公开(公告)号：US20060034082A1

公开(公告)日：2006-02-16

申请号：US10957650

申请日：2004-10-05

申请人： Jung Park ,  Young Park ,  Hun Hahm ,  Young Jeong ,  Hyung Kim

发明人： Jung Park ,  Young Park ,  Hun Hahm ,  Young Jeong ,  Hyung Kim

IPC分类号： F21V13/04

CPC分类号： H01L33/58 ,  G02F1/133603 ,  H01L33/54 ,  Y10S362/80

摘要： The present invention relates to a multi-lens LED. The LED has multiple lenses and an intermediate layer interposed between the multiple lenses in order to radiate light emitted from an LED chip in a desired direction and/or beam angle without using a complicated lens configuration. The first lens is centered behind the LED chip when seen in the propagation direction of light, the second lens has a concave structure and surrounds the first lens, and the intermediate layer is interposed between the first and second lenses, so that light emitted from the LED chip can be radiated in a wide beam angle. When provided in the form of a hemisphere, the multi-lens LED can be attached to a wall or a ceiling in use for interior lighting. On the other hand, when provided in the form of a cylinder, the multi-lens LED of the invention can be applied in arrays to be used as a light source of an LCD backlight apparatus.

摘要翻译： 本发明涉及一种多透镜LED。 LED具有多个透镜和介于多个透镜之间的中间层，以便在不需要复杂透镜配置的情况下以期望的方向和/或光束角辐射从LED芯片发射的光。 当在光的传播方向上观察时，第一透镜位于LED芯片的后面，第二透镜具有凹形结构并且围绕第一透镜，并且中间层插入在第一透镜和第二透镜之间，使得从 LED芯片可以以较宽的光束角度辐射。 当以半球的形式提供时，多透镜LED可以附着在用于室内照明的墙壁或天花板上。 另一方面，当以圆筒形式提供时，本发明的多透镜LED可以应用于阵列以用作LCD背光装置的光源。

公开(公告)号：US20060006406A1

公开(公告)日：2006-01-12

申请号：US10967212

申请日：2004-10-19

申请人： Hyung Kim ,  Young Park ,  Hun Hahm ,  Jung Park ,  Young Jeong

发明人： Hyung Kim ,  Young Park ,  Hun Hahm ,  Jung Park ,  Young Jeong

IPC分类号： H01L29/24

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to one of the terminals formed on the first side while being electrically connected to one of the terminals formed on the second side, and other LEDS being electrically connected to two terminals formed on the first side or to two terminals formed on the second side. A light source comprises the LED packages having the structure as described above. Without being arranged in a line, the LEDs emitting the same color are differently arranged in every LED package, thereby solving the problem of non-uniform combination of the colors according to the positions of the LEDs on an LED package-mounting substrate.

摘要翻译： LED封装包括基板，形成在基板的第一侧上的一个或三个端子，形成在与第一侧相对的第二侧上的三个端子和设置在基板上的两个或三个LED，其中一个LED电连接 连接到形成在第一侧上的端子中的一个端子，同时电连接到形成在第二侧上的端子之一，并且其它LEDS电连接到形成在第一侧上的两个端子或形成在第二侧上的两个端子。 光源包括具有如上所述结构的LED封装。 不排列成一行，发光相同颜色的LED在每个LED封装中被不同地排列，从而解决了根据LED封装安装基板上LED的位置的颜色不均匀组合的问题。

公开(公告)号：US20060001034A1

公开(公告)日：2006-01-05

申请号：US10959154

申请日：2004-10-07

申请人： Young Park ,  Hun Hahm ,  Hyung Kim ,  Jung Park ,  Young Jeong

发明人： Young Park ,  Hun Hahm ,  Hyung Kim ,  Jung Park ,  Young Jeong

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： Disclosed is an RGB light emitting diode package with improved color mixing properties. The RGB light emitting diode package includes red, green, and blue light emitting diode chips provided on a reflector, on which elements are to be installed or mounted. A photomixing material and a filler resin scatters rays so as to uniformly mix the rays emitted from the light emitting diode chips. The photomixing material and filler resin are applied onto upper sides of the light emitting diode chips while being mixed with each other, and the photomixing material is uniformly dispersed in the filler resin. The RGB light emitting diode package according to the present invention is advantageous in that since it has excellent color mixing properties in a relatively small area, it is possible to achieve slimness of the package, while it is difficult to design a slim package using a conventional process in which there is a limit that an area large enough to mix colors must be provided.

