical polishing aqueous composition (B) containing at least one organic compound having a heterocyclic ring in addition to the chemical mechanical polishing aqueous dispersion (A). Also A chemical mechanical polishing agent kit of the present invention comprises the chemical mechanical polishing aqueous dispersion (A) and the chemical mechanical polishing aqueous composition (B). The polishing method and the polishing agent kit can prevent an increase of dishing and corrosion of wiring portion to enhance the yield.

摘要翻译： 本发明的化学机械抛光方法包括通过使用含有磨粒的化学机械抛光水分散体（A）进行抛光，然后通过使用含有至少一种有机物的化学机械抛光含水组合物（B）进行抛光 除了化学机械研磨水分散体（A）之外还具有杂环的化合物。 本发明的化学机械研磨剂试剂盒也包括化学机械研磨用水分散体（A）和化学机械研磨用水性组合物（B）。 抛光方法和抛光剂套件可以防止布线部分的凹陷和腐蚀增加以提高产量。

公开(公告)号：US20060186089A1

公开(公告)日：2006-08-24

申请号：US11358224

申请日：2006-02-22

申请人： Hirotaka Shida ,  Masayuki Hattori

发明人： Hirotaka Shida ,  Masayuki Hattori

IPC分类号： C03C15/00 ,  B44C1/22 ,  C23F1/00

CPC分类号： C09G1/02 ,  H01L21/3212

摘要： A chemical mechanical polishing method, including: chemically and mechanically polishing a polishing target surface by continuously performing a first polishing step and a second polishing step having a polishing rate lower than a polishing rate of the first polishing step, a chemical mechanical polishing aqueous dispersion used in the first polishing step and the second polishing step being a mixture of an aqueous dispersion and an aqueous solution, and the polishing rate being changed between the first polishing step and the second polishing step by changing a mixing ratio of the aqueous dispersion and the aqueous solution.

公开(公告)号：US20050227451A1

公开(公告)日：2005-10-13

申请号：US11102639

申请日：2005-04-11

申请人： Tomohisa Konno ,  Hirotaka Shida ,  Kiyonobu Kubota ,  Masayuki Hattori ,  Nobuo Kawahashi

发明人： Tomohisa Konno ,  Hirotaka Shida ,  Kiyonobu Kubota ,  Masayuki Hattori ,  Nobuo Kawahashi

IPC分类号： C09G1/02 ,  H01L21/76

CPC分类号： C09G1/02 ,  C09K3/1463 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/76819

摘要： Disclosed is a chemical mechanical polishing aqueous dispersion comprising (A1) first fumed silica having a specific surface area of not less than 10 m2/g and less than 160 m2/g and an average secondary particle diameter of not less than 170 nm and not more than 250 nm and (A2) second fumed silica having a specific surface area of not less than 160 m2/g and an average secondary particle diameter of not less than 50 nm and less than 170 nm. Also disclosed is a chemical mechanical polishing method using the chemical mechanical polishing aqueous dispersion. According to the chemical mechanical polishing aqueous dispersion and the chemical mechanical polishing method, a chemical mechanical polishing process wherein a barrier metal layer and a cap layer can be efficiently removed by polishing and damage to an insulating film material of a low dielectric constant present in the underlying layer is reduced can be carried out.

摘要翻译： 公开了一种化学机械抛光水分散体，其包含（A1）比表面积不小于10m 2 / g且小于160m 2 / g的第一热解法二氧化硅， g，平均二次粒径为170nm以上250nm以下，（A2）比表面积为160m 2 / g以上的第二热解法二氧化硅，平均 二次粒径不小于50nm且小于170nm。 还公开了使用化学机械研磨水分散体的化学机械研磨方法。 根据化学机械抛光水分散体和化学机械抛光方法，化学机械抛光方法可以通过抛光和损坏存在于介质中的低介电常数的绝缘薄膜材料来有效地去除阻挡金属层和盖层 底层减少可以进行。

公开(公告)号：US07005382B2

公开(公告)日：2006-02-28

申请号：US10694890

申请日：2003-10-29

申请人： Kazuo Nishimoto ,  Tatsuaki Sakano ,  Akihiro Takemura ,  Masayuki Hattori ,  Nobuo Kawahashi ,  Naoto Miyashita ,  Atsushi Shigeta ,  Yoshitaka Matsui ,  Kazuhiko Ida

发明人： Kazuo Nishimoto ,  Tatsuaki Sakano ,  Akihiro Takemura ,  Masayuki Hattori ,  Nobuo Kawahashi ,  Naoto Miyashita ,  Atsushi Shigeta ,  Yoshitaka Matsui ,  Kazuhiko Ida

