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    Side-emitting LED package and method of manufacturing the same
    4.
    发明申请
    Side-emitting LED package and method of manufacturing the same 审中-公开
    侧面发光LED封装及其制造方法

    公开(公告)号：US20060273337A1

    公开(公告)日：2006-12-07

    申请号：US11444402

    申请日：2006-06-01

    申请人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

    发明人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

    IPC分类号： H01L33/00

    CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00014

    摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

    摘要翻译： 本发明涉及一种侧面发光LED封装及其制造方法。 侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。 侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射 模制部件形成透光表面。 封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。 本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

    Light emitting diode package with diffuser and method of manufacturing the same
    5.
    发明申请
    Light emitting diode package with diffuser and method of manufacturing the same 有权
    具有扩散器的发光二极管封装及其制造方法

    公开(公告)号：US20070045644A1

    公开(公告)日：2007-03-01

    申请号：US11491947

    申请日：2006-07-25

    申请人： Seong Han ,  Seon Lee ,  Chang Song ,  Jung Park ,  Young Park ,  Kyung Han

    发明人： Seong Han ,  Seon Lee ,  Chang Song ,  Jung Park ,  Young Park ,  Kyung Han

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

    摘要翻译： 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

    High power light emitting diode package and fabrication method thereof
    6.
    发明申请
    High power light emitting diode package and fabrication method thereof 失效
    大功率发光二极管封装及其制造方法

    公开(公告)号：US20060267036A1

    公开(公告)日：2006-11-30

    申请号：US11442414

    申请日：2006-05-30

    申请人： Seon Lee ,  Hun Hahm ,  Dae Kim ,  Young Song ,  Young Park ,  Chang Song

    发明人： Seon Lee ,  Hun Hahm ,  Dae Kim ,  Young Song ,  Young Park ,  Chang Song

    IPC分类号： H01L33/00

    CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.

    摘要翻译： 本发明涉及一种大功率LED封装及其制造方法。 LED封装包括响应于施加的功率而产生光的发光部，安装有发光部的导热部件，用于电连接发光部和板的引线部，以及用于一体地固定的模具部 导热部件和引线部分。 导热构件由高度方向上的至少两个金属层构成，引线部包括从导热构件延伸的至少一个第一引线和与导热构件分离的至少一个第二引线。 本发明允许将两个组件集成到一个组件中，减少组件的数量并简化组装过程，从而降低制造成本。

    LED package frame and LED package having the same
    7.
    发明申请
    LED package frame and LED package having the same 有权
    LED封装框架和LED封装相同

    公开(公告)号：US20060169999A1

    公开(公告)日：2006-08-03

    申请号：US11319101

    申请日：2005-12-28

    申请人： Young Park ,  Seung Lee ,  Hun Hahm ,  Hyung Kim ,  Bum Kim ,  Young Jeong ,  Ho Ahn ,  Jung Park

    发明人： Young Park ,  Seung Lee ,  Hun Hahm ,  Hyung Kim ,  Bum Kim ,  Young Jeong ,  Ho Ahn ,  Jung Park

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

    摘要： The invention relates to an LED package frame and an LED package incorporating the same. The LED package frame comprises an LED chip; and a heat conductive member made of a lump of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member to separate the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability. Also, it is possible to provide an LED package frame and a high power LED package by fixing the lead fixed to the heat conductive member without a jig.

    摘要翻译： 本发明涉及一种LED封装框架和一个包含该LED封装框架的LED封装件。 LED封装框架包括LED芯片; 以及由高导热性材料块制成的导热构件。 导热构件在侧部具有接收部，并且安装有LED芯片。 引线一端插入导热部件的接收部分，并与LED芯片电连接。 电绝缘层被放置在引导件和导热构件的接收部分之间的紧密接触中以将引线与接收部分分离。 通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。 此外，通过将固定在导热构件上的引线固定而不用夹具，可以提供LED封装框架和大功率LED封装。

    Multi-lens light emitting diode
    8.
    发明申请
    Multi-lens light emitting diode 有权
    多镜头发光二极管

    公开(公告)号：US20060034082A1

    公开(公告)日：2006-02-16

    申请号：US10957650

    申请日：2004-10-05

    申请人： Jung Park ,  Young Park ,  Hun Hahm ,  Young Jeong ,  Hyung Kim

    发明人： Jung Park ,  Young Park ,  Hun Hahm ,  Young Jeong ,  Hyung Kim

    IPC分类号： F21V13/04

    CPC分类号： H01L33/58 ,  G02F1/133603 ,  H01L33/54 ,  Y10S362/80

    摘要： The present invention relates to a multi-lens LED. The LED has multiple lenses and an intermediate layer interposed between the multiple lenses in order to radiate light emitted from an LED chip in a desired direction and/or beam angle without using a complicated lens configuration. The first lens is centered behind the LED chip when seen in the propagation direction of light, the second lens has a concave structure and surrounds the first lens, and the intermediate layer is interposed between the first and second lenses, so that light emitted from the LED chip can be radiated in a wide beam angle. When provided in the form of a hemisphere, the multi-lens LED can be attached to a wall or a ceiling in use for interior lighting. On the other hand, when provided in the form of a cylinder, the multi-lens LED of the invention can be applied in arrays to be used as a light source of an LCD backlight apparatus.