摘要翻译： 公开了具有改进的混色特性的RGB发光二极管封装。 RGB发光二极管封装包括设置在要安装或安装元件的反射器上的红色，绿色和蓝色发光二极管芯片。 光混合材料和填充树脂散射射线，以均匀混合从发光二极管芯片发出的光线。 将光混合材料和填料树脂彼此混合地施加到发光二极管芯片的上侧，并且光混合材料均匀地分散在填充树脂中。 根据本发明的RGB发光二极管封装的优点在于，由于它在相对较小的区域中具有优异的混色特性，所以可以实现封装的薄型化，同时难以使用常规的方法来设计纤薄封装 必须提供足够大的混合颜色的区域的限制。

公开(公告)号：US20050276066A1

公开(公告)日：2005-12-15

申请号：US10916480

申请日：2004-08-12

申请人： Hyung Kim ,  Young Park ,  Hun Hahm ,  Jung Park ,  Young Jeong

发明人： Hyung Kim ,  Young Park ,  Hun Hahm ,  Jung Park ,  Young Jeong

IPC分类号： G02F1/1335 ,  G02F1/13357

CPC分类号： G02F1/133603 ,  G02F1/133605 ,  Y10S362/80

摘要： Disclosed herein is a backlight unit of a liquid crystal display. The backlight unit comprises a plurality of light emitting diode packages arranged in a matrix while being spaced a uniform distance apart from each other, each light emitting diode package including one or more light emitting diode chips and structured such that light generated from the light emitting chips is emitted in the horizontal direction, and a reflector consisting of a plurality of reflection cells connected to each other in a matrix. Each of the reflection cells of a unit size has each of the light generating packages positioned at the center thereof, and reflects the light, emitted from the light emitting diode at the center thereof in the horizontal direction, to the perpendicular direction.

摘要翻译： 这里公开了液晶显示器的背光单元。 背光单元包括以矩阵形式布置的多个发光二极管封装，同时隔开彼此间隔均匀的距离，每个发光二极管封装包括一个或多个发光二极管芯片，并被构造为使得从发光芯片产生的光 在水平方向上发射，并且由多个反射单元组成的反射器以矩阵形式彼此连接。 单位尺寸的每个反射单元具有位于其中心的每个发光组件，并且将从发光二极管的沿水平方向的中心发射的光反射到垂直方向。

公开(公告)号：US20050264716A1

公开(公告)日：2005-12-01

申请号：US10965257

申请日：2004-10-15

申请人： Hyung Kim ,  Young Park ,  Hun Hahm ,  Jung Park ,  Young Jeong

发明人： Hyung Kim ,  Young Park ,  Hun Hahm ,  Jung Park ,  Young Jeong

IPC分类号： G02F1/13357 ,  G02F1/1335 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60

CPC分类号： H01L33/54 ,  G02F1/133603 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to an LED package used as a light source used in a backlight assembly for an LCD, and a backlight assembly for an LCD comprising the same. The LED package includes a substrate, one LED or more separated from each other by designated intervals and arranged in a line on the substrate, and a molding portion, for sealing the upper surface of the substrate including the LEDs, provided with an upper surface including two curved surfaces having circular circumferential shapes, wherein each of the curved surfaces has a curvature for totally reflecting light emitted from the LEDs. The LED package assures a sufficient optical traveling route therein without requiring a separate light guide plate, thereby emitting a white ray having uniform luminance.

摘要翻译： 本发明涉及一种用作LCD背光组件中使用的光源的LED封装，以及一种用于LCD的背光组件。 LED封装包括基板，一个LED或更多的隔离指定间隔的LED或更多的布置在基板上的一行中的模制部分，以及用于密封包括LED的基板的上表面的模制部分，该模制部分设置有包括 两个具有圆周形状的曲面，其中每个曲面具有用于全反射从LED发射的光的曲率。 LED封装确保了其中的足够的光学行进路线，而不需要单独的导光板，从而发出具有均匀亮度的白光。

公开(公告)号：US20060273338A1

公开(公告)日：2006-12-07

申请号：US11445227

申请日：2006-06-02

申请人： Seon Lee ,  Hun Hahm ,  Jung Park ,  Kyung Han ,  Seong Han ,  Dae Kim ,  Young Park

发明人： Seon Lee ,  Hun Hahm ,  Jung Park ,  Kyung Han ,  Seong Han ,  Dae Kim ,  Young Park

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

公开(公告)号：US20050263785A1

公开(公告)日：2005-12-01

申请号：US10916525

申请日：2004-08-12

申请人： Hyung Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Park ,  Young Jeong

发明人： Hyung Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Park ,  Young Jeong

IPC分类号： G02F1/13357 ,  H01L29/22 ,  H01L33/54 ,  H01L33/60 ,  H01L33/00

CPC分类号： H01L33/54 ,  H01L33/60

摘要： Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.