IPC分类号： B24B1/00

CPC分类号： H01L21/3212 ,  C09G1/02 ,  H01L21/02024

摘要： Provided are an aqueous dispersion for chemical mechanical polishing, which planarizes a surface to be polished and has high shelf stability, a chemical mechanical polishing process excellent in selectivity when surfaces of different materials are polished, and a production process of a semiconductor device. A first aqueous dispersion contains a water-soluble quaternary ammonium salt, an inorganic acid salt, abrasive grains and an aqueous medium. A second aqueous dispersion contains at least a water-soluble quaternary ammonium salt, another basic organic compound other than the water-soluble quaternary ammonium salt, an inorganic acid salt, a water-soluble polymer, abrasive grains and an aqueous medium. The second aqueous dispersion is composed of a first aqueous dispersion material (I) obtained by mixing a water-soluble quaternary ammonium salt and an inorganic acid salt into an aqueous medium, and a second aqueous dispersion material (II) obtained by mixing a water-soluble polymer and another basic organic compound other than the water-soluble quaternary ammonium salt into an aqueous medium. Abrasive grains are contained in at least one of the aqueous dispersion materials.

摘要翻译： 提供了用于化学机械抛光的水分散体，其平坦化待抛光的表面并具有高的储存稳定性，当抛光不同材料的表面时选择性优异的化学机械抛光工艺以及半导体器件的生产工艺。 第一种水性分散体含有水溶性季铵盐，无机酸盐，磨粒和水性介质。 第二水性分散体至少包含水溶性季铵盐，除水溶性季铵盐以外的其它碱性有机化合物，无机酸盐，水溶性聚合物，磨料颗粒和水性介质。 第二水性分散体由通过将水溶性季铵盐和无机酸盐混合到水性介质中而得到的第一水分散体（I）和第二水分散体（II） 水溶性聚合物和除了水溶性季铵盐之外的另一种碱性有机化合物转化成水性介质。 磨粒在至少一种水分散体中含有。

公开(公告)号：US06409780B1

公开(公告)日：2002-06-25

申请号：US09482937

申请日：2000-01-14

申请人： Hiroyuki Yano ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Kiyonobu Kubota

发明人： Hiroyuki Yano ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Kiyonobu Kubota

IPC分类号： C09K314

CPC分类号： C09G1/02 ,  C09K3/1463

摘要： Water-laden solid matter is provided which is obtained by adding 40 to 300 weight parts of water to 100 weight parts of inorganic oxide particles synthesized by fumed process or metal evaporation oxidation process, slurry for polishing is provided which is manufactured by using the water-laden solid matter, and a method for manufacturing a semiconductor device using the above slurry. Said water-laden solid matter is within a range of 0.3 to 3 g/cm3 in bulk density and within a range of 0.5 to 100 mm&phgr; in average particle size when manufactured granular. Said slurry for polishing is manufactured from the water-laden solid matter, and the average particle size thereof after being dispersed in water is within a range of 0.05 to 1.0 &mgr;m.

摘要翻译： 提供含水固体物质，其通过向通过热解法或金属蒸发氧化法合成的100重量份的无机氧化物颗粒中加入40至300重量份的水而获得，提供了通过使用水 - 负载固体物质，以及使用上述浆料制造半导体器件的方法。 所述含水固体物质的体积密度为0.3〜3g / cm 3，制粒时的平均粒径为0.5〜100mmφ的范围。 用于抛光的所述浆料由含水固体物质制成，其在分散在水中的平均粒径在0.05-1.0μm的范围内。

公开(公告)号：US08437426B2

公开(公告)日：2013-05-07

申请号：US12567856

申请日：2009-09-28

申请人： Hidetoshi Kawauchi ,  Masayuki Hattori ,  Toshiyuki Miyauchi ,  Takashi Yokokawa ,  Kazuhiro Shimizu ,  Kazuhisa Funamoto

发明人： Hidetoshi Kawauchi ,  Masayuki Hattori ,  Toshiyuki Miyauchi ,  Takashi Yokokawa ,  Kazuhiro Shimizu ,  Kazuhisa Funamoto

IPC分类号： H04B1/38 ,  H04N7/12 ,  H04L27/00

CPC分类号： H04L27/2662 ,  H04L25/0232 ,  H04L25/03159 ,  H04L27/2656 ,  H04L27/2665

摘要： Disclosed herein is a receiving apparatus including: first to third position determination sections configured to determine the start position of an FFT interval which serves as a signal interval targeted for FFT by an FFT section; a selection section configured to select one of those start positions of the FFT interval which are determined by the first through the third position determination section; and the FFT section configured to perform FFT on the OFDM time domain signal by regarding the start position selected by the selection section as the start position of the FFT interval in order to generate the first OFDM frequency domain signal.