    摘要翻译： 本发明涉及一种多透镜LED。 LED具有多个透镜和介于多个透镜之间的中间层，以便在不需要复杂透镜配置的情况下以期望的方向和/或光束角辐射从LED芯片发射的光。 当在光的传播方向上观察时，第一透镜位于LED芯片的后面，第二透镜具有凹形结构并且围绕第一透镜，并且中间层插入在第一透镜和第二透镜之间，使得从 LED芯片可以以较宽的光束角度辐射。 当以半球的形式提供时，多透镜LED可以附着在用于室内照明的墙壁或天花板上。 另一方面，当以圆筒形式提供时，本发明的多透镜LED可以应用于阵列以用作LCD背光装置的光源。

    Light emitting diode package and light source comprising the same
    9.
    发明申请
    Light emitting diode package and light source comprising the same 失效
    发光二极管封装和包含该发光二极管封装的光源

    公开(公告)号：US20060006406A1

    公开(公告)日：2006-01-12

    申请号：US10967212

    申请日：2004-10-19

    申请人： Hyung Kim ,  Young Park ,  Hun Hahm ,  Jung Park ,  Young Jeong

    发明人： Hyung Kim ,  Young Park ,  Hun Hahm ,  Jung Park ,  Young Jeong

    IPC分类号： H01L29/24

    CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to one of the terminals formed on the first side while being electrically connected to one of the terminals formed on the second side, and other LEDS being electrically connected to two terminals formed on the first side or to two terminals formed on the second side. A light source comprises the LED packages having the structure as described above. Without being arranged in a line, the LEDs emitting the same color are differently arranged in every LED package, thereby solving the problem of non-uniform combination of the colors according to the positions of the LEDs on an LED package-mounting substrate.

    摘要翻译： LED封装包括基板，形成在基板的第一侧上的一个或三个端子，形成在与第一侧相对的第二侧上的三个端子和设置在基板上的两个或三个LED，其中一个LED电连接 连接到形成在第一侧上的端子中的一个端子，同时电连接到形成在第二侧上的端子之一，并且其它LEDS电连接到形成在第一侧上的两个端子或形成在第二侧上的两个端子。 光源包括具有如上所述结构的LED封装。 不排列成一行，发光相同颜色的LED在每个LED封装中被不同地排列，从而解决了根据LED封装安装基板上LED的位置的颜色不均匀组合的问题。

    RGB light emitting diode package with improved color mixing properties
    10.
    发明申请
    RGB light emitting diode package with improved color mixing properties 有权
    RGB发光二极管封装，具有改进的混色性能

    公开(公告)号：US20060001034A1

    公开(公告)日：2006-01-05

    申请号：US10959154

    申请日：2004-10-07

    申请人： Young Park ,  Hun Hahm ,  Hyung Kim ,  Jung Park ,  Young Jeong

    发明人： Young Park ,  Hun Hahm ,  Hyung Kim ,  Jung Park ,  Young Jeong

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    摘要： Disclosed is an RGB light emitting diode package with improved color mixing properties. The RGB light emitting diode package includes red, green, and blue light emitting diode chips provided on a reflector, on which elements are to be installed or mounted. A photomixing material and a filler resin scatters rays so as to uniformly mix the rays emitted from the light emitting diode chips. The photomixing material and filler resin are applied onto upper sides of the light emitting diode chips while being mixed with each other, and the photomixing material is uniformly dispersed in the filler resin. The RGB light emitting diode package according to the present invention is advantageous in that since it has excellent color mixing properties in a relatively small area, it is possible to achieve slimness of the package, while it is difficult to design a slim package using a conventional process in which there is a limit that an area large enough to mix colors must be provided.

    摘要翻译： 公开了具有改进的混色特性的RGB发光二极管封装。 RGB发光二极管封装包括设置在要安装或安装元件的反射器上的红色，绿色和蓝色发光二极管芯片。 光混合材料和填充树脂散射射线，以均匀混合从发光二极管芯片发出的光线。 将光混合材料和填料树脂彼此混合地施加到发光二极管芯片的上侧，并且光混合材料均匀地分散在填充树脂中。 根据本发明的RGB发光二极管封装的优点在于，由于它在相对较小的区域中具有优异的混色特性，所以可以实现封装的薄型化，同时难以使用常规的方法来设计纤薄封装 必须提供足够大的混合颜色的区域的限制。