摘要翻译： 这里公开了一种发光二极管（LED）装置。 发光二极管装置包括形成有用于施加电信号的端子的封装，安装在封装上的一个或多个LED芯片，使得LED芯片电连接到端子，形成为围绕封装上的LED芯片的透镜 用于随着介质的折射率的差异而将从LED芯片发射的光的路径改变到水平方向，以及形成在透镜上的用于反射透镜的反射器的反射器，而不是在透镜的上方沿水平方向折射 镜头，水平方向。 LED装置将从透镜的光学设计范围偏离的光反射回透镜，从而防止产生热点，提高光的水平发光效率。

公开(公告)号：US20070045644A1

公开(公告)日：2007-03-01

申请号：US11491947

申请日：2006-07-25

申请人： Seong Han ,  Seon Lee ,  Chang Song ,  Jung Park ,  Young Park ,  Kyung Han

发明人： Seong Han ,  Seon Lee ,  Chang Song ,  Jung Park ,  Young Park ,  Kyung Han

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

摘要翻译： 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

公开(公告)号：US20070012939A1

公开(公告)日：2007-01-18

申请号：US11412984

申请日：2006-04-28

申请人： Seok Hwang ,  Je Kim ,  Young Park ,  Kun Ko ,  Jee Kim ,  Jung Park ,  Bok Min

发明人： Seok Hwang ,  Je Kim ,  Young Park ,  Kun Ko ,  Jee Kim ,  Jung Park ,  Bok Min

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/08 ,  H01L33/32 ,  H01L33/38 ,  H01L2933/0016

摘要： The present invention relates to a flip chip light emitting diode, in which the flow of current concentrated on a portion adjacent to an n-type electrode can be induced into the center of a light emitting section and a current-spreading effect is accordingly enhanced, thereby increasing light emission efficiency of a light emitting diode chip, and a method of manufacturing the same. The method of manufacturing a flip chip light emitting diode includes sequentially forming an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer on an optically-transparent substrate; etching predetermined regions of the active layer and p-type nitride semiconductor layer and exposing a plurality of regions of the n-type nitride semiconductor layer so as to form a plurality of mesas; etching predetermined regions of the active layer and p-type nitride semiconductor layer positioned between the formed mesas and exposing the plurality of regions of the n-type nitride semiconductor layer so as to form a plurality of grooves; forming an insulating layer on the surface of the groove; forming a p-type electrode across the insulating layer formed on the upper portion of the p-type nitride semiconductor layer and the surface of the groove; and forming an n-type electrode on the formed mesa.

摘要翻译： 倒装芯片发光二极管技术领域本发明涉及一种倒装芯片发光二极管，其中集中在与n型电极相邻的部分上的电流可以被感应到发光部分的中心，从而相应地提高了电流扩展效果， 从而提高发光二极管芯片的发光效率及其制造方法。 制造倒装芯片发光二极管的方法包括在光学透明基板上依次形成n型氮化物半导体层，有源层和p型氮化物半导体层; 蚀刻有源层和p型氮化物半导体层的预定区域，并露出n型氮化物半导体层的多个区域以形成多个台面; 蚀刻位于形成的台面之间的有源层和p型氮化物半导体层的预定区域，并暴露出n型氮化物半导体层的多个区域以形成多个沟槽; 在所述槽的表面上形成绝缘层; 在形成在p型氮化物半导体层的上部和沟槽的表面上的绝缘层上形成p型电极; 并在形成的台面上形成n型电极。

公开(公告)号：US20050280014A1

公开(公告)日：2005-12-22

申请号：US10954144

申请日：2004-09-30

申请人： Jung Park ,  Young Park

发明人： Jung Park ,  Young Park

IPC分类号： H01L29/22 ,  H01L29/24 ,  H01L33/48 ,  H01L33/54 ,  H01L33/58

CPC分类号： H01L33/58 ,  H01L33/483 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED package in which an LED chip a body has a cup part housing an LED chip. The cup part has a step formed in the outer circumference of the top thereof. A lens is mounted on the cup part, and has a flange extended downward from the outer circumference of the lens along the outside wall of the cup part to form a gap between the flange and the downward step of the cup part and to seal the gap from the outside. Resin material fills a space formed between the underside of the lens and the cup part and at least partially the gap formed between the step of the cup part and the lens flange. The resin material is prevented from leaking out of the LED package. The LED package of the invention prevents the creation of voids in the resin material surrounding the LED chip or the leakage of the resin material to the outside.

摘要翻译： 一种LED封装，其中LED芯片的主体具有容纳LED芯片的杯部分。 杯部具有在其顶部的外周形成的台阶。 透镜安装在杯部上，并且具有从透镜的外周沿杯部的外壁向下延伸的凸缘，以在凸缘与杯部的向下台阶之间形成间隙，并且密封间隙 从外部。 树脂材料填充在透镜的下侧和杯部之间形成的空间，并且至少部分地填充形成在杯部和台阶之间的间隙。 防止树脂材料泄漏出LED封装。 本发明的LED封装防止在LED芯片周围的树脂材料中产生空隙或树脂材料泄漏到外部。