摘要翻译： 本发明公开了一种接收装置，包括：第一至第三位置确定部分，被配置为确定FFT间隔的起始位置，其作为由FFT部分进行FFT的信号间隔; 选择部，被配置为选择由所述第一至第三位置确定部确定的所述FFT间隔的那些起始位置之一; FFT部，被配置为通过将由选择部选择出的开始位置作为FFT间隔的开始位置，对OFDM时域信号进行FFT，以生成第一OFDM频域信号。

公开(公告)号：US07929628B2

公开(公告)日：2011-04-19

申请号：US11900636

申请日：2007-09-11

申请人： Hidetoshi Kawauchi ,  Masayuki Hattori

发明人： Hidetoshi Kawauchi ,  Masayuki Hattori

IPC分类号： H04L27/28

CPC分类号： H04L25/0234 ,  H04L25/0216 ,  H04L25/022 ,  H04L25/0222 ,  H04L25/025 ,  H04L25/03159 ,  H04L27/2647 ,  H04L2025/03414

摘要： An OFDM receiver may include OFDM-signal receiving means for receiving an orthogonal frequency division multiplexing (OFDM) signal; channel-characteristic estimating means for estimating a channel characteristic using pilot signals in the OFDM signal received by the OFDM-signal receiving means; and transmission-distortion compensating means for applying, on the basis of the channel characteristic estimated by the channel-characteristic estimating means, processing for compensating for transmission distortion to the OFDM signal received by the OFDM-signal receiving means. The channel-characteristic estimating means may include plural kinds of time-direction-channel estimating means used for the estimation of a channel characteristic, and switching control means for switching these estimating means according to a state of a channel.

摘要翻译： OFDM接收机可以包括用于接收正交频分复用（OFDM）信号的OFDM信号接收装置; 信道特性估计装置，用于使用由OFDM信号接收装置接收的OFDM信号中的导频信号来估计信道特性; 以及发送失真补偿装置，用于根据由信道特性估计装置估计的信道特性，应用用于补偿由OFDM信号接收装置接收的OFDM信号的发送失真的处理。 信道特性估计装置可以包括用于估计信道特性的多种时间 - 方向信道估计装置，以及根据信道状态切换这些估计装置的切换控制装置。

公开(公告)号：US20100303186A1

公开(公告)日：2010-12-02

申请号：US12662669

申请日：2010-04-28

申请人： Masayuki Hattori ,  Tetsuhiro Futami ,  Yuichi Hirayama ,  Keita Izumi

发明人： Masayuki Hattori ,  Tetsuhiro Futami ,  Yuichi Hirayama ,  Keita Izumi

IPC分类号： H04L7/00 ,  H03L7/06

CPC分类号： H03L7/22 ,  H03L7/093

摘要： Disclosed herein is a synchronization circuit including: a first phase-locked loop circuit; a second phase-locked loop circuit; a first output circuit; a second output circuit; a first detection circuit; a second detection circuit; and a control circuit.

摘要翻译： 这里公开了一种同步电路，包括：第一锁相环电路; 第二锁相环电路; 第一输出电路; 第二输出电路; 第一检测电路; 第二检测电路; 和控制电路。

公开(公告)号：US20090158127A1

公开(公告)日：2009-06-18

申请号：US12335802

申请日：2008-12-16

申请人： Toshiyuki MIYAUCHI ,  Masayuki Hattori ,  Takashi Yokokawa

发明人： Toshiyuki MIYAUCHI ,  Masayuki Hattori ,  Takashi Yokokawa

IPC分类号： H03M13/05 ,  G06F11/07

CPC分类号： H03M13/15 ,  H03M13/1515 ,  H03M13/45

摘要： Disclosed herein is a decoding apparatus that performs soft-decision decoding on a linear block code, the apparatus including a hard-decision decoder configured to perform hard-decision decoding on a received word using a hard-decision decoding algorithm; and a soft-decision decoder configured to perform, using a soft-decision algorithm, soft-decision decoding merely on a received word for which the hard-decision decoder has failed in the hard-decision decoding.

摘要翻译： 本发明公开了一种对线性块码执行软判决解码的解码装置，该装置包括：硬判决解码器，被配置为使用硬判决解码算法对接收到的字执行硬判决解码; 以及软判决解码器，其被配置为仅在硬判决解码器在硬判决解码中已经失败的接收到的字上执行软判决算法的软判决解